55 results on '"Tu, K.N."'
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2. Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget
3. Non-destructive Observation of Void Formation Due to Electromigration in Solder Microbump by 3D xray
4. Enhancement on the bonding strength of Cu-Cu joints by 2 steps annealing
5. Electromigration and thermomigration in flip chip solder joints
6. Electromigration effect on strain and mechanical property change in lead-free solder joints
7. Electromigration failure with thermal gradient effect in SnAgCu solder joints with various UBM.
8. Electromigration Study in Flip Chip Solder Joints.
9. Electromigration effect on strain and mechanical property change in lead-free solder joints.
10. Electromigration in eutectic tin-lead solder lines at the device temperature.
11. Effect of electromigration on mechanical behavior of solder joints.
12. Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature.
13. Morphology, growth and size distribution of Cu6Sn5 intermetallic compound by flux-driven ripening at SnPb solder and Cu interface.
14. {113} defect-engineered silicon light-emitting diodes.
15. Unique phase changes induced by electromigration (EM) in solder joints.
16. Determination of metal/Si contact temperature during electrical current stressing.
17. Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization.
18. Effect of electromigration on intermetallic compound formation in Pb-free solder-Cu interfaces.
19. Reliability issues of Pb-free solder joints in electronic packaging technology.
20. Structure and kinetics of Sn whisker growth on Pb-free solder finish.
21. Crystallization of electroless Ni-P under bump metallization induced by solder reaction.
22. A novel approach to study patterned thin film local stress for microelectronics application.
23. Nano silicide formation in nano Si wires.
24. Microstructure evolution of tin under electromigration studied by synchrotron X-ray micro-diffraction.
25. Reliability issues of Pb-free solder joints in electronic packaging technology
26. {113} defect-engineered silicon light-emitting diodes
27. Effect of electromigration on intermetallic compound formation in Pb-free solder-Cu interfaces
28. Structure and kinetics of Sn whisker growth on Pb-free solder finish
29. Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
30. Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization
31. Morphology, growth and size distribution of Cu/sub 6/Sn/sub 5/ intermetallic compound by flux-driven ripening at SnPb solder and Cu interface
32. Determination of metal/Si contact temperature during electrical current stressing
33. Impact reliability of solder joints
34. Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature
35. Metal silicon interfacial reactions in SOI
36. Effect of electromigration on mechanical behavior of solder joints
37. Electromigration in eutectic tin-lead solder lines at the device temperature
38. In-situ transmission electron microscopy study of nanotwinned copper under electromigration.
39. Nucleation and growth of epitaxial silicide in nanowire of silicon.
40. Metal silicon interfacial reactions in SOI.
41. Electromigration in Flip Chip Pb-Free Solder Joints.
42. Thermomigration in SnPb composite solder joints and wires.
43. Synchrotron radiation based X-ray micro-diffraction study on reliability issues of solder joints in electronic packaging technology.
44. In-situ study of the effect of electromigration on strain evolution and mechanical property change in lead-free solder joints.
45. Electromigration in Pb-free solder bumps with Cu column as flip chip joints.
46. A study of electromigration in Sn3.5Ag and Sn3.8Ag0.7Cu solder lines.
47. Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad.
48. Impact reliability of solder joints.
49. Effect of Concentration Gradient on Phase Stability.
50. Kinetic and Thermodynamic Aspects of Phase Evolution in Ti/a-Si Multilayer Films.
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