Polymers in electronics packaging

Authors :: Manzione, Louis T.
Lando, David J.
Source :: AT & T Technical Journal. Nov-Dec, 1990, Vol. v69 Issue n6, p60, 17 p.
Publication Year :: 1990

Subjects :: Integrated Circuit Fabrication
Technology
Microelectronics
Chip Packaging
Packaging Density
New Technique
Research and Development
Manufacturers
User Need
Miniaturization
Performance Improvement
AT&T Corp. AT&T Microelectronics Div. -- Research

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