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Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization.
- Source :
- 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345); 2002, p1201-1205, 5p
- Publication Year :
- 2002
Details
- Language :
- English
- ISBNs :
- 9780780374300
- Database :
- Complementary Index
- Journal :
- 52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345)
- Publication Type :
- Conference
- Accession number :
- 81103413
- Full Text :
- https://doi.org/10.1109/ECTC.2002.1008259