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High-yield assembly of multichip modules through known-good IC's and effective test strategies

Authors :
Hagge, John K.
Wagner, Russell J.
Source :
Proceedings of the IEEE. Dec, 1992, Vol. v80 Issue n12, p1965, 30 p.
Publication Year :
1992

Subjects

Subjects :
Multichip Module
Chip Packaging
Packaging Density
New Technique
Industry Analysis
Trends
Integrated Circuit Fabrication
Testing
Circuit Design

Details

ISSN :
00189219
Volume :
v80
Issue :
n12
Database :
Gale General OneFile
Journal :
Proceedings of the IEEE
Publication Type :
Academic Journal
Accession number :
edsgcl.13885581

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Authors Abstract Subjects Details