Search

The high density of interface and surface states that cause the strong Fermi pinning observed on GaAs surfaces can be reduced by depositing GaN ultra-thin films on GaAs. To further improve this passivation, it is necessary to investigate the nitridation phenomena by identifying the distinct steps occurring during the process and to understand and quantify the growth kinetics of GaAs nitridation under different conditions. Nitridation of the cleaned GaAs substrate was performed using N 2 plasma source. Two approaches have been combined. Firstly, an AR-XPS (Angle Resolved X-ray Photoelectron Spectroscopy) study is carried out to determine the chemical environments of the Ga, As and N atoms and the composition depth profile of the GaN thin film which allow us to summarize the nitridation process in three steps. Moreover, the temperature and time treatment have been investigated and show a significant impact on the formation of the GaN layer. The second approach is a refined growth kinetic model which better describes the GaN growth as a function of the nitridation time. This model clarifies the exchange mechanism of arsenic with nitrogen atoms at the GaN/GaAs interface and the phenomenon of quasi-saturation of the process observed experimentally.

The electronic properties of n-type InP epitaxial layers covered by their native oxides have been investigated in order to explain the NO 2 gas sensing mechanism. The impact of interface states on the interface Fermi level, E F , carrier concentration in-depth profiles, n ( x ), and resistance, R , of n-InP layers has been studied by means of numerical analysis. The U-shaped interface state continuum, with the density minimum, N SS0 , from 10 10 to 10 13 eV −1 cm −2 , has been assumed at the InP interface according to the disordered-induced gap state model. Moreover, the surface fixed charge, Q FC , representing adsorbed ions at the semiconductor surface has been introduced. Also the influence of temperature on the electron distribution n ( x ) has been analysed. The n-InP layer resistance and Hall-effect measurements (using the Van der Pauw method) have been performed for the InP sensors before and upon NO 2 action in order to assess the influence of gas adsorption on the electron concentration and mobility as well as on the depletion layer width, W . On this basis the influence of interface states and near-surface region on the InP layer response to NO 2 adsorption has been determined. In addition, the conclusions for optimising the InP-based resistive sensor structure (in terms of the layer thickness and doping) have been obtained.

The benefits of using a low power glow discharge nitrogen plasma source to create high quality GaN layers on GaAs(001) surface are first highlighted. This uncommon type of plasma source has the particularity of working at a low power (3–10 W) and a low pressure (10 − 1 Pa) which induce creation of a small quantity of active nitrogen species. We put in evidence that this distinctiveness allows the growth of a stoichiometric and As-free GaN ultra-thin film on a GaAs(001) substrate by the mean of the inter-diffusion of As and N atoms. XPS, EELS, AFM are used to monitor surface composition and structure changes and to estimate the GaN thickness. A near saturation of the nitride layer thickness versus plasma exposure time is found. Furthermore, the possibility to crystallize the amorphous GaN layer by an annealing at 620 °C in a cubic structure with a lattice parameter close to that of c-GaN is put in evidence by means of TEM and LEED measurements. These measurements also show the homogeneity of the GaN thickness. In addition, the passivating effect of the GaN ultra-thin film to protect the GaAs surface is proved with the monitoring by XPS of the surface oxidation during several days of air exposure.

An in situ method based on the combination between XPS and MM-EPES techniques is developed in order to study the growth mode and to determine the nanostructure surface of a deposited ultra thin film on solid substrate by determining both the thickness and the covering. In this way, XPS and MM-EPES modeling are done by adapting a simple approach of the surface organization. Then this method is used to study a gold film deposition on an oxidized silicon substrate. This study leads to determine accurately the surface organization and thus the growth mode. Moreover, the obtained results were validated by performing microscopic measurement by Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM). AFM and SEM results show a good agreement with those determined by the combination of XPS and MM-EPES techniques. Moreover, experiment shows that this method is able to determine surface parameters when the microscopy techniques do not give any information in the case of a small quantity of deposited Au.

O2SF6 plasma effects on processed GaAs surfaces have been investigated. The influence of plasma parameters such as composition, power and exposure time has been studied. The microwave plasma treatment efficiency has been studied by surface depth profiling (cycles consisting of XPS measurements followed by a slight etching) coupled with an original modelling calculation. We have pointed out that SF6 addition in plasma increases the oxidative rule of oxygen by increasing the total oxide thickness and that the quantity of the different oxidative and passivating species does not limit the oxidative mechanism, in the O2:SF6 ratio range 80:20 to 40:60. The increase in the plasma power leads to a change in the composition of the outer region of the oxide layer with an increase in the gallium content on the surface, and to an increase in the total oxide layer. The exposure time to the plasma increases also these two phenomena.

