Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials.

Details

Language :

English

ISBNs :

9781479969944

Database :

Complementary Index

Journal :

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

Publication Type :

Conference

Accession number :

102519990

Full Text :

https://doi.org/10.1109/EPTC.2014.7028355