MCMs: many options, many questions; multichip modules confound designers with substrate and die-attachment possibilities

Authors :: Costlow, Terry
Isaac, John
Source :: Electronic Engineering Times. June 10, 1991, Issue n645, p49, 3 p.
Publication Year :: 1991

Subjects :: Multichip Module
Industry Analysis
Circuit Design
Trends
Packaging Density
Chip Packaging
Outlook
Substrates
Integrated Circuit Fabrication

Tools