The aim of the present study is to demonstrate the feasibility to form well-ordered nanoholes on InP(1 0 0) surfaces by low Ar + ion sputtering process in UHV conditions from anodized aluminum oxide (AAO) templates. This process is a promising approach in creating ordered arrays of surface nanostructures with controllable size and morphology. To follow the Ar + ion sputtering effects on the AAO/InP surfaces, X-ray photoelectron spectroscopy (XPS) was used to determine the different surface species. In 4d and P 2p core level spectra were recorded on different InP(1 0 0) surfaces after ions bombardment. XPS results showed the presence of metallic indium on both smooth InP(1 0 0) and AAO/InP(1 0 0) surfaces. Finally, we showed that this experiment led to the formation of metallic In dropplets about 10 nm in diameter on nanoholes patterned InP surface while the as-received InP(1 0 0) surface generated metallic In about 60 nm in diameter.

This article investigates the growth of InN layers on (1 0 0) InP in ultra-high vacuum using a glow discharge source (GDS). Auger electron spectroscopy (AES) was used to understand the different steps of the nitridation process with the analysis of In-MNN, N-KLL and P-LMM transitions. A modeling of Auger signals using a stacked layers model allows us to confirm that four monolayers of indium nitride are created on (1 0 0) InP. InN layers grown on (1 0 0) InP were studied optically by photoluminescence (PL) spectroscopy versus the excitation power and the sample temperature (10–300 K). Results show broad spectral band energy close to the lowest reported InN bandgap. The temperature dependence of the PL peak energy showed a S-shaped behavior (decrease–increase–decrease). The results suggest that the InN-related emission is significantly affected by the change in carrier dynamics with increasing temperature: the effect can be due to the large exciton localization effects.

Preparation of processed GaAs surface cleaning in view of molecular beam epitaxy regrowth by means of a O 2 SF 6 microwave plasma has been investigated. Photoemission, Auger electron spectroscopy, atomic force microscopy and secondary ion mass spectrometry have been used for characterization. The O 2 SF 6 plasma treatment was found to be very efficient for decontaminating the GaAs surface and leads to the formation of an oxide layer that can be taken off by a thermal or low-temperature H-plasma-assisted deoxidation. The levels of oxygen and carbon contaminants at the regrowth interface were measured to be in the range of a standard homoepitaxial layer–epiready substrate interface. Fluorine was observed to be eliminated upon deoxidation while sulphur is present, particularly in the case of low temperature grown layers. This plasma treatment was found to be efficient for preparation of processed GaAs surfaces for molecular beam epitaxial regrowth.

A multiple analysis of a defective nitrided case has been used to investigate different parts of the over layer region. Experiments by means of X-ray photoelectron spectroscopy (XPS), electron probe microanalysis (EPMA), light microscopy and microhardness measurements were done at different scales and information was given on the structural and physico-chemical properties. The metallographic study allowed estimating the nitrided case depth together with hardness and nitrogen concentration profiles in depth. Also, the irregular nitrogen concentration and the irregular hardness profiles, in a parallel direction to the surface, were correlated with the structure features in the nitrided sample cross-section. One can notice a reasonable connection among the different results, which gives a good understanding of the defective nitrided sample.

The nitridation of GaAs(1 0 0) surfaces has been studied using XPS spectroscopy, one of the best surface sensitive techniques. A glow discharge cell was used to produce a continuous plasma with a majority of N atomic species. We used the Ga3d and As3d core levels to monitor the chemical state of the surface and the coverage of the species. A theoretical model based on stacked layers allows to determine the optimal temperature of nitridation. Moreover, this model permits the determination of the thickness of the GaN layer. Varying time of nitridation from 10 min to 1 h, it is possible to obtain GaN layers with a thickness between 0.5 nm and 3 nm.

This paper deals with the chemical and sensing properties of n-type indium phosphide (InP) epitaxial layers, which were applied in a novel resistive structure for gas detection. The influence of working temperature on the structure response to the oxidising gas, nitrogen dioxide (NO2), in the ppb range was investigated. Also, the in-depth profiles of charge carrier concentration and resistivity of the InP material were calculated at various temperatures. In order to understand better the sensing mechanism, a detailed analysis of the chemical properties of the InP surface before and after gas action was performed by means of X-ray photoelectron spectroscopy (XPS) combined with Auger spectroscopy (AES) and Ar+ sputtering of the sample.

