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Polymer dielectrics for multichip module packaging

Authors :
Garrou, Philip
Source :
Proceedings of the IEEE. Dec, 1992, Vol. v80 Issue n12, p1942, 13 p.
Publication Year :
1992

Subjects

Subjects :
Chip Packaging
Packaging Density
Integrated Circuit Fabrication
Trends
Industry Analysis
Performance Improvement
Circuit Design
Multichip Module

Details

ISSN :
00189219
Volume :
v80
Issue :
n12
Database :
Gale General OneFile
Journal :
Proceedings of the IEEE
Publication Type :
Academic Journal
Accession number :
edsgcl.13885577

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