3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly.

Details

Language :

English

ISBNs :

9784904090138

Database :

Complementary Index

Journal :

2015 International Conference on Electronic Packaging & iMAPS All Asia Conference (ICEP-IAAC)

Publication Type :

Conference

Accession number :

103099051

Full Text :

https://doi.org/10.1109/ICEP-IAAC.2015.7111000