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Design for packageability: early consideration of packaging from a VLSI designer's viewpoint

Authors :
Dehkordi, Peyman H.
Bouldin, Donald W.
Source :
Computer. April, 1993, Vol. v26 Issue n4, p76, 6 p.
Publication Year :
1993

Subjects

Subjects :
Circuit Design
Chip Packaging
New Technique
Research and Development
Packaging Density
Multichip Module
Integrated circuit fabrication
Very-large-scale integration
Hybrid integrated circuits -- Design and construction
Integrated circuit fabrication -- Innovations
Very-large-scale integration -- Innovations

Details

ISSN :
00189162
Volume :
v26
Issue :
n4
Database :
Gale General OneFile
Journal :
Computer
Publication Type :
Academic Journal
Accession number :
edsgcl.14101145

Tools

Authors Abstract Subjects Details