III–V semiconductor compound structures are widely applied in technology of advanced microelectronics, optoelectronics, and gas sensors. In this paper, we report on the use of XPS to characterize in situ the interaction of thermally activated hydrogen atoms and hydrogen molecules with InP(1 0 0) surfaces covered by thin InN overlayers. XPS spectra were taken with an ESCALAB-210 spectrometer after repeated hydrogenation cycles at temperatures up to 350 °C. The evolution of the In 3d, In 4d, P 2p, N 1s, O 1s and C 1s photoelectron spectra was carefully monitored. The XPS spectra of the hydrogen exposed surface revealed significant differences compared to those from the non-hydrogenated surface. InN films were found to be weakly reactive to hydrogen under experimental conditions explored. The behavior of P atoms at the hydrogenated surface was dependent on the parameters characterizing each hydrogenation (exposure, hydrogen species used, annealing temperature). Moreover, the heavily hydrogenated surface exhibited a phosphorus enrichment.

Electron spectroscopy (AES and XPS) and photoluminescence analysis (PL) were used to study porous layers elaborated by electrochemical etching of p-GaAs and n-InP substrates. Surface characterizations have been performed on the as received porous substrates, ions bombarded and nitridated porous layers. Porous surfaces of GaAs(1 0 0) and InP(1 0 0) have been compared after different treatments: Argon ion bombardment and nitridation with a glow discharge source (GDS) in UHV. These processes have been followed by Auger measurements (AES). The effects of the bombardment and the nitridation of porous InP were studied. The PL investigations of the porous GaAs layer show visible and infrared photoluminescence bands. Quantum confinement in the nanocrystallites of GaAs formed by electrochemical etching can explain the luminescence of the porous GaAs layers.

Nitridation of GaAs(1 0 0) is performed using a double differential pumping RF cell. X-ray photoelectron spectroscopy (XPS) is used to monitor surface composition changes that result from ionic etching by Ar+ bombardment and nitridation of this substrate. We have studied the influence of temperature and pressure of nitrogen. The process of nitridation leads to the formation of a nitride layer which seems to be a ternary compound of gallium, arsenic and nitrogen. To improve the composition of the surface layer and to obtain pure GaN thin films on the surface by stopping arsenic migration, we have performed another kind of nitridation process. It consists, firstly, of a deposition of metallic gallium on the substrate surface. The system Ga/GaAs is then nitrided and the XPS measurements indicate the formation of a GaN layer on the surface.

The effects of the energy density distribution and relaxation time of the interface state on electric parameters of Au/InSb/InP(100) Schottky diodes were investigated, in the latter diode, InSb forms a fine restructuration layer allowing to block P atoms migration to surface. To be sure of the disappearance of the In droplets, a high quantity of Sb was evaporated and the excess was eliminated by heating the substrate surface at 300 °C before evaporating Au onto it. The current–voltage I(VG) and capacitance–voltage C(VG) characteristics are measured as a function of frequency (100 Hz–1 MHz). Typical Ln[I/(1−e−qVG/kT)] versus VG characteristics of Au/heated InSb/InP(100) Schottky diode under forward bias show two linear regions separated by a transition segment. From the first region, the slope and the intercept of this plot on the current axis allow to determine the ideality factor n and the saturation current Is evaluated to 1.79 and 1.64×10−7 A, respectively. The mean density of interface states estimated from the C(VG) measurements was 1.57 1012 cm−2 eV−1. The interface states were responsible for the non-ideal behavior of the I(VG) characteristics, the capture cross-section σn for the fast slow varies between 2.16×10−11 and 7.13×10−12 cm2 for the relaxation times range 7.9×10−3–2.4×10−2s.

We report the Au catalyst-assisted synthesis of 20 μm long GaAs nanowires by the vapor-liquid-solid hydride vapor phase epitaxy (HVPE) exhibiting a polytypism-free zincblende phase for record radii lower than 15 nm down to 5 nm. HVPE makes use of GaCl gaseous growth precursors at high mass input of which fast dechlorination at the usual process temperature of 715 °C results in high planar growth rate (standard 30-40 μm/h). When it comes to the vapor-liquid-solid growth of nanowires, fast solidification at a rate higher than 100 μm/h is observed. Nanowire growth by HVPE only proceeds by introduction of precursors in the catalyst droplets from the vapor phase. This promotes almost pure axial growth leading to nanowires with a constant cylinder shape over unusual length. The question of the cubic zincblende structure observed in HVPE-grown GaAs nanowires regardless of their radius is at the heart of the paper. We demonstrate that the vapor-liquid-solid growth in our conditions takes place at high liquid chemical potential that originates from very high influxes of both As and Ga. This yields a Ga concentration systematically higher than 0.62 in the Au-Ga-As droplets. The high Ga concentration decreases the surface energy of the droplets, which disables nucleation at the triple phase line thus preventing the formation of wurtzite structure whatever the nanowire radius is.

