High Density Cofired Multilayer Ceramic Boards: Performance, Productivity and Cost Vs. Multilayer Thick Film Systems

Authors :: Higgins, L.M.III
Thomas, J.L.
Rydwansky, F.C.Jr.
Source :: International Journal for Hybrid Microelectronics. Oct, 1983, Vol. v6 Issue n1, pp475-483
Publication Year :: 1983

Subjects :: Circuit Design
Performance Improvement
Packaging Density
Ceramics
Thick-Film Circuits
Thick Films
Performance
Productivity
Thin Films
Substrates
Circuitry
Modules
Boards/Cards

Tools