Back to Search
Start Over
Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM).
- Source :
- Interconnect Technology Conference (IITC), 2010 International; 2010, p1-3, 3p
- Publication Year :
- 2010
Details
- Language :
- English
- ISBNs :
- 9781424476763
- Database :
- Complementary Index
- Journal :
- Interconnect Technology Conference (IITC), 2010 International
- Publication Type :
- Conference
- Accession number :
- 81622813
- Full Text :
- https://doi.org/10.1109/IITC.2010.5510743