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Trends in low-cost, high performance substrate technology

Authors :
Carey, David H.
Source :
IEEE Micro. April, 1993, Vol. v13 Issue n2, p19, 9 p.
Publication Year :
1993

Subjects

Subjects :
Substrates
Integrated circuit fabrication
Multichip Module
New Technique
Optimization
Packaging Density
Integrated circuit fabrication -- Methods
Packaging density (Electronics) -- Methods

Details

ISSN :
02721732
Volume :
v13
Issue :
n2
Database :
Gale General OneFile
Journal :
IEEE Micro
Publication Type :
Academic Journal
Accession number :
edsgcl.13912663

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