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71 results on '"Packaging Density"'

1. A system design perspective on optical interconnection technology

Author

Nordin, Ronald A. and Levi, Anthony F.J.

Subjects
Chip Packaging, Circuit Printing, New Technique, Circuit Design, Research and Development, Packaging Density, American Telephone and Telegraph Co. -- Research, Integrated circuits -- Design and construction, Printed circuits -- Innovations
Published
1993

2. The technology of molded multichip modules

Author

Zimmerman, Michael A.

Subjects
Chip Packaging, Packaging Density, Multichip Module, New Technique, Circuit Design, Research and Development, American Telephone and Telegraph Co. -- Research, Integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Packaging density (Electronics) -- Research
Published
1993

3. Design for packageability: early consideration of packaging from a VLSI designer's viewpoint

Author

Dehkordi, Peyman H. and Bouldin, Donald W.

Subjects
Circuit Design, Chip Packaging, New Technique, Research and Development, Packaging Density, Multichip Module, Integrated circuit fabrication, Very-large-scale integration, Hybrid integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Very-large-scale integration -- Innovations
Published
1993

4. Overlay high-density interconnect: a chips-first multichip module technology

Author

Daum, Wolfgang, Burdick, William E., Jr., and Fillion, Raymond A.

Subjects
Multichip Module, Chip Packaging, New Technique, Technology, Research and Development, Packaging Density, Integrated circuit fabrication, General Electric Co. Research and Development Center -- Research, Hybrid integrated circuits -- Design and construction, Semiconductor industry -- Research, Integrated circuit fabrication -- Innovations
Published
1993

5. Trends in low-cost, high performance substrate technology

Author

Carey, David H.

Subjects
Substrates, Integrated circuit fabrication, Multichip Module, New Technique, Optimization, Packaging Density, Integrated circuit fabrication -- Methods, Packaging density (Electronics) -- Methods
Published
1993

6. Addressing the challenges of advanced packaging and interconnection

Author

Herrell, Dennis J.

Subjects
Packaging Density, Multichip Module, Substrates, Integrated circuit fabrication, New Technique, Miniaturization, Packaging density (Electronics) -- Innovations, Semiconductor industry -- Packaging, Integrated circuit fabrication -- Innovations
Published
1993

8. An MPGA-like FPGA

Author

Marple, David

Subjects
Circuit Design, Gate Arrays, Program Logic, New Technique, Scientific Research, Transistor, Packaging Density
Published
1992

12. Developing a soft X-ray projection lithography tool

Author

Stulen, Richard H. and Freeman, Richard R.

Subjects
X-Rays, Photolithography, Circuit Design, Packaging Density, Research and Development, New Technique, Chip Packaging, Laser, Integrated Circuit Fabrication, Sandia Laboratories, Lucent Technologies Inc. Bell Laboratories -- Research, United States. Sandia National Laboratories -- Research
Published
1991

13. A rapid-prototyping environment for digital-signal processors

Author

Hartley, Richard, Welles, Kenneth, II, Hartman, Michael, Chatterjee, Abhijit, Delano, Paul, Molnar, Barbara, and Rafferty, Colin

Subjects
Computer-Aided Design, Circuit Design, Digital Signal Processor, New Technique, Software Packages, Packaging Density, Prototype, Testing, Debugging, Technology, General Electric Co. -- Product information, GE Diodes (CAD system) -- Design and construction
Published
1991

14. Challenges in lithographic materials and processes

Author

Reichmanis, Elsa and Thompson, Larry F.

Subjects
Technology, Photolithography, New Technique, Research and Development, Very-Large-Scale Integration, Integrated Circuit Fabrication, X-Rays, Packaging Density, Future Technologies
Published
1990

15. Polymers in electronics packaging

Author

Manzione, Louis T. and Lando, David J.

Subjects
Integrated Circuit Fabrication, Technology, Microelectronics, Chip Packaging, Packaging Density, New Technique, Research and Development, Manufacturers, User Need, Miniaturization, Performance Improvement, AT&T Corp. AT&T Microelectronics Div. -- Research
Published
1990

16. Materials and processing: core competencies and strategic resources

Author

Patel, C. Kumar, N.

