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Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations.

Authors :
Carbonell, L.
Volders, H.
Heylen, N.
Kellens, K.
Caluwaerts, R.
Devriendt, K.
Sanchez, E.A.
Wouters, J.
Gravey, V.
Shah, K.
Luo, Q.
Sundarrajan, A.
Jiang Lu
Aubuchon, J.
Ma, P.
Narasimhan, M.
Cockburn, A.
Tokei, Z.
Beyer, G.P.
Source :
2009 IEEE International Interconnect Technology Conference; 2009, p200-202, 3p
Publication Year :
2009

Details

Language :
English
ISBNs :
9781424444922
Database :
Complementary Index
Journal :
2009 IEEE International Interconnect Technology Conference
Publication Type :
Conference
Accession number :
81079971
Full Text :
https://doi.org/10.1109/IITC.2009.5090387
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