Electromigration effect on strain and mechanical property change in lead-free solder joints.

Details

Language :

English

ISBNs :

9781424406647

Database :

Complementary Index

Journal :

2006 8th Electronics Packaging Technology Conference

Publication Type :

Conference

Accession number :

80811413

Full Text :

https://doi.org/10.1109/EPTC.2006.342808