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Your search keyword '"Packaging Density"' showing total 77 results
Start Over Descriptor "Packaging Density" Topic circuit design
77 results on '"Packaging Density"'

1. A system design perspective on optical interconnection technology

Author

Nordin, Ronald A. and Levi, Anthony F.J.

Subjects
Chip Packaging, Circuit Printing, New Technique, Circuit Design, Research and Development, Packaging Density, American Telephone and Telegraph Co. -- Research, Integrated circuits -- Design and construction, Printed circuits -- Innovations
Published
1993

2. The technology of molded multichip modules

Author

Zimmerman, Michael A.

Subjects
Chip Packaging, Packaging Density, Multichip Module, New Technique, Circuit Design, Research and Development, American Telephone and Telegraph Co. -- Research, Integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Packaging density (Electronics) -- Research
Published
1993

3. X-ray lithography - an overview

Author

Peckerar, Martin C. and Maldonado, Juan R.

Subjects
X-Rays, Photolithography, Circuit Printing, Industry Analysis, Trends, Technology, Chip Packaging, Packaging Density, Circuit Design
Published
1993

4. Design for packageability: early consideration of packaging from a VLSI designer's viewpoint

Author

Dehkordi, Peyman H. and Bouldin, Donald W.

Subjects
Circuit Design, Chip Packaging, New Technique, Research and Development, Packaging Density, Multichip Module, Integrated circuit fabrication, Very-large-scale integration, Hybrid integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Very-large-scale integration -- Innovations
Published
1993

6. Design of multichip modules

Author

Schaper, Leonard W.

Subjects
Multichip Module, Circuit Design, Chip Packaging, Integrated Circuit Fabrication, Trends, User Need, Packaging Density
Published
1992

7. Polymer dielectrics for multichip module packaging

Author

Garrou, Philip

Subjects
Chip Packaging, Packaging Density, Integrated Circuit Fabrication, Trends, Industry Analysis, Performance Improvement, Circuit Design, Multichip Module
Published
1992

8. An MPGA-like FPGA

Author

Marple, David

Subjects
Circuit Design, Gate Arrays, Program Logic, New Technique, Scientific Research, Transistor, Packaging Density
Published
1992

12. Developing a soft X-ray projection lithography tool

Author

Stulen, Richard H. and Freeman, Richard R.

Subjects
X-Rays, Photolithography, Circuit Design, Packaging Density, Research and Development, New Technique, Chip Packaging, Laser, Integrated Circuit Fabrication, Sandia Laboratories, Lucent Technologies Inc. Bell Laboratories -- Research, United States. Sandia National Laboratories -- Research
Published
1991

13. A rapid-prototyping environment for digital-signal processors

Author

Hartley, Richard, Welles, Kenneth, II, Hartman, Michael, Chatterjee, Abhijit, Delano, Paul, Molnar, Barbara, and Rafferty, Colin

Subjects
Computer-Aided Design, Circuit Design, Digital Signal Processor, New Technique, Software Packages, Packaging Density, Prototype, Testing, Debugging, Technology, General Electric Co. -- Product information, GE Diodes (CAD system) -- Design and construction
Published
1991

14. MCMs meld into systems

Author

Derman, Glenda

Subjects
Multichip Module, Semiconductor Device, Packaging Density, Chip Packaging, Circuit Design, New Technique
Published
1991

15. Multichip modules: next-generation packages

Author

Johnson, Robert R.

Subjects
Integrated Circuits, Circuit Design, New Technique, Chip Packaging, Packaging Density, Increase, Enhancements, Substrates
Published
1990

16. Image-compression chips advance on three fronts

Author

Wilson, Ron

Subjects
Image Processing, Data Compression, Integrated Circuits, Circuit Design, Packaging Density, Enhancements, Manufacturers, Product Development, Standard
Published
1990

19. Are you ready for next-generation dynamic RAM chips?

Author

Masuoka, Fujio

Subjects
Generations of Computers, DRAM, Capacitors, Circuit Design, High-Density Storage, Noise, Stack Architecture, Enhancements, Future Technologies, Packaging Density
Published
1990

20. Multichips, optics will be wave of future

Author

Derman, Glenda

Subjects
Optoelectronic Devices, Connector, Modularity, Integrated Circuit Fabrication, Chip Set, Future Technologies, Trends, Packaging Density, Circuit Design
Published
1990

21. SMT to pass through-hole by '94

Author

Bindra, Ashok

Subjects
Surface-Mount Technology, Integrated Circuits, Circuit Design, Future of Computing, Packaging Density, Enhancements
Published
1990

23. BiMOS devices give designers the best of two worlds

Author

Connolly, Ed

Subjects
Bipolar Integrated Circuits, Metal oxide semiconductors, Complementary, Circuit Design, Industrialists, Integrated Circuit Fabrication, New Technique, Chip Packaging, Packaging Density, Logic Circuitry
Published
1987

24. Trends in advanced packaging technology

Author

Balde, John W.

Subjects
Multichip Module, Industry Analysis, Trends, Semiconductor industry, Chip Packaging, Packaging Density, Circuit Design, Semiconductor industry -- Analysis, Integrated circuits -- Design and construction
Published
1992

25. Self-calibration and oversampling make room for more digital circuitry on monolithic ADCs

Author

Wiegand, Jim

Subjects
Analog to Digital Converter, Integrated Circuit Fabrication, Circuit Design, Packaging Density, Miniaturization, Business, Electronics and electrical industries
Abstract

Self-calibration and oversampling technology allows new ADCs to contain more digital than analog circuitry. Self-calibration allows for looser tolerances on the analog circuitry and eliminates the need for potentiometers. It also allows the chip to adjust to changes over temperature and time. The increased percentage of digital circuitry provides more room for functions such as microprocessor interfaces. Oversampling is a digitally intensive conversion technique that is most adaptable to audio-frequency and low frequency signal environments.

