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CMP process optimization for improved compatibility with advanced metal liners.

Authors :
Heylen, N.
Li Yunlong
Kellens, K.
Carbonell, L.
Volders, H.
Santoro, G.
Gravey, V.
Cockburn, A.
Yuchun Wang
Shah, K.
Leunissen, L.
Beyer, G.P.
Tokei, Z.
Source :
Interconnect Technology Conference (IITC), 2010 International; 2010, p1-3, 3p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424476763
Database :
Complementary Index
Journal :
Interconnect Technology Conference (IITC), 2010 International
Publication Type :
Conference
Accession number :
81622785
Full Text :
https://doi.org/10.1109/IITC.2010.5510692
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