EPES (elastic peak electron spectroscopy) allows measuring the percentage of elastic backscattered electrons η e from a surface excited by primary electrons. However, this method must be combined with Monte Carlo simulations to get quantitative information. After a brief description of the algorithm used in this work (named MC2), we focused on the adaptation of this simulation for nanoporous surfaces (named MC2-NP). The theoretical results obtained put in evidence the dependence of η e versus pore diameter (d), depth of the pores (h) and covering rate (CR) of the pores on the surface. Results obtained on surfaces having cylinder-shaped and cone-shaped holes with nanometer dimensions are presented too. To validate theoretical results obtained with MC2-NP, silicon(111) nanoporous surfaces have been prepared with an anodized aluminum oxide (AAO) template and by argon ion bombardment in an UHV chamber. Uniform nanohole arrays were formed as a replica of ordered lattice pattern of the template. Then EPES experimental measurements have been performed on planar and nanoporous Si(111) surfaces using a retarding field analyzer (RFA). The experimental results put in evidence that the percentage of the elastically backscattered electrons is influenced by the patterning of the surface. Then comparing values of η e obtained experimentally with those obtained with MC2-NP simulations, we show the sensitivity of the EPES method for studying nanoporous surfaces. In this way, we expect fast estimation of nanohole's dimensions by in-situ MM-EPES (Multi-Mode EPES) without other techniques such as for example scanning electron microscopy.

The purpose of this paper is to characterize interface states in Au/InSb/InP(1 0 0) Schottky-type diodes and determine the effect of InSb surface preparation on the energy density distribution and relaxation time of the interface state. In the latter diode, InSb forms a fine restructuration layer allowing to block In atoms migration to surface. We have proceeded as follows: first, a great amount of antimony has been evaporated and, as a second step, the excess antimony is removed by heating the substrate at 300°C. The characteristic parameters of the interface states are derived from the capacitance-voltage C ( V G ), conductance–voltage G ( V G ) measured as a function of frequency and current–voltage I ( V G ) under forward biases. The mean density of interface states N ss estimated was 3.05×10 12 eV −1 cm −2 , the interface states were responsible for the non-ideal behavior of the I ( V G ) characteristics of the diodes. The relaxation times are independent of the bias and varies with N ss in the range 7.1×10 −4 s and 3.7×10 −3 s.

In this work, we measure the current–voltage ( I – V ) and the capacitance–voltage ( C – V ) characteristics of the Au/InP(100) and Au/InSb/InP(100) Schottky type diodes. The InP( n ) substrate is restructured by some monolayers of the InSb thin film. We then propose a study of the electrical quality of the elaborated components after the Au/InP interface creation; first without annealing and then after annealing by heating at 500°C temperatures. Analysis of the measured I ( V ) characteristics for the Au/InP and Au/InSb/InP samples allows the determination of the electrical parameter variations. The saturation current I s , the serial resistance R s , the mean ideality factor n and also the barrier height φ B n , are respectively equal to 2.10×10 −4 A, 19 Ω, 1.8 and 0.401 eV for the Au/InP sample and equal to 1.34×10 −7 A, 175 Ω, 1.78 and 0.592 eV for the Au/heated InSb/InP. Another good result is that the analysis and simulation of the I ( V ) and the C ( V ) characteristics allows us to determine the very important mean interfacial state density N ss(mean) , and is obtained to be equal 4.23×10 12 eV −1 cm −2 for the Au/InP sample and equal to 4.42×10 12 eV −1 cm −2 for the Au/heated InSb/InP. This work thus permits the evolution study of these electrical parameters related to the restructuration conditions.

