Thermal stability of copper Through-Silicon Via barriers during IC processing.

Authors :: Civale, Y.
Croes, K.
Miyamori, Y.
Thangaraju, S.
Redolfi, A.
Van Ammel, A.
Velenis, D.
Cherman, V.
Hendrickx, P.
Van der Plas, G.
Cockburn, A.
Gravey, V.
Kumar, N.
Zhitao Cao
Tezcan, D.S.
Soussan, P.
Travaly, Y.
Tokei, Z.
Beyne, E.
Swinnen, B.
Source :: Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International; 2011, p1-3, 3p
Publication Year :: 2011

Language :: English
ISBNs :: 9781457705038
Database :: Complementary Index
Journal :: Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Publication Type :: Conference
Accession number :: 80323965
Full Text :: https://doi.org/10.1109/IITC.2011.5940352