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Electromigration in Flip Chip Pb-Free Solder Joints.

Authors :
Tu, K.N.
Source :
2007 8th International Conference on Electronic Packaging Technology; 2007, p1-1, 1p
Publication Year :
2007

Details

Language :
English
ISBNs :
9781424413928
Database :
Complementary Index
Journal :
2007 8th International Conference on Electronic Packaging Technology
Publication Type :
Conference
Accession number :
80877859
Full Text :
https://doi.org/10.1109/ICEPT.2007.4441566
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