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Purpose: The purpose of this research is to efficiently separate incident terahertz (THz) waves into distinct transmission and reflection channels by minimizing the absorption ratio. So, the optical systems operating within the THz frequency range can developed. To achieve a multi-band response, four different periodic arrays of graphene patterns are used. These arrays are strategically stacked on both sides of three SU-8 photoresists, serving as dielectric materials. Consequently, each layer exhibits a unique influence on the device's response, and by applying four external bias voltages, the behavior of the device can be precisely controlled and adjusted. Design/methodology/approach: A novel optoelectronic device operating in the THz frequency range is introduced, using periodic arrays of graphene patterns and SU-8 photoresist dielectrics. The design of this device is based on meta-surface principles, using both the equivalent circuit model (ECM) and transmission line concept. The output of the device is a THz coupler implemented by analyzing the reflection and transmission channels. The structure is characterized using the ECM and validated through comprehensive full-wave simulations. By representing the electromagnetic phenomenon with passive circuit elements, enabling the calculation of absorption, reflection and transmission through the application of the theory of maximum power transfer. Findings: Based on simulation results and theoretical analysis, the proposed device exhibits sensitivity to gate biasing, enabling efficient reflection and transmission of THz waves. The device achieves reflection and transmission peaks exceeding across the five distinct THz bands 90%, and its behavior can be tuned by external gate biasing. Moreover, the device's sensitivity to variations in geometrical parameters and chemical potentials demonstrates its reliable performance. With its outstanding performance, this high-performance meta-surface emerges as an ideal candidate for fundamental building blocks in larger optical systems, including sensors and detectors, operating within the THz frequency band. Originality/value: The proposed device covers a significant portion of the THz gap through the provision of five adjustable peaks for reflection and transmission channels. Additionally, the ECM and impedance matching concept offers a simplified and time-efficient approach to designing the meta-surface. Leveraging this approach, the proposed device is effectively represented using passive circuit elements such as inductors, capacitors and resistors, while its performance is validated through the utilization of the finite element method (FEM) as a full-wave simulation tool. This combination of circuit modeling and FEM simulation contributes to the robustness and accuracy of the device's performance evaluation. [ABSTRACT FROM AUTHOR]

Changxin Memory Technologies Inc. has been issued a patent for a method of fabricating a semiconductor structure. The method allows for the miniaturization of patterns on semiconductor structures in different regions, while not miniaturizing patterns in other regions. The patent describes a specific process involving the formation of patterns, mask layers, and the removal of certain layers to achieve the desired structure. The inventors provide various embodiments and claims for the method. This patent may be of interest to researchers and professionals in the fields of business, electronics, and semiconductors. [Extracted from the article]

A study conducted at National Chung Hsing University in Taichung, Taiwan, has developed a new surface-enhanced Raman scattering (SERS) substrate for sensitive biosensing. The substrate consists of silver nanoparticles deposited on a silver thin film-coated photoresist microcone array. The researchers optimized the substrate's hotspot enhancement effect by adjusting the concentration of trisodium citrate. The SERS substrate was able to detect the indicating peaks of Rhodamine 6G (R6G) at a low concentration of 10(-12) M and establish a standard detection curve for HbA1c detection. The research concluded that the established standard detection curve was reproducible. [Extracted from the article]

A recent study conducted by the National Center for Scientific Research (CNRS) in Lyon, France, explores the potential of additive manufacturing in revolutionizing industry. The researchers developed a solvent-free hybrid organic-inorganic photoresist that can be used for high-resolution and grayscale 3D microprinting. By utilizing both one- and two-photon absorption, the photoresist can produce large area and high-resolution 3D structures, making it a promising tool for personalized health care, microfluidics, microoptics, and catalysis. The research was supported by TotalEnergies and has been peer-reviewed. [Extracted from the article]

A patent application has been submitted by inventors from 10X Genomics Inc. for a method of generating high-definition molecular arrays using photoresist. The method involves irradiating a substrate with masked spot regions and an unmasked boundary region, blocking or ablating oligonucleotide molecules in the boundary region, irradiating the substrate to render certain spot regions available for oligonucleotide attachment, and attaching oligonucleotides to provide extended molecules in the spot regions. The patent application provides detailed information on the method and its various embodiments. This information may be useful for researchers in the biotechnology industry and related fields who are interested in generating molecular arrays for analyzing gene expression patterns. [Extracted from the article]