In this work, we have studied the dominant transport mechanism in an Au/InSb/InP diode. The InP (n) substrate is restructured with some monolayers of an InSb thin film. The structures have been characterized electrically and the C(V) and I(V) curves have been plotted. The saturation current , the serial resistance and the mean ideality factor n were calculated using the I(V) characteristics and are respectively equal to , and 1.7. Thus, the doping level and diffusion voltage were deduced from the C(V) curves and are evaluated to and . The analysis of I(V) and C(V) characteristics allows us to determine that the mean interfacial density of states and the transmission coefficient are respectively equal to and . The presence of deep discrete donor levels in the semiconductor bulk and/or the distributed density of states is responsible for the nonlinearity of the characteristic because the C(V) curve is controlled by two donor levels located at 0.76 eV and 1.02 eV relative to the conduction band edge .

The usefulness of elastic peak electron spectroscopy (EPES) has been demonstrated by application to a semiconductor study of indium phosphide or InAsP. In this paper, we present some results obtained with EPES. The inelastic mean free paths of indium phosphide have been calculated using EPES and the Monte-Carlo simulation or electron trajectories in solids. The second part of this work deals with the determination of the concentration of elements in heterostructures such as Au/InSb/InP(100) and InAs x P 1-x , and the results are compared to those obtained using AES.

This work attempts to characterize the Au/InP Schottky diode at different temperatures (in the range 300–425 K). The InP surface is restructured with an InSb thin film with several monolayers. I(V) analysis versus different temperatures gives the saturation current variation Is (2×10−5–7×10−5 A), the mean ideality factor (1.7–1.24), the barrier height (0.47–0.45 V), and finally the serial resistance Rs variations (85–19 Ω). The doping concentration Nd and the diffusion voltage Vd are calculated using the C(V) characteristics. The concentration Nd is 3×1015 cm−3 at room temperature and increases with thermal activation to 7×1015 cm−3 at 425 K. Nevertheless, the diffusion voltage Vd is reversibly proportional to the doping concentration Nd and decreases from 33.7×10−2 to 29×10−2 V. The mean interfacial state density Nss decreases with increasing temperature, from 4.33×1012 to 1012 cm−2.eV−1. This improvement is the result of molecular restructuring and reordering at the Au/InP interface. For temperatures less than 375 K, the C(V) characteristic is controlled by an important interfacial state density and/or the presence of deep donor levels in the semiconductor bulk. At temperatures greater than 375 K, the C−2(V) curve is linear and the deep donor levels disappear. The traps effect is also reduced.

Alumina was evaporated on InP(100) and InSb/InP(100) substrates. The InSb buffer layer permits thermal and structural protection of the indium phosphide substrate. This layer was obtained by condensation of antimony atoms on the indium-rich InP surface after ionic etching. The evaporation of antimony leads to Sb-In bonds. Modellization of the Auger signal variations during alumina condensation was compared to the experimental results. Auger measurements indicate the improvement of the elaborated structure. This fact has been confirmed by the electrical C(V) characterizations.

InP(100) is a promising substrate for microelectronic and optoelectronic devices due to its high mobility. Sb atomic condensation induces the formation of some InSb overlayers that produce passivation of the surface. First steps of the mechanism have been studied at atomic scale using synchrotron radiation. The process of InSb formation is due to a 3D-2D phase transformation. In this work we also point out the effect of the sample heating. Results are in good agreement with previous ones obtained by Auger electron spectroscopy (AES) and electron energy loss spectroscopy (EELS). We have obtained a good stabilization of the surface with respect to any prolonged heating up to 450 °C. The size of the In or Sb clusters decreases with temperature: the InSb monolayer becomes almost stoichiometric at 450 °C. The substrate has also a good quality for an optimum behavior of electronic components (L. Bideux, B. Gruzza, A. Porte and H. Robert, Surf. Interface Anal., 20 (1993) 803–807).

AES (Auger electron spectroscopy) and EELS (electron energy loss spectroscopy) have been used to study the first stages of the Al 2 O 3 Si and Al 2 O 3 InP interfaces formations. Alumina was condensed using an evaporation cell heated by an electronic bombardment. InP is one of the most promising materials for applications in high speed and optoelectronic devices, but surface and interface properties have an important influence on the performance of components. This paper is divided in two parts: (1) Test of alumina deposition on Si(100) substrates and comparison with published results. (2) Condensation on InP(100) substrates (cleaned with a Ar+ bombardment)