Subjects
Computer-Aided Manufacturing, Materials Handling, Automation, Process Control, Research and Development, New Technique, Business Planning, Strategic Planning, Integrated Circuit Fabrication, Semiconductor Preparation, Technology, Packaging Density
Published
1990

17. Electron beam lithography tool for manufacture of X-ray masks

Author

Groves, Timothy R., Hartley, John G., Pfeiffer, Hans C., Puisto, Denise, and Bailey, Donald K.

Subjects
Photolithography, Research and Development, Photomask, New Technique, Packaging Density, Circuit Printing, Integrated circuit fabrication, X-ray lithography -- Research, Masks (Electronics) -- Innovations, Printed circuits -- Design and construction, Integrated circuit fabrication -- Research
Published
1993

18. MCMs meld into systems

Author

Derman, Glenda

Subjects
Multichip Module, Semiconductor Device, Packaging Density, Chip Packaging, Circuit Design, New Technique
Published
1991

19. Multichip modules: next-generation packages

Author

Johnson, Robert R.

Subjects
Integrated Circuits, Circuit Design, New Technique, Chip Packaging, Packaging Density, Increase, Enhancements, Substrates
Published
1990

20. Advanced packaging and interconnection technology

Author

Misunas, David

Subjects
Packaging Density, New Technique, Integrated circuit fabrication, Trends, Packaging density (Electronics) -- Innovations, Integrated circuits -- Design and construction, Semiconductor industry -- Packaging
Published
1993

22. Interconnects & packaging: part 1: IC attachments

Author

Derman, Glenda

Subjects
Circuit Printing, New Technique, Trends, Chip Packaging, Packaging Density, Chip Carriers, Integrated circuit fabrication, Surface-mount technology, Printed circuits -- Design and construction, Integrated circuit fabrication -- Methods, Surface-mount technology -- Innovations
Published
1994

23. BiMOS devices give designers the best of two worlds

Author

Connolly, Ed

Subjects
Bipolar Integrated Circuits, Metal oxide semiconductors, Complementary, Circuit Design, Industrialists, Integrated Circuit Fabrication, New Technique, Chip Packaging, Packaging Density, Logic Circuitry
Published
1987

25. GaAs ROM hits 4 Gbytes/s

Author

Brown, Chappell

Subjects
Research and Development, ROM, Performance Improvement, Enhancements, Packaging Density, New Technique, Gallium Arsenide Semiconductor, Rockwell Automation Inc. -- Research, Read-only memory -- Innovations, Gallium arsenide semiconductors -- Research
Published
1994

26. SunDisk, NEC ally in flash; plans 256-Mbit device for use in 500-MByte PC cards

Author

Lammers, David and Wilson, Ron

Subjects
Cooperative Agreements, Product Development, Research and Development, Flash Memory, EEPROM, Packaging Density, Increase, New Technique, Chip Packaging, SanDisk Corp. -- Product development, NEC Corp. -- Product development, Integrated circuit fabrication -- Innovations, Electrically erasable programmable read-only memory -- Design and construction
Published
1994

27. BGAs are extending their connections

Author

Cole, Marie S. and Caulfield, Tom

Subjects
Circuit Printing, New Technique, Packaging Density, Chip Packaging, Performance Improvement, Ceramics, Soldering, Integrated circuit fabrication, Surface-mount technology, Printed circuits -- Design and construction, Integrated circuit fabrication -- Methods, Surface-mount technology -- Innovations
Published
1994

28. One-micron process ups complexity of gauging ASIC performance

Author

Andrews, Warren

Subjects
Application-Specific Integrated Circuit, Circuit Design, Packaging Density, Semiconductor Production Equipment, New Technique, Gate Arrays, VLSI Technology Inc. -- Innovations, LSI Corp. -- Innovations, Motorola Inc. -- Innovations
Published
1989

