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251 results on '"Packaging Density"'

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1. Oil-in-Water Pickering Emulsions Stabilized by Halloysite Clay Nanotubes Toward Efficient Filterability.

2. A Study on Cell Body Model for Highly Integrated Circuits.

5. Controlled release niosome embedded chitosan system: Effect of crosslink mesh dimensions on drug release.

6. Optimization of Microscale Thermoelectric Cooling (TEC) Element Dimensions for Hotspot Cooling Applications.

7. Characterization of Fully Embedded RF Inductors in Organic SOP Technology.

8. Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type

9. A system design perspective on optical interconnection technology

10. The technology of molded multichip modules

11. X-ray lithography - an overview

12. Design for packageability: early consideration of packaging from a VLSI designer's viewpoint

13. Overlay high-density interconnect: a chips-first multichip module technology

14. Trends in low-cost, high performance substrate technology

15. Addressing the challenges of advanced packaging and interconnection

16. Multichip packaging - a tutorial

18. Design of multichip modules

19. Polymer dielectrics for multichip module packaging

20. An MPGA-like FPGA

24. Developing a soft X-ray projection lithography tool

25. A rapid-prototyping environment for digital-signal processors

26. Challenges in lithographic materials and processes

27. Polymers in electronics packaging

28. Materials and processing: core competencies and strategic resources

29. Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type.

30. Electron beam lithography tool for manufacture of X-ray masks

31. Early history of X-ray lithography at IBM

32. MCMs meld into systems

33. Solid state

34. Processing seeds to bloom

35. On-chip wiring for VLSI: Status and directions

37. Multichip modules: next-generation packages

38. Advanced packaging and interconnection technology

41. Image-compression chips advance on three fronts

42. Design and performance of a modular jack type Mini-MT connector for high-density optical duplex connection.

44. Interconnects & packaging: part 1: IC attachments

45. Packaging personal gear

46. Interconnections and packaging

47. New paradigm gives life to JJ

49. Are you ready for next-generation dynamic RAM chips?

50. Multichips, optics will be wave of future

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