The Curie temperature of Mn5Ge3 has been successfully enhanced by carbon doping. In this context the diffusion of a carbon thin film in Mn5Ge3 has been studied at room temperature. A value of the diffusivity of about D = 2.4 × 10-23 ± 0.5 × 10-23 m2 s-1 is reported. This value is in the typical range of interstitial diffusion coefficients. Moreover Auger Ge and Mn peaks shifts and Ge3d core level have been investigated to get some details on the reactivity of carbon atoms in Mn5Ge3. Mn Auger transitions display a shift of 4 eV whereas Ge transitions do not. Similarly Ge3d core level does not contain C related contribution but presents a Mn one. These observations confirmed the fact that carbon atoms are not inert species for Mn. It suggests that a ternary Ge-Mn-C alloy could occur and should be taken into account when doping the Mn5Ge3 with carbon. (© 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)

Efficient visible luminescence from porous Si (PSi) layers is associated with the quantum size and the presence of hydrogen as a passivant on the inner surface. The increase of the amount of H was performed by wet chemical etching in HF, producing the increase of photoluminescence intensity. The detection of H is not possible by AES or XPS and is difficult even with EELS. Elastic peak electron spectroscopy (EPES) showed a large decrease of the elastic reflection coefficient reappearing in the elastic peak, and measured with a retarding field analyser (RFA). The effective elastic backscattering coefficients of a monolayer of H, Si, O were calculated for the RFA angular window and resulted in reasonable agreement with literature data available

The interaction of H 2 and H + with InP(100) surfaces was studied by AES, EELS and EPES (elastic peak electron spectroscopy) supply more information than AES (Auger electron spectroscopy) alone. EPES measures the intensity of the elastic peak; the signal magnitude is determined by the elastic scattering cross section and the inelastic mean free path. Dramatic changes in the EPES spectra were observed on InP(100) surface cleaned by Ar + ion bombardment and then exposed to 70 L H 2 . For the evaluations of the EPES spectra, effective elastic scattering cross sections for a monolayer of H, C. P and In atoms were calculated for electron energies between E=50 and 300 eV range. AES and EPES spectra indicated enrichment of P in the surface layer, heating the ion etched sample to 473 K and exposing it to H 2 resulted in the formation of a P monolayer on the surface, while the bombardment of the surface with H + ions produced depletion of P in the surface layer. No experimental evidence was found using EELS (electron energy loss spectroscopy) and EPES for adsorption of H on the InP(100) surface.

The model of quantitative interpretation of Auger electron spectroscopy (AES) results is described and some complementary electron energy loss spectroscopy (EELS) results are also reported. It is shown that the InP(100) surfaces perturbed by the Ar+ cleaning treatment can be ordered by Sb deposition. The variations of ditferent Auger lines are interpreted, and the transformations 3D → 2D of the initially formed In clusters can be well-followed during the frrst stages of the deposition. PACS numbers: 68.35.Βs, 68.35.Fx, 72.80.Ey, 82.80.Pv

Quantitative and qualitative analysis techniques were employed to study the first stages of ultra-high vacuum plasma nitriding of the 42CrMo4 steel. At constant treatment temperature, maintained for all samples at about 360 °C, we have established the influence of treatment time on the chemical composition, thickness and electrical properties of the nitrided layer. In this purpose it was used a stacking atomic layer model describing the sample surface, which takes into account the attenuation depth of photoelectrons by the atomic monolayers. So, we have found that after 2 h of nitriding in laboratory conditions, 70% of the nitrided layer was composed of iron oxide. Also, I – V measurements indicate an influence of the nitride overlayer with increasing treatment time.

International audience; The nitridation of InP(1 0 0) surfaces has been studied using synchrotron radiation photoemission. The samples were chemically cleaned and then ion bombarded, which cleaned the surface and also induced the formation of metallic indium droplets. The nitridation with a Glow Discharge Cell (GDS) produced indium nitride by reaction with these indium clusters. We used the In 4d and P 2p core levels to monitor the chemical state of the surface and the coverage of the species present. We observed the creation of In-N and P-N bonds while the In-In metallic bonds decrease which confirm the reaction between indium clusters and nitrogen species. A theoretical model based on stacked layers allows us to assert that almost two monolayers of indium nitride are produced. The effect of annealing on the nitridated layers at 450 °C has also been analysed. It appears that this system is stable up to this temperature, well above the congruent evaporation temperature (370 °C) of clean InP(1 0 0): no increase of metallic indium bonds due to decomposition of the substrate is detected as shown in previous works [L. Bideux, Y. Ould-Metidji, B. Gruzza, V. Matolin, Surf. Interface Anal. 34 (2002) 712] studying the InP(1 0 0) surfaces.

