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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications.
- Source :
- ECS Journal of Solid State Science & Technology; 2020, Vol. 9 Issue 12, p184-190, 7p
- Publication Year :
- 2020
Details
- Language :
- English
- ISSN :
- 21628769
- Volume :
- 9
- Issue :
- 12
- Database :
- Complementary Index
- Journal :
- ECS Journal of Solid State Science & Technology
- Publication Type :
- Academic Journal
- Accession number :
- 150598571
- Full Text :
- https://doi.org/10.1149/2162-8777/abd260