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Your search keyword '"Packaging Density"' showing total 74 results
Start Over Descriptor "Packaging Density" Topic integrated circuit fabrication
74 results on '"Packaging Density"'

1. Design for packageability: early consideration of packaging from a VLSI designer's viewpoint

Author

Dehkordi, Peyman H. and Bouldin, Donald W.

Subjects
Circuit Design, Chip Packaging, New Technique, Research and Development, Packaging Density, Multichip Module, Integrated circuit fabrication, Very-large-scale integration, Hybrid integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Very-large-scale integration -- Innovations
Published
1993

2. Overlay high-density interconnect: a chips-first multichip module technology

Author

Daum, Wolfgang, Burdick, William E., Jr., and Fillion, Raymond A.

Subjects
Multichip Module, Chip Packaging, New Technique, Technology, Research and Development, Packaging Density, Integrated circuit fabrication, General Electric Co. Research and Development Center -- Research, Hybrid integrated circuits -- Design and construction, Semiconductor industry -- Research, Integrated circuit fabrication -- Innovations
Published
1993

3. Trends in low-cost, high performance substrate technology

Author

Carey, David H.

Subjects
Substrates, Integrated circuit fabrication, Multichip Module, New Technique, Optimization, Packaging Density, Integrated circuit fabrication -- Methods, Packaging density (Electronics) -- Methods
Published
1993

4. Addressing the challenges of advanced packaging and interconnection

Author

Herrell, Dennis J.

Subjects
Packaging Density, Multichip Module, Substrates, Integrated circuit fabrication, New Technique, Miniaturization, Packaging density (Electronics) -- Innovations, Semiconductor industry -- Packaging, Integrated circuit fabrication -- Innovations
Published
1993

5. Multichip packaging - a tutorial

Author

Tummala, Rao R.

Subjects
Chip Packaging, Packaging Density, Industry Analysis, Trends, Technology, Outlook, Integrated Circuit Fabrication, Multichip Module
Published
1992

7. Design of multichip modules

Author

Schaper, Leonard W.

Subjects
Multichip Module, Circuit Design, Chip Packaging, Integrated Circuit Fabrication, Trends, User Need, Packaging Density
Published
1992

8. Polymer dielectrics for multichip module packaging

Author

Garrou, Philip

Subjects
Chip Packaging, Packaging Density, Integrated Circuit Fabrication, Trends, Industry Analysis, Performance Improvement, Circuit Design, Multichip Module
Published
1992

9. Developing a soft X-ray projection lithography tool

Author

Stulen, Richard H. and Freeman, Richard R.

Subjects
X-Rays, Photolithography, Circuit Design, Packaging Density, Research and Development, New Technique, Chip Packaging, Laser, Integrated Circuit Fabrication, Sandia Laboratories, Lucent Technologies Inc. Bell Laboratories -- Research, United States. Sandia National Laboratories -- Research
Published
1991

10. Challenges in lithographic materials and processes

Author

Reichmanis, Elsa and Thompson, Larry F.

Subjects
Technology, Photolithography, New Technique, Research and Development, Very-Large-Scale Integration, Integrated Circuit Fabrication, X-Rays, Packaging Density, Future Technologies
Published
1990

11. Polymers in electronics packaging

Author

Manzione, Louis T. and Lando, David J.

Subjects
Integrated Circuit Fabrication, Technology, Microelectronics, Chip Packaging, Packaging Density, New Technique, Research and Development, Manufacturers, User Need, Miniaturization, Performance Improvement, AT&T Corp. AT&T Microelectronics Div. -- Research
Published
1990

12. Materials and processing: core competencies and strategic resources

Author

Patel, C. Kumar, N.

Subjects
Computer-Aided Manufacturing, Materials Handling, Automation, Process Control, Research and Development, New Technique, Business Planning, Strategic Planning, Integrated Circuit Fabrication, Semiconductor Preparation, Technology, Packaging Density
Published
1990

13. Electron beam lithography tool for manufacture of X-ray masks

Author

Groves, Timothy R., Hartley, John G., Pfeiffer, Hans C., Puisto, Denise, and Bailey, Donald K.