29. New fab process speeds up AT&T's FPGAs; different architecture promised for early next year

Author

Baker, Stan

Subjects
Gate Arrays, Product Introduction, Product Development, Strategic Planning, Manufacturers, Integrated Circuit Fabrication, New Technique, Processor Speed, Enhancements, Performance Improvement, Packaging Density, AT&T Corp. AT&T Microelectronics Div. -- Product introduction, AT and T ATT3000 (Programmable logic array) -- Product introduction, AT and T ATT656 (Programmable logic array) -- Product development
Published
1991

30. Lattice fields FPGA; uses E2PROM programming

Author

Baker, Stan

Subjects
Gate Arrays, Programmable, Product Introduction, Packaging Density, New Technique, EEPROM, Lattice Semiconductor Corp. -- Product introduction, LatticeNet NetMap 2.0 (Network management system) -- Product introduction, Lattice Semiconductor ispLSI (Programmable logic array) -- Product introduction
Published
1991

31. Litho's light still bright

Author

Santo, Brian

Subjects
Semiconductor Production Equipment, Enhancements, Photolithography, New Technique, Packaging Density, Circuit Design, Semiconductor Preparation, Industry Analysis, Outlook
Published
1991

33. External switchers come of age

Author

Duarte, Bradford J.

Subjects
Circuit Design, New Technique, Switches, Computer-Aided Manufacturing, Enhancements, Industry Analysis, Power Supply, Manufacturers, Packaging Density
Published
1990

34. Actel plays to capacity with 8,000-gate FPGA

Author

Baker, Stan

Subjects
Product Introduction, Gate Arrays, Packaging Density, Increase, New Technique, Enhancements, Actel Corp. -- Product introduction, Actel A1280 (Programmable logic array) -- Product introduction
Published
1990

36. Three-metal-layer TAB emerges

Author

Bindra, Ashok

Subjects
Integrated Circuit Fabrication, Circuit Design, New Technique, Technology, Chip Packaging, Packaging Density, Increase, Research and Development, Circuit Printing
Published
1990

37. The silicon challenges of the 1990s

Author

Chatterjee, Pallab K.

Subjects
Semiconductor Industry, Industry Analysis, Forecasting, Outlook, Technology, Packaging Density, Integrated Circuit Fabrication, New Technique, Enhancements
Published
1990

38. Silicon atoms manipulated in IBM study

Author

Hooper, Laurence

Subjects
International Business Machines Corp. -- Research, Science (Periodical) -- Reports, Nanotechnology -- Research, Semiconductors -- Research, Integrated circuits -- Research, Scanning tunneling microscopy -- Usage, Nanotechnology, Semiconductor Device, Miniaturization, Packaging Density, Science (Periodical), New Technique, Integrated Circuits, Business, Business, general
Abstract

IBM researchers report, in the journal Science, that they have developed a technique that allows them to manipulate individual silicon atoms. IBM scientists already had demonstrated, in 1990, that they could manipulate individual xenon atoms, and they could do this so precisely that they were able to form a pattern in the shape of the company's logo. Circuitry in today's electronic devices is measured in microns, which is on a scale that is 1,000 times coarser than devices that might be built at the atomic scale, where devices and their components are measured in nanometers, or billionths of a meter. IBM's latest research was accomplished using a scanning tunneling microscope, which can be used to manipulate atoms with strong chemical bonds. Atoms of 'noble' elements, such as xenon, interact weakly with other atoms.

Published
1991

39. Motorola, TRW develop new chip with more power

Author

Yoder, Stephen Kreider

Subjects
Motorola Inc. -- Product development, Northrop Grumman Space & Mission Systems Corp. -- Product development, Semiconductor industry -- Innovations, Microprocessors -- Product development, Semiconductor Device, New Technique, Self-Repair Capability, Packaging Density, Microprocessor, Product Development, Semiconductor Industry, Business, Business, general, TRW CPUAX SuperChip (Microprocessor) -- Product development
Abstract

Motorola Inc and TRW Inc have announced the development of the CPUAX SuperChip, a 'supercomputer' chip that incorporates important technological breakthroughs. The device contains four million transistors and can process 200 million floating point operations a second. TRW claims that the chip contains everything necessary to be an entire computer. The chip, they say, can perform tasks that currently require a computer the size of a room. The CPUAX, which was designed for the US Navy, has the most dense architecture yet created, but it will have little market impact immediately. More important now, are the development techniques that were necessary for this chip, which can be applied to current operations. With the help of a second chip called a satellite chip, the SuperChip will be able to monitor its workings and switch to alternate circuits should an internal failure occur.