Researchers at the Indian Institute of Technology have developed a new method for microfabrication using an epoxy-based polymer called SU-8. They created thin, single-layered, freestanding porous membranes that are hydrophilized for efficient bioseparation. These membranes are strong, safe, sterilizable, reusable, and suitable for plasma separation and postfermentation broth enrichment. The research was supported by the Department of Science And Technology and the Ministry of Electronics And Information Technology in India. [Extracted from the article]

A patent application has been submitted by researchers from Neuralink Corp. for a method of fabricating a cantilever section in a structure. The method involves providing a structure with a substrate, a compliant layer, and an optional sacrificial layer, cutting part-way through the substrate, undercutting into the substrate or releasing the sacrificial layer, and breaking the substrate along the partial cut to create a cantilever section. The structure can be made from materials such as silicon, polyimide, parylene C, SU-8 photoresist, or benzocyclobutene (BCB). The method can be used to create devices like neural electrodes that can be implanted into mammals. [Extracted from the article]

Technical advances are a necessity for any industry, and to that end, companies invest considerable resources in R&D. This monthly section will list the abstracts of recently approved U.S. patents. Most are direct to wire and cable while a few may be more indirect/downstream. [ABSTRACT FROM AUTHOR]

Keywords for this news article include: Nanjing, People's Republic of China, Asia, Aerospace Medicine, Aerospace Research, Chemicals, Chemistry, Electrochemicals, Health and Medicine, Nanjing Tech University. Nanjing, People's Republic of China, Asia, Aerospace Medicine, Aerospace Research, Chemicals, Chemistry, Electrochemicals, Health and Medicine Keywords: Nanjing; People's Republic of China; Asia; Aerospace Medicine; Aerospace Research; Chemicals; Chemistry; Electrochemicals; Health and Medicine EN Nanjing People's Republic of China Asia Aerospace Medicine Aerospace Research Chemicals Chemistry Electrochemicals Health and Medicine 2136 2136 1 07/24/23 20230728 NES 230728 2023 JUL 28 (NewsRx) -- By a News Reporter-Staff News Editor at Health & Medicine Week -- Fresh data on Aerospace Research - Aerospace Medicine are presented in a new report. [Extracted from the article]

The resolution of optical lithography and the spacing of atom lithography are limited by about half of the wavelength due to the Rayleigh limit. Here we propose a coherent atom lithography experiment which can print nanometer structures. In this proposal, we show that subwavelength spatial distribution of the atoms in the excited state can be achieved by inducing spatially modulated Rabi oscillations in two-level atoms. We use the internal energy of the atoms to excite the photoresist and it can then print the subwavelength structure into the photoresist. For the peak Rabi frequency of about 2 GHz and the recoil limited collimation, we show that sub-10-nm spacing in both one- and two-dimensional space is possible. [ABSTRACT FROM AUTHOR]

The article chronicles the development of chemically amplified photoresists in the late 20th century. In the 1970s, photolithographic procedures used light from the near-ultraviolet and mid-ultraviolet ranges at 365 and 313 nanometers, respectively. During this period, IBM produced its own photolithography equipment based on polyphthalaldehyde polymer chain, and later on the mixture of poly(p-t-butyloxycarbonyloxystyrene) and onium-salt photoacid generator.

Features a program started by Silicon Valley Group Inc. which identified the challenges and risks associated with the development of 157-nm lithography and aimed to establish partnerships with industry experts to find suitable solutions. Information on photoresist and resist processing; Details on pellicle development; Importance of controlling purging and contamination; Categories of molecular contamination.

Presents information on flip-chip integrated circuit packaging. Mounting of high input/output count devices; Common methods of depositing solder bumps; Role of photoresist in electroplating and evaporating processes; Impact of developments in lithography on steppers.

Describes the lithographic tools that may be used to pattern photoresists. Reason for using extreme ultra violet; Details on the illumination system; Range of optical materials and coatings.

Presents a procedure in making single- and double-sided prototype circuit boards using the photoresist method. Sources for the artwork of the board layout; Materials needed.

The article reports on export restrictions by Japan of several chemicals used in the electronics industries. It mentions the restrictions on fluorinated polyimide, hydrogen fluoride, and photoresist, the impact on South Korean industries, and efforts of South Korea to work around the restrictions.

