Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad.

Details

Language :

English

ISBNs :

9780780389076

Database :

Complementary Index

Journal :

Proceedings Electronic Components & Technology, 2005. ECTC '05

Publication Type :

Conference

Accession number :

81215000

Full Text :

https://doi.org/10.1109/ECTC.2005.1441307