Subjects
Photolithography, Research and Development, Photomask, New Technique, Packaging Density, Circuit Printing, Integrated circuit fabrication, X-ray lithography -- Research, Masks (Electronics) -- Innovations, Printed circuits -- Design and construction, Integrated circuit fabrication -- Research
Published
1993

14. Early history of X-ray lithography at IBM

Author

Spiller, Eberhard

Subjects
Research and Development, History of Computing, Circuit Printing, Packaging Density, Chip Packaging, X-Rays, Photolithography, Integrated circuit fabrication, International Business Machines Corp. T.J. Watson Research Center -- Research, Printed circuits -- Research, X-ray lithography -- Research, Integrated circuit fabrication -- Research
Published
1993

15. On-chip wiring for VLSI: Status and directions

Author

Small, M.B. and Pearson, D.J.

Subjects
Integrated Circuit Fabrication, Semiconductor Preparation, Very-Large-Scale Integration, Packaging Density, CMOS, Chemical Engineering, Future Technologies
Published
1990

17. Advanced packaging and interconnection technology

Author

Misunas, David

Subjects
Packaging Density, New Technique, Integrated circuit fabrication, Trends, Packaging density (Electronics) -- Innovations, Integrated circuits -- Design and construction, Semiconductor industry -- Packaging
Published
1993

19. Interconnects & packaging: part 1: IC attachments

Author

Derman, Glenda

Subjects
Circuit Printing, New Technique, Trends, Chip Packaging, Packaging Density, Chip Carriers, Integrated circuit fabrication, Surface-mount technology, Printed circuits -- Design and construction, Integrated circuit fabrication -- Methods, Surface-mount technology -- Innovations
Published
1994

20. Interconnections and packaging

Author

Watson, George F.

Subjects
Supercomputer, Computer industry, Product Development, Packaging Density, Integrated circuit fabrication, Semiconductor industry, Performance Improvement, Functional Capabilities, Supercomputers -- Equipment and supplies, Computer industry -- Research, Integrated circuits -- Design and construction, Semiconductor industry -- Research
Published
1992

22. Multichips, optics will be wave of future

Author

Derman, Glenda

Subjects
Optoelectronic Devices, Connector, Modularity, Integrated Circuit Fabrication, Chip Set, Future Technologies, Trends, Packaging Density, Circuit Design
Published
1990

23. BiMOS devices give designers the best of two worlds

Author

Connolly, Ed

Subjects
Bipolar Integrated Circuits, Metal oxide semiconductors, Complementary, Circuit Design, Industrialists, Integrated Circuit Fabrication, New Technique, Chip Packaging, Packaging Density, Logic Circuitry
Published
1987

24. Self-calibration and oversampling make room for more digital circuitry on monolithic ADCs

Author

Wiegand, Jim

Subjects
Analog to Digital Converter, Integrated Circuit Fabrication, Circuit Design, Packaging Density, Miniaturization, Business, Electronics and electrical industries
Abstract

Self-calibration and oversampling technology allows new ADCs to contain more digital than analog circuitry. Self-calibration allows for looser tolerances on the analog circuitry and eliminates the need for potentiometers. It also allows the chip to adjust to changes over temperature and time. The increased percentage of digital circuitry provides more room for functions such as microprocessor interfaces. Oversampling is a digitally intensive conversion technique that is most adaptable to audio-frequency and low frequency signal environments.

Published
1987

25. BGAs stepping into high-pin-count role

Author

Costlow, Terry

Subjects
Electronics Packaging Symposium, Outlook, Semiconductor Industry, Industry Analysis, Conferences and Meetings, Chip Packaging, Packaging Density, Integrated circuit fabrication, Packaging density (Electronics) -- Forecasts and trends, Integrated circuit fabrication -- Forecasts and trends
Published
1994

26. Packaging debate rolls on

Author

Costlow, Terry

Subjects
Electronic Components Conference, Chip Packaging, Packaging Density, Arrays, Integrated circuit fabrication, Conferences and Meetings, Electronic Components Conference -- 1994 AD, Electronic components industry -- Conferences, meetings and seminars, Integrated circuits -- Design and construction
Published
1994

