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Advanced packaging and interconnection technology

Authors :
Misunas, David
Source :
IEEE Micro. April, 1993, Vol. v13 Issue n2, p7, 3 p.
Publication Year :
1993

Subjects

Subjects :
Packaging Density
New Technique
Integrated circuit fabrication
Trends
Packaging density (Electronics) -- Innovations
Integrated circuits -- Design and construction
Semiconductor industry -- Packaging

Details

ISSN :
02721732
Volume :
v13
Issue :
n2
Database :
Gale General OneFile
Journal :
IEEE Micro
Publication Type :
Academic Journal
Accession number :
edsgcl.13912083

Tools

Authors Abstract Subjects Details