Published
1990

40. Very small package hopes for bit IC impact

Author

Bindra, Ashok

Subjects
Chip Packaging, Integrated circuit fabrication, New Technique, Circuit Design, Packaging Density, Increase, Panda Project Inc. -- Innovations, Integrated circuit fabrication -- Innovations
Published
1994

41. FIM plates temper converter heat

Author

Bokil, Doug and O'Brien, Tony

Subjects
Converters, New Technique, Circuit Design, Packaging Density, Power Supply, Integrated circuit fabrication, Power resources -- Design and construction, Integrated circuit fabrication -- Innovations
Published
1994

42. Technique boosts 3-D memory density

Author

Bindra, Ashok

Subjects
New Technique, Storage Density, Packaging Density, Chip Packaging, Increase, Semiconductor Memory, Integrated circuit fabrication, Cubic Memory Inc. -- Innovations, Memory (Computers) -- Design and construction, Integrated circuit fabrication -- Innovations
Published
1994

43. MCMs deployed for use in military DSPs

Author

Leopold, George

Subjects
Multichip Module, New Technique, Chip Packaging, Packaging Density, Performance Improvement, Shared Memory, Military, Integrated circuit fabrication, Digital Signal Processor, LORAL/ROLM Mil-Spec Corp. -- Innovations, MicroModule Systems Inc. -- Innovations, Integrated circuit fabrication -- Innovations, Signal processing -- Equipment and supplies
Published
1994

44. Thin IC packages may be anorexic

Author

Marcoux, Phil P.

Subjects
Chip Packaging, Packaging Density, New Technique, Industry Analysis, Integrated circuit fabrication, Surface-mount technology, Semiconductor preparation, Integrated circuit fabrication -- Methods, Surface-mount technology -- Innovations, Semiconductor preparation -- Innovations
Published
1994

45. Thomson 3-D modules ready for prime time

Author

Woolnough, ROger

Subjects
Research and Development, Consortium, DRAM, Multichip Module, Chip Packaging, Packaging Density, New Technique, Thales S.A. -- Innovations, Dynamic random access memory -- Innovations, Semiconductor industry -- Research, Packaging density (Electronics) -- Innovations
Published
1994

46. DTAB mounts speed and power threat

Author

Karnezos, Marcos

Subjects
New Technique, Circuit Printing, Chip Packaging, Packaging Density, Performance Improvement, Integrated circuit fabrication, Surface-mount technology, Printed circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Surface-mount technology -- Usage
Published
1994

47. Design tools go the grid-array way

Author

LeBrun, Jim

Subjects
Chip Packaging, Packaging Density, Circuit Design, Circuit Printing, New Technique, Layout, Electronic design automation, Computer-aided design, Integrated circuit fabrication, Integrated circuits -- Design and construction, Printed circuits -- Design and construction, Electronic design automation -- Innovations, Computer-aided design, Integrated circuit fabrication -- Innovations
Published
1994

49. BGA: the package of choice

Author

Bindra, Ashok

Subjects
Chip Packaging, Packaging Density, New Technique, Application-Specific Integrated Circuit, Circuit Design, Programmable Logic Devices, Manufacturers, Marketing Strategy, Review of Past Year, Industry Analysis, International Business Machines Corp. IBM Microelectronics Div. -- Marketing, Motorola Inc. -- Marketing
Published
1993

50. One brainy chip

Subjects
Neural Network, Integrated Circuits, Circuit Design, Packaging Density, New Technique, Product Development, Cooperative Agreements, Multiprocessing, Intel Corp. -- Product development, Nestor Inc. -- Product development
Published
1993

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