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Steppers take on flip-chip IC packaging.
- Source :
-
Laser Focus World . Nov99, Vol. 35 Issue 11, pS11. 4p. 1 Color Photograph, 1 Black and White Photograph, 1 Diagram, 1 Graph. - Publication Year :
- 1999
-
Abstract
- Presents information on flip-chip integrated circuit packaging. Mounting of high input/output count devices; Common methods of depositing solder bumps; Role of photoresist in electroplating and evaporating processes; Impact of developments in lithography on steppers.
- Subjects :
- *INTEGRATED circuits
*SOLDER & soldering
*PHOTORESISTS
*LITHOGRAPHY
*PACKAGING
Subjects
Details
- Language :
- English
- ISSN :
- 10438092
- Volume :
- 35
- Issue :
- 11
- Database :
- Academic Search Index
- Journal :
- Laser Focus World
- Publication Type :
- Periodical
- Accession number :
- 2477454