The technology of molded multichip modules

Authors :: Zimmerman, Michael A.
Source :: AT & T Technical Journal. Sept-Oct, 1993, Vol. v72 Issue n5, p73, 11 p.
Publication Year :: 1993

Subjects :: Chip Packaging
Packaging Density
Multichip Module
New Technique
Circuit Design
Research and Development
American Telephone and Telegraph Co. -- Research
Integrated circuits -- Design and construction
Integrated circuit fabrication -- Innovations
Packaging density (Electronics) -- Research

Tools