International audience; The nitrides of group III metals: AlN, GaN and InN are very important materials due to their applications for short wavelength opto-electronics (light-emitting diodes and laser diodes). It is essential for the realization of such novel devices to grow high-quality nitride single crystals. In this paper, we report the first stages of the InP(1 0 0) surfaces nitridation in order to grow high-quality nitride films. Indeed, the nitridation process is an important step in the growth of nitrides [J. Vac. Sci. Technol. A 17 (1999) 2194; Phys. Status Solidi A 176 (1999) 595]. Previous works [Synth. Met. 90 (1997) 2233; Appl. Phys. Lett. 63 (1993) 1957] have shown that in situ Ar+ ions bombardment is useful on the one hand to clean the surface, and on the other hand to create droplets of metallic indium in well-controlled quantity. Then the indium metallic enrichment of the surface, monitoring by elastic peak electron spectroscopy (EPES) and Auger electron spectroscopy (AES) allows to prepare the III-V semiconductors surfaces to the nitridation step. The nitridated process has been performed with a high voltage plasma discharge cell and has been studied using quantitative Auger electron spectroscopy, elastic peak electron spectroscopy and electron energy loss spectroscopy (EELS), in order to optimize the conditions of InN layers formation.

Porous GaAs layers were formed by electrochemical etching of p-type GaAs(1 0 0) substrates in HF solution. A surface characterization has been performed on p-type GaAs samples using X-ray photoelectron spectroscopy (XPS) technique in order to get information about the chemical composition, particularly on the surface contamination. According to the XPS spectra, the oxide layer on as-received porous GaAs substrates contains As2O3, As2O5 and Ga2O3. Large amount of oxygen is present at the surface before the surface cleaning. Compared to untreated GaAs surface, room temperature photoluminescence (PL) investigations of the porous layers reveal the presence of two PL bands: a PL peak at ∼871 nm and a “visible” PL peak at ∼650–680 nm. Both peak wavelengths and intensities varied from sample to sample depending on the treatment that the samples have undergone. The short PL wavelength at 650–680 nm of the porous layers is attributed to quantum confinement effects in GaAs nano-crystallites. The surface morphology of porous GaAs has been studied using atomic force microscopy (AFM). Nano-sized crystallites were observed on the porous GaAs surface. An estimation of the mean size of the GaAs nano-crystals obtained from effective mass theory and based on PL data was close to the lowest value obtained from the AFM results.

Quantitative X-ray photoelectron spectroscopy was used to characterize the native oxide film formed on 42CrMo4 steel surface by air exposure in normal conditions. In order to determine the thickness and composition of the oxide layer we have used a stacking layer model together with experimental XPS sputtering depth profiling. At a nanoscale study, to obtain quantitative results one must take into account fundamental parameters like the attenuation depth of photoelectrons. We have found that both lepidocrocit (γ-FeOOH) and magnetite (Fe3O4) were present and the total thickness of the oxide layer was 16 monolayers.

In this study, InP(1 0 0) surfaces were bombarded by argon ions in ultra high vacuum. Indium metallic droplets were created in well controlled quantities and played the role of precursors for the nitridation process. A glow discharge cell was used to produce a continuous plasma with a majority of N atomic species. X-ray photoelectron spectroscopy (XPS) studies indicated that the nitrogen combined with indium surface atoms to create InN thin films (two monolayers) on an In rich-InP(1 0 0) surface. This process occurred at low temperature: 250 °C. Synchrotron radiation photoemission (SR-XPS) studies of the valence band spectra, LEED and EELS measurements show an evolution of surface species and the effect of a 450 °C annealing of the InN/InP structures. The results reveal that annealing allows the crystallization of the thin InN layers, while the LEED pattern shows a (4 × 1) reconstruction. As a consequence, InN related structures in EELS and valence bands spectra are different before and after the annealing. According to SR-XPS measurements, the Fermi level is found to be pinned at 1.6 eV above the valence band maximum (VBM).

This article investigates the nitridation effect of InP(100) semiconductor surfaces performed using a glow discharge cell. Auger electron spectroscopy and XPS were used to understand the different steps of this process. An important point is the initial quantity of metallic indium on the InP(100) surfaces. Indeed the indium droplets, created in well-known quantity, play the role of precursor. At a relatively low temperature of 523 K the system undergoes surface restructuring, which includes removal of the In droplets and the formation of two InN monolayers. Phosphorus-nitrogen bonds have been detected by the analysis of P LMM Auger peaks, and In-N bonds by analysis of the In 4d XPS peak. However, the presence or not of metallic indium inside this InN overlayer is crucial for passivation of the substrate. Ex situ photoluminescence measurements correlated to the electron spectroscopies results have shown the good passivation effect of the InP(100) surfaces by InN overlayers for 40 min of nitridation.

International audience; Auger electron spectroscopy (AES) was used to investigate the processes taking place during the initial stages of InP(100) surfaces nitridation. This AES study combined with electrical measurements (intensity-potential) shows that the processes greatly differ depending on the nitridation angles. Results show that with grazing angle for nitrogen flow, the nitridation process is more efficient. Results obtained with AES spectra are coherent with electrical measurements : Hg/InN/InP(100) Schottky diodes present better electrical characteristics in the case of a grazing flow. That means, the adsorption of nitrogen on the surface is more important for this configuration.

The cleaning and the nitridation of GaAs(1 0 0) substrates have been studied in this work by electron energy loss spectroscopy (EELS), elastic peak electron spectroscopy (EPES) and X-ray photoelectron spectroscopy (XPS). The nitridation of GaAs(1 0 0) was performed using a double differential pumping RF cell. We have studied in a first part, the surface modifications of the substrate during ionic cleaning. In a second part, we have determined the λ i ( E ) K ( E , E n ) curves from EELS spectra using Tougaard's procedure for cleaned-GaAs(1 0 0) and nitrited-GaAs(1 0 0) substrates. The thickness of the GaN overlayer was deduced from these results.

A double chamber vacuum system was constructed for the electron spectroscopy study of GaN layer growth. The samples are prepared by vacuum deposition from Knudsen-type Ga source in the afterglow atmosphere of active nitrogen produced by high-pressure RF-plasma source. The growth chamber is connected to the analysis chamber equipped with electron spectroscopy (XPS, AES) analysis, permitting to study the chemical composition of layers as a function of growing conditions. It is shown that the new RF-source is suitable for preparation of pure stoichiometric GaN layers.

The paper deals with porous Si (PSi) samples, prepared with different parameters (substrate, current density, solution, etc.) of anodization and anodic oxidation. The porosity of samples varied between 36 and 78%, their thickness was 1–5 p.m. The samples were studied in six laboratories using complementary methods. The spectra of elastic reflection coefficients r e (E p ) are characteristic of the composition and they are affected by the structure of the surface layer. They were measured with a retarding field analyser using spectrometer correction and deduced from the elastic peak versus E p primary energy. The r e (E p ) showed a dramatic decrease in the 50–100 eV range with H adatoms on the surface, produced by HF treatment. It is caused by attenuation and multiple elastic reflections of electrons on the porous surface with H adatoms. An oxidized sample showed a contrary effect, which can be explained by the elastic reflection cross-sections of Si and O in this low energy range. Valence band XPS spectra were measured with a KRATOS XSAM 800 analyser. They showed changes with HF treatment and porous structure. To avoid difficulties with STM due to the oxide, the surface topography was mapped by atomic force microscopy, resulting in 0.3–0.9 nm roughness on samples of 36% porosity.

Ion beam nitridation of indium phosphide (100) substrates was studied using x-ray photoelectron spectroscopy (XPS) and Auger electron spectroscopy (AES). Argon ion bombardment of the InP(100) surface removes the native oxides and induces the formation of three-dimensional indium clusters. After cleaning, the samples were nitrided in an ultrahigh vacuum chamber using a home-made radiofrequency plasma source (13.56 MHz) that allows nitridation at low pressures (10−4 Pa). We have studied the influence of temperature on the nitridation mechanisms. For low temperature (T < 200°C), no variation of the metallic indium droplets was observed; for high temperature (T > 270°C), the first layers of the substrate were damaged. The optimal temperature for the nitridation of InP(100) was found to be 250°C.

This paper deals with both the theoretical and experimental analysis of electronic properties of n-type indium phosphide (n-InP) epitaxial layers covered by native oxides for gas sensor applications. The rigorous calculations of the influence of continuous surface states with U-shaped density distribution NSS(E) as well as surface fixed charge (QFC) representing adsorbed ionized species or surface ?-doping on the conductivity of n-InP layers were carried out. The surface state density minimum (NSS0) was changed from 1011 to 1013 eV-1cm-2. From the Hall effect measurements upon NO2 exposition the concentration of charge carriers was determined as a function of gas concentration. Additionally, the roughness of the n-InP surface before and after gas action was investigated by using AFM.