The article reports on align-and-shine photolithography technique, for fabricating cantilevers and other types of fiber-end micro-optical, mechanical sensors, developed by researchers at the Vrije Universiteit, Amsterdam, the Netherlands. In the technique, as reported, a photomask on the end of a UV-transmitting multimode optical fiber is aligned and brought into contact with the photoresist-coated end of the target fiber thus allowing the photomask pattern to be transferred to the photoresist.

Focuses on the importance of lithography simulation in designing semiconductors. Software for lithography; Modifications of the photoresist; Simulation flow of a lithography process.

Focuses on a new method of making microchips. Coating silicon wafers with several ultrathin films, including a light-sensitive layer known as a photoresist; Transformation of a certain polymer from an insulator to a conductor; Information that Bruce M. Novak, a University of California at Berkeley chemist, is trying to develop a better photoresist.

E. I. DU PONT de Nemours & Co. has introduced a new photopolyrner resist, Piston CM206 primary imaging dry film. The product is designed for the photochemical machining industry, the [...]

The article offers brief information on the DF-2005 Dry-Film Negative Photo Resist from Engineered Material Systems Inc.

The market for positive photoresist materials is expected to reach $450 million in 1995 in worldwide sales. Photoresist materials consist of a resin and a photoactive compound. Negative photoresist materials are based on azide photochemical and positive photoresist materials consist of a diazonaphtoquinone sensitizer. Growth is expected in positive photoresist materials, with a 10% growth rate projected for 1996. Positive photoresist materials are utilized in microelectronics.

The article focuses on Grant Willson, researcher in the field of resists. Grant Willson taught chemistry at the University of California at San Diego in the late 1970s. He developed resists for 313-nanometer-wavelength exposure tools and another resist for the thin-film heads used in IBM hard-disk drives. He developed chemically amplified resist technology with researcher Hiroshi Ito and others. This technology forms the basis of the resists used today. Willson continues to innovate at the University of Texas in Austin. He also co-founded Molecular Imprints Inc. with his colleague S.V. Sreenivasen, a mechanical engineering professor.

Reports on the development of high-quality conical lenses (axicons) of SU-8 photoresist on glass using electron-beam lithography by researchers at Nanyang Technological University in Singapore and Shenzhen University in China. Use of the Bessel beam to trap and levitate a silica sphere; Other approaches to optical trapping and levitation; Applications of micro-axicons to lab-on-a-chip technologies.

The article reports that in order to bridge the gap between design and manufacturing, Germany-based Sigma-C GmbH has begun marketing its established Solid lithography simulation technology to designers. The company has decided to introduce a new product, Solid+, which acts as a virtual exposure tool to simulate microlithography and identify potential problem areas during the design process. Solid+ can specify among other things, whether patterns can be accurately produced by photoresist at smaller process nodes.

A little high-tech plumbing and colored water may change how engineers make miniaturized fluid-carrying structures. A team at the University of Washington in Seattle has added a new twist to the light-blocking patterns, or photomasks, used like stencils in microchip manufacturing. They've invented photomasks containing tiny, transparent pipes into which the engineers have injected dyes that dim the ultraviolet (UV) radiation passing through. Where less UV light penetrates the photomask, there's less breakdown of the photosensitive coatings, called photoresists, that cover chips during processing. The coating left behind forms a structure of varying heights that can serve as a mold. Bioengineer Albert Folch says that these new masks, which are themselves microfluidic devices, could be used to create improved miniature fluid networks. Folch, Chihchen Chen, and Danny Hirdes describe their microfabrication method in 'Proceedings of the National Academy of Sciences.' By adding this new technique to a growing toolkit, "we could now make almost any microscale structure as fast as you can [design] the mask on the computer," says David Beebe of the University of Wisconsin-Madison.

The article reports that negative photoresists supplier Engineered Materials Systems Inc. will exhibit its products during the 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition. The event will be hold at the Sofitel San Francisco bay Hotel, Redwood City, California from December 15-17, 2015.

The article previews the DF-3000 Series Negative Film Photoresists for MEMS (microelectromechanical systems) applications, from Engineered Materials Systems (EMS) Inc., to be exhibited at the Electronic Components and Technology Conference in 2015.

Motorola subsidiary Freescale Semiconductor and Arch Microelectronic Materials have been collaborating on deep ultraviolet bilayer photoresists for multilayer use in Freescale's CMOS technology, according to Reuters. Scientists from both companies […]

Tokyo Electron Ltd. (TEL) has begun accepting orders for the CLEAN TRACK ACT M photomask resist coater/developer targeted for 6025 substrate processing at the 90-65nm nodes. Three modules are incorporated […]

Mallinckrodt Baker Inc. has introduced an expanded photoresist-stripper recovery program to collect and reformulate recovered components into new strippers. The program is intended to reduce fab costs and address the […]

The article offers brief information on the DF-4017 Dry Film Negative Photoresist used for producing hydrophobic system in micro-electromechanical systems (MEMS) from Engineered Material Systems Inc.

The article previews the DF-3020 Dry Film Negative Photoresist from Engineered Material Systems Inc.

The article discusses the release of the NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS) from Engineered Material Systems Inc.

The article offers information on other uses of optical lithography. It relates that the stimulated emission depletion (STED), a work by Stefan Hell at the Max Planck Institute for Biophysical Chemistry in Göttingen, Germany, has inspired the development of other approaches of optical litography. These approaches include photolithography by Rajesh Menon and colleagues, photoresists, and two-laser lithography by John Fourkas and colleagues.

The article reports on the acquisition of Gracel Display by Rohm and Haas Company in Philadelphia, Pennsylvania. The author stated that the $40 million transaction gives Rohm and Haas controlling interest in Gracel and Rohm and Haas's growing display technologies business. He added that as part of the company's Display Chemicals group, it manufactures thin-film-transistor photoresists and related materials.

The article reports on the use of convention photoresist-patterning techniques and semiconductor-etching technology by scientists at Ibsen Photonics for fabricating low-cost, high-quality transmissive diffraction gratings in fused silica. A holographic stepper was used to fabricate a grating pattern in photoresist. The fused-silica diffraction gratings are particularly suited to laser-pulse-compression applications.

The article reports that in an effort to help photomask makers deal with high volume of data in integrated circuit design, EDA software development services vendor SoftJin Technologies will soon introduce a software product called Mebeszip to compress mask data files in Mebes format by a factor of five to 15, reducing file sizes and associated data transfer times.

The article reports that a spiral phase plate (SPP) introduces a phase shift of a magnitude that usually depends linearly on the angle and not at all on the radius, with a phase discontinuity at its zero degree to 360 degree position. An SPP produces phase dislocations in a normal laser beam passing through it. Photoresist spun on glass is exposed via eleotron-beam lithography, soft-baked, and developed. The mode-conversion efficiency of the SPPs was measured to be from 80% to 87%, producing beams annularly uniform to 10%.

This article reports that two research groups in Holland have joined worldwide efforts to apply atomic lithography to nanoscale integration of semiconductors. Researchers using this method tackle the usual process in reverse: Instead of forcing light through a physical mask, they focus a physical beam of atoms with a mask made from standing waves of light. Eindhoven University of Technology professor Ton van Leeuwen and professor Theo Rasing at Radboud University Nijmegen, report similar results. The groups hope that their choice of iron will allow them to use a combination of magnetic materials to produce novel ferroelectric and spintronic effects in future versions.

Reports that scientists at the Data Storage Institute have written lines as mall as 20 nanometer in width using near-field scanning optical microscope. Nonlinear effects in the resist produced by the light source; Fabrication of semiconductor chips via photolithography; Low laser power effects.

Presents news briefs concerning the U.S. electronics industry as of August 5, 2002. Supercomputer collaboration between Lawrence Livermore National Laboratory and the U.S. Department of Energy's National Energy Research Supercomputer Center; National Institute of Standards and Technology's study of photoresists in a joint project with IBM Corp. and the University of Texas at Austin.

Reports on the emergence of photoresist technology for semiconductor production. Argon fluoride photoresist developed by Hyundai Electronics; Partnership of semiconductor companies and material suppliers in Japan; Competition in developing advanced photolithography techniques.

Reports on the development of matrix resins for single-layer 193-nanometer photoresists by chemists at Lucent Technologies that offer adequate photosensitivity and adhesion while remaining robust under etch conditions. Synthesis by standard radical polymerization techniques; Advantages over conventional matrix resins.

Features the photoresists developed by International Business Machines Corp. in San Jose, California. Applications of the device in making microfine-featured integrated-circuit chips; Sensitivity of the photoresists to shorter wavelengths of light; Etching functions of the photoresists.