Published
1987

27. PLD makers tiptoe toward 0.5 microns

Author

Wilson, Ron

Subjects
Programmable Logic Devices, Manufacturers, Product Development, Industry Analysis, Strategic Planning, Chip Packaging, Packaging Density, Trends, Circuit Design, Hardware Vendors
Published
1994

28. One-micron process ups complexity of gauging ASIC performance

Author

Andrews, Warren

Subjects
Application-Specific Integrated Circuit, Circuit Design, Packaging Density, Semiconductor Production Equipment, New Technique, Gate Arrays, VLSI Technology Inc. -- Innovations, LSI Corp. -- Innovations, Motorola Inc. -- Innovations
Published
1989

29. Memories holding on to more bits

Author

Weber, Sam

Subjects
DRAM, Packaging Density, Increase, Trends, Chip Packaging, Performance Improvement, Manufacturers, Industry Analysis, Review of Past Year, SRAM, Circuit Design
Published
1993

30. Litho's light still bright

Author

Santo, Brian

Subjects
Semiconductor Production Equipment, Enhancements, Photolithography, New Technique, Packaging Density, Circuit Design, Semiconductor Preparation, Industry Analysis, Outlook
Published
1991

31. Chip makers target read channels

Author

Costlow, Terry

Subjects
Hard Disk Drive, Disk Drives, Product Development, 2.5' Disk, Integrated Circuits, Packaging Density, Circuit Design, Enhancements, Data Transfer Rate, Read/Write Heads
Published
1990

32. Altera tips new EPLD architecture

Author

Baker, Stan

Subjects
Gate Arrays, Product Introduction, Circuit Design, Packaging Density, Altera Corp. -- Product introduction, Cypress Semiconductor Corp. -- Product development, Altera MAX 7000 (Programmable logic array) -- Product introduction
Published
1990

33. Heat demands advanced SMT packages for power use

Author

Tiziani, Roberto, Casati, Paolo, and Brechignac, Remi

Subjects
Surface-Mount Technology, Thermodynamics, Circuit Design, Packaging Density, Heat Transfer, Integrated Circuits
Published
1990

34. External switchers come of age

Author

Duarte, Bradford J.

Subjects
Circuit Design, New Technique, Switches, Computer-Aided Manufacturing, Enhancements, Industry Analysis, Power Supply, Manufacturers, Packaging Density
Published
1990

35. PLDs will blur into ASICs

Author

Birkner, John

Subjects
Gate Arrays, Logic Circuitry, Circuit Design, Trends, Outlook, Application-Specific Integrated Circuit, Industry Analysis, Packaging Density, Computer-Aided Engineering
Published
1990

38. Three-metal-layer TAB emerges

Author

Bindra, Ashok

Subjects
Integrated Circuit Fabrication, Circuit Design, New Technique, Technology, Chip Packaging, Packaging Density, Increase, Research and Development, Circuit Printing
Published
1990

39. Fine-pitch bursts onto the market

Author

Bindra, Ashok

Subjects
Circuit Design, Market Analysis, Packaging Density, Trends, Outlook, Chip Carriers, Integrated Circuits, Sales
Published
1990

40. Very small package hopes for bit IC impact

Author

Bindra, Ashok

Subjects
Chip Packaging, Integrated circuit fabrication, New Technique, Circuit Design, Packaging Density, Increase, Panda Project Inc. -- Innovations, Integrated circuit fabrication -- Innovations
Published
1994

41. FIM plates temper converter heat

Author

Bokil, Doug and O'Brien, Tony

Subjects
Converters, New Technique, Circuit Design, Packaging Density, Power Supply, Integrated circuit fabrication, Power resources -- Design and construction, Integrated circuit fabrication -- Innovations
Published
1994

42. Making a case for the proper socket

Author

Grabbe, Dimitry

Subjects
Circuit Printing, Circuit Design, Chip Packaging, Packaging Density, I/O Management, Multichip Module, Technology, Integrated circuit fabrication, Printed circuits -- Design and construction, Integrated circuit fabrication -- Methods
Published
1994

43. Design tools go the grid-array way

Author

LeBrun, Jim

Subjects
Chip Packaging, Packaging Density, Circuit Design, Circuit Printing, New Technique, Layout, Electronic design automation, Computer-aided design, Integrated circuit fabrication, Integrated circuits -- Design and construction, Printed circuits -- Design and construction, Electronic design automation -- Innovations, Computer-aided design, Integrated circuit fabrication -- Innovations
Published
1994

44. Turning down the heat

Author

Marcoux, Phil

Subjects
Chip Packaging, Heat Transfer, Processor Speed, Circuit Design, Packaging Density
Published
1994

45. PCB CAD Systems Tackle Surface Mount

Author

Goering, R.

Subjects
Circuit Design, Computer-Aided Design, Routing, Circuit Quality, New Product, Technology, Comparison, Packaging Density, Software Selection, Software Packages
Published
1985

49. A Miniature Chip Carrier for Microcircuit Applications

Author

Brown, R.L.

Subjects
Applications, Chip Carriers, Chip Packaging, Design, Hybrid Circuits, Assembly Line, Automation, Manufacturing, Microelectronics, Miniaturization, Size, Circuit Design, Arrays, Packaging Density, Integrated Circuits, Thick-Film Circuits
Published
1983

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