27. BGAs are extending their connections

Author

Cole, Marie S. and Caulfield, Tom

Subjects
Circuit Printing, New Technique, Packaging Density, Chip Packaging, Performance Improvement, Ceramics, Soldering, Integrated circuit fabrication, Surface-mount technology, Printed circuits -- Design and construction, Integrated circuit fabrication -- Methods, Surface-mount technology -- Innovations
Published
1994

29. New fab process speeds up AT&T's FPGAs; different architecture promised for early next year

Author

Baker, Stan

Subjects
Gate Arrays, Product Introduction, Product Development, Strategic Planning, Manufacturers, Integrated Circuit Fabrication, New Technique, Processor Speed, Enhancements, Performance Improvement, Packaging Density, AT&T Corp. AT&T Microelectronics Div. -- Product introduction, AT and T ATT3000 (Programmable logic array) -- Product introduction, AT and T ATT656 (Programmable logic array) -- Product development
Published
1991

30. Three-metal-layer TAB emerges

Author

Bindra, Ashok

Subjects
Integrated Circuit Fabrication, Circuit Design, New Technique, Technology, Chip Packaging, Packaging Density, Increase, Research and Development, Circuit Printing
Published
1990

31. The silicon challenges of the 1990s

Author

Chatterjee, Pallab K.

Subjects
Semiconductor Industry, Industry Analysis, Forecasting, Outlook, Technology, Packaging Density, Integrated Circuit Fabrication, New Technique, Enhancements
Published
1990

32. Thin means power in chip maker's art

Author

Yoder, Stephen Kreider

Subjects
Intel Corp. -- Equipment and supplies, Photolithography -- Methods, Semiconductor industry -- Equipment and supplies, Particle beams -- Usage, Semiconductor production equipment industry -- Research, Semiconductors -- Etching, X-ray lithography -- Equipment and supplies, Integrated Circuit Fabrication, Packaging Density, Miniaturization, Photolithography, Semiconductor Production Equipment, X-Rays, Particle Physics, Research and Development, Semiconductor Industry, Business, Business, general
Abstract

Integrated circuit manufacturers wage an endless struggle to reduce the size of circuits so that more can fit on each chip. Today's factories use light waves to draw circuits that are about 0.8 microns wide, with the thinnest circuits being about 0.4 microns wide, but these specifications are not adequate. Manufacturers want to make 0.25-micron circuits by the late 1990s, but light waves are simply too 'fat' to do this. X-ray lithography, involving wave lengths as narrow as 0.0008 microns, is an adequate technology, but it is expensive. An X-ray light source can cost as much as $20 million. Some companies, including Intel Corp, are looking at research into particle beam technologies, which would bypass X-rays, promising the possibility to etch 0.1 micron circuit patterns directly into silicon, using computer-guided beams of electrons or protons.

Published
1991

33. IBM moves to 'cubing' -- 3D semiconductor technology

Author

Rohrbough, Linda

Subjects
Cooperative Agreements, Product Development, Semiconductor industry, Integrated circuit fabrication, Chip Packaging, Packaging Density, International Business Machines Corp. -- Contracts, Irvine Sensors Corp. -- Contracts, Semiconductor industry -- Contracts, Integrated circuits -- Product development
Abstract

IBM Moves To "Cubing" -- 3D Semiconductor Technology 06/15/92 COSTA MESA, CALIFORNIA, U.S.A., 1992 JUN 15 (NB) -- IBM has signed a joint development agreement with Irvine Sensors to commercialize […]

Published
1992

34. Very small package hopes for bit IC impact

Author

Bindra, Ashok

Subjects
Chip Packaging, Integrated circuit fabrication, New Technique, Circuit Design, Packaging Density, Increase, Panda Project Inc. -- Innovations, Integrated circuit fabrication -- Innovations
Published
1994

35. FIM plates temper converter heat

Author

Bokil, Doug and O'Brien, Tony

Subjects
Converters, New Technique, Circuit Design, Packaging Density, Power Supply, Integrated circuit fabrication, Power resources -- Design and construction, Integrated circuit fabrication -- Innovations
Published
1994

36. Technique boosts 3-D memory density

Author

Bindra, Ashok

Subjects
New Technique, Storage Density, Packaging Density, Chip Packaging, Increase, Semiconductor Memory, Integrated circuit fabrication, Cubic Memory Inc. -- Innovations, Memory (Computers) -- Design and construction, Integrated circuit fabrication -- Innovations
Published
1994

37. MCMs deployed for use in military DSPs

Author

Leopold, George

Subjects
Multichip Module, New Technique, Chip Packaging, Packaging Density, Performance Improvement, Shared Memory, Military, Integrated circuit fabrication, Digital Signal Processor, LORAL/ROLM Mil-Spec Corp. -- Innovations, MicroModule Systems Inc. -- Innovations, Integrated circuit fabrication -- Innovations, Signal processing -- Equipment and supplies
Published
1994

38. Thin IC packages may be anorexic

Author

Marcoux, Phil P.

Subjects
Chip Packaging, Packaging Density, New Technique, Industry Analysis, Integrated circuit fabrication, Surface-mount technology, Semiconductor preparation, Integrated circuit fabrication -- Methods, Surface-mount technology -- Innovations, Semiconductor preparation -- Innovations
Published
1994

39. DTAB mounts speed and power threat

Author

Karnezos, Marcos

Subjects
New Technique, Circuit Printing, Chip Packaging, Packaging Density, Performance Improvement, Integrated circuit fabrication, Surface-mount technology, Printed circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Surface-mount technology -- Usage
Published
1994

40. Making a case for the proper socket

Author

Grabbe, Dimitry

Subjects
Circuit Printing, Circuit Design, Chip Packaging, Packaging Density, I/O Management, Multichip Module, Technology, Integrated circuit fabrication, Printed circuits -- Design and construction, Integrated circuit fabrication -- Methods
Published
1994

41. Design tools go the grid-array way

Author

LeBrun, Jim

Subjects
Chip Packaging, Packaging Density, Circuit Design, Circuit Printing, New Technique, Layout, Electronic design automation, Computer-aided design, Integrated circuit fabrication, Integrated circuits -- Design and construction, Printed circuits -- Design and construction, Electronic design automation -- Innovations, Computer-aided design, Integrated circuit fabrication -- Innovations
Published
1994

43. Tab Bonding a 200 Lead Die

Author

Scharr, T.A.

Subjects
Packaging Density, Substrates, Bonds, Integrated Circuits, Design, Technology, Soldering, Chip Packaging, Integrated Circuit Fabrication, VLSI
Published
1983

45. Automated Assembly of Hybrids Using High Density Chip Carriers

Author

Miles, R. S.

Subjects
Semiconductor Preparation, Hybrid Circuits, Automation, Assembly Line, Integrated Circuits, Chip Carriers, Microelectronics, Semiconductor Device, Chip Packaging, Testing, Integrated Circuit Fabrication, Packaging Density, Manufacturing, Chip Yield
Published
1983

46. Packaging paths diverge

Author

Costlow, Terry

Subjects
Massive Parallelism, Packaging Density, RISC, Price Cutting, Integrated Circuit Fabrication, Parallel Processing
Published
1993

47. Venture to help designers test chips; $100 million partnership at Los Alamos lab will develop advanced software

Author

Smith, Rebecca

Subjects
United States. Department of Energy, Semiconductor Industry Association, Los Alamos National Laboratory, Computer-Aided Design, Integrated Circuit Fabrication, Packaging Density, Semiconductor Preparation, Simulation, Government Funding, Research and Development, United States. Department of Energy -- Research, United States. Los Alamos National Laboratory -- Research, Semiconductor Industry Association -- Research
Published
1994

48. Darpa seeks foundry for multichip modules

Author

Robinson, Brian

Subjects
Chip Packaging, New Technique, Packaging Density, Research and Development, Government Funding, National Government, Government Agency, Military, Integrated Circuit Fabrication, Semiconductor Preparation, Request for Proposals, United States. Defense Advanced Research Projects Agency, United States. Defense Advanced Research Projects Agency -- Research
Published
1990

49. Managing the VLSI Explosion with Silicon Compilation

Author

Collett, R.

Subjects
Integrated Circuits, Microelectronics, Technology, Packaging Density, Semicustom Integrated Circuits, Integrated Circuit Fabrication, VLSI, Computer-Aided Design, Hardware Review, Comparison, CAD/CAM, Genesil -- Evaluation, Concorde I -- Evaluation
Published
1985

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