39 results on '"Sleeckx, E."'
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2. Barrier and seed repair performance of thin RuTa films for Cu interconnects
3. Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration
4. Optimization of low temperature silicon nitride processes for improvement of device performance
5. Impact of LKD5109™ low- k to cap/liner interfaces in single damascene process and performance
6. Characterisation and integration feasibility of JSR’s low- k dielectric LKD-5109
7. Characterization and Integration in Cu Damascene Structures of AURORA, an Inorganic Low-k Dielectric
8. Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications.
9. Temperature dependence of the optical gap in thin amorphous films of As2S3, As2Se3 and other basic non-crystalline chalcogenides
10. On the optical constants of amorphous Ge xSe 1− x thin films of non-uniform thickness prepared by plasma-enhanced chemical vapour deposition
11. Numerically Optimized Double Layer Antireflective Coating for High Efficiency Interdigitated Back Contact (IBC) Silicon Solar Cells
12. Cost Effective Dry Oxidation for Emitter Passivation: A Key Step for High Efficiency Screen Printed p-Type PERC Solar Cells
13. Overview on Recent Improvement for Industrially Applicable PERL-Type Si Solar Cell Processing
14. 3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly.
15. Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal.
16. Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials.
17. Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside.
18. High and Hyper NA Immersion Lithography using Advanced Patterning Film APF TM.
19. On the scalability of source/drain current enhancement in thin film sSOI.
20. Ge deep sub-micron pFETs with etched TaN metal gate on a high-k dielectric, fabricated in a 200mm silicon prototyping line.
21. Electrical Characterisation of Silicon-Rich-Oxide Based Memory Cells Using Pulsed Current-Voltage Techniques.
22. Silicon-rich-oxides as an alternative charge-trapping medium in Fowler-Nordheim and hot carrier type non-volatile-memory cells.
23. Quasi-Non Volatile Flatband-Voltage Shift in Metal-Oxide-Semiconductor Capacitors with Silicon-Rich-Oxide Dielectric.
24. Properties of porous HSQ-based films capped by plasma enhanced chemical vapor deposition dielectric layers.
25. Bulk FinFET fabrication with new approaches for oxide topography control using dry removal techniques.
26. Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM).
27. Self Aligned CuGeN Process for 32/22nm Nodes and Beyond.
28. On the origin of photo-induced and thermally induced irreversible bleaching of amorphous Ge-Se films.
29. Performance Improvement of Tall Triple Gate Devices With Strained SiN Layers.
30. Highly efficient grating coupler between optical fiber and silicon photonic circuit.
31. Integration feasibility of porous SiLK* semiconductor dielectric.
32. A review of the specific role of oxygen in irreversible photo- and thermally induced changes of the optical properties of thin film amorphous chalcogenides
33. Review of flash design rules for closed-die forgings
34. Optical gap and Urbach edge slope in a-Se
35. Holographic investigations of photoinduced changes in PECVD GeSe thin films
36. Structural and optical properties of amorphous selenium prepared by plasma-enhanced CVD
37. Optical properties of amorphous Se films prepared by PECVD
38. Plasma-enhanced chemical vapour deposition of amorphous GexSe1−x films
39. Dynamic Behavior of Healing Bones.
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