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Reports on the collaboration between Advanced Micro Devices Inc., Infineon and United Microelectronics Corp. to develop a common 65 and 45nanometer manufacturing platform. Benefits of the collaboration to the companies; Goal of the development of the manufacturing platforms; State of the electronics industry in the U.S.

Reports on the joint development partnership between LSI Logic Corp. and ACM Research Inc. following the purchase of LSI to the stress free polishing (SFP) tool of ACM in December 2001. Plan of LSI for the SFP tool; Implication of the deal to ACM; Claim of ACM on its SFP tool.

Reports on the partnership between Mindspeed Technologies and Sagantec to develop a template-driven layout methodology for re-using analog semiconductor intellectual property (IP). Expected benefits of the methodology; Challenges in analog design; Approach in analog IP migration.

Reports that Chartered Semiconductor Manufacturing Ltd. of Singapore is helping customers and development partners migrate their devices to smaller geometries. Expected wafer capacity of the company in 2001; Approach taken by the company in branding its foundry services; Manufacturing partners of the company; Budget projection for research and development in 2001.

Focuses on the partnership between Synopsys Inc. and Agilent Technologies Inc. aimed at establishing standards for automated test equipment and electronic design automation companies. Factors that affect integrated device manufacturers; Plans of the two companies for their partnership; Significance of the partnership to the semiconductory industry.

Presents news briefs on semiconductor-related issues as of September 2000. Details on the partnership of Aldec Inc. with Synopsys Inc.; Order received by CPU Tech from the United States Navy.

Presents updates that are related to the distribution of semiconductor equipment as of July 24, 2000. Recognition given by Intel Corp. to Wyle Electronics; Solution provider of EConnections Inc.; Partnership between Newport Components Inc. and Mouser Electronics Inc.

Focuses on the decision of Synopsys Inc. to formalized its system design partnership with STMicroelectronics. Details on the OpenSystems initiative launched by Synopsys; Focus of the partnership.

Presents news briefs on the computer software industry in March 1999. Partnership between Altera Corp. and Synopsys Inc.; Acquisition of Smartech Oy by Synopsys; Upgrade of SPECCTRA printed circuit board (PCB) design software from Cadence Design.

Highlights the minority investments and joint ventures as a source of capital for electronics firms. Background on the exponential growth of corporate partnering; Current trends; Steps to attracting investments for corporate partners; Simplicity as key to a successful joint venture.

Reports about agreement between Chips Technology and Advanced Micro Devices (AMD). Purpose of agreement; Separate agreement with NEC technology; Terms of AMD agreement; Comments of personnel from both companies on the agreement; Application and design of tools provided by Chips.

The article reports that Mentor Graphics Corp. and European semiconductor leader STMicroelectronics NV announced a joint-development project named DeCADE, which will build digital and analog SoC design solutions. DeCADE will provide design tools for core complementary metal oxide semiconductors (CMOS) technologies and for value-added and application-specific derivative technologies which are developed from the core CMOS process.

The article reports on the agreement to litigation settlement and design partnership between Samsung Electronics