308 results on '"Kolawa, E."'
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2. Reaction of aluminum-on-titanium bilayer with GaN: Influence of the Al:Ti atomic ratio
3. Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition
4. Reactively sputtered Ru-Si-O films
5. Full Field Measurements of Curvature using Coherent Gradient Sensing: Application to Thin Film Characterization
6. Physical properties
7. Diffusion barriers for Al and Cu metallizations on Si
8. High Performance Processors for Space Environments: A Subproject of the NASA Exploration Missions Systems Directorate 'Radiation Hardened Electronics for Space Environments' Technology Development Program
9. Amorphous (Mo, Ta, or W)-Si-N diffusion barriers for Al metallizations
10. Reaction of Ta thin film with single crystalline (001) beta-SiC
11. Ohmic contacts to n-GaAs with a Pt/Ge/Au contacting layer and a Ta-Si-N barrier: electrical and metallurgical characteristics
12. Stability of rhenium thin films on single crystal (001) beta-SiC
13. Results of NASA's workshop on extreme technologies for space exploration
14. Saturation current model for the N-channel Gsup4-FET
15. Electronic packaging for extreme environments
16. A Library of Rad Hard Mixed-Voltage/Mixed-Signal Building Blocks for Integration of Avionics Systems for Deep Space
17. Effect of Si in reactively sputtered Ti-Si-N films on structure and diffusion barrier performance
18. Electrodeposition of High Permeability Magnetic Films
19. Miniaturized Radioisotope Solid State Power Sources
20. Miniaturized Radioisotope Solid State Power Sources
21. Development of Thick-Film Thermoelectric Microcoolers Using Electrochemical Deposition
22. Thick-Film Thermoelectric Microdevices
23. Die Attachment for -120***Supo***C to +20***Supo***C Thermal Cycling of Microelectronics for Future Mars Rovers - an Overview
24. Die Attachment for -120(sup o)C to +20(sup o)C Thermal Cycling of Microelectronics for Future Mars Rovers - an Overview
25. Avionics Systems On A Chip for Space Exploration
26. Avionics Systems On A Chip for Space Exploration
27. Development of Thick-Film Themoelectric Microcoolers Using Electrochemical Deposition
28. Monolithic Microprocessor and RF Transceiver for Low-Power Mobile Applications
29. Monolithic Microprocessor and RF Transceiver for Low-Power Mobile Applications
30. Thermoelectric Microcoolers for Thermal Management Applications
31. Probabilistic Fatigue Life Analysis of High Density Electronics Packaging
32. Degradation mechanisms in SOI n-channel LDMOSFETs
33. Transmission Lines for High Frequency and High Density Packaging
34. Transmission Lines for High Frequency and High Density Packaging
35. A High Frequency Electronic Packaging Technology
36. High Frequency Electronic Packaging Technology
37. The Properties of CrN/Au and Cr/CrN/Au Multilayers
38. Novel Techniques for Millimeter Wave Packages
39. Novel Techniques for Millimeter Wave Packages
40. The Influence of Impurities on the Properties of the Cr/Au and Cr/CrN/Au Structures
41. Sputtered Ta-Si-N diffusion barriers in Cu metallizations for Si
42. Reaction of Ta thin film with single crystalline (001) β-SiC.
43. Stability of rhenium thin films on single crystal (001) β-SiC.
44. Tantalum-based diffusion barriers in Si/Cu VLSI metallizations.
45. Thermal oxidation of reactively sputtered amorphous W80N20 films.
46. Thermal oxidation of amorphous ternary Ta36Si14N50 thin films.
47. Copper Metallization Layers on Bismuth-Telluride Substrates: Effectiveness of Cr, Pt, and Ta40Si14 N46 Thin Films as Diffusion Barriers
48. Properties of reactively sputtered Mo1−x O x films
49. Microstructure of reactively sputtered oxide diffusion barriers
50. Exploiting SOICMOS for the extreme environments of future space missions
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