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High Frequency Electronic Packaging Technology
- Publication Year :
- 1994
- Publisher :
- United States: NASA Center for Aerospace Information (CASI), 1994.
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Abstract
- Commercial and government communication, radar, and information systems face the challenge of cost and mass reduction via the application of advanced packaging technology. A majority of both government and industry support has been focused on low frequency digital electronics.
- Subjects :
- Electronics And Electrical Engineering
Subjects
Details
- Language :
- English
- Database :
- NASA Technical Reports
- Publication Type :
- Report
- Accession number :
- edsnas.20060037875
- Document Type :
- Report