Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature.

Details

Language :

English

ISBNs :

9780780390850

Database :

Complementary Index

Journal :

Proceedings International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces, 2005

Publication Type :

Conference

Accession number :

81266287

Full Text :

https://doi.org/10.1109/ISAPM.2005.1432044