8 results on '"Gravey, V."'
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2. Barrier and seed repair performance of thin RuTa films for Cu interconnects
3. Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications.
4. Bulk FinFET fabrication with new approaches for oxide topography control using dry removal techniques.
5. Thermal stability of copper Through-Silicon Via barriers during IC processing.
6. Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM).
7. CMP process optimization for improved compatibility with advanced metal liners.
8. Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations.
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