The technology of molded multichip modules

MLA

Zimmerman, Michael A. “The Technology of Molded Multichip Modules.” AT & T Technical Journal, vol. v72, no. n5, Sept. 1993, p. 73. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.15071398&authtype=sso&custid=ns315887.

APA

Zimmerman, M. A. (1993). The technology of molded multichip modules. AT & T Technical Journal, v72(n5), 73.

Chicago

Zimmerman, Michael A. 1993. “The Technology of Molded Multichip Modules.” AT & T Technical Journal v72 (n5): 73. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsggo&AN=edsgcl.15071398&authtype=sso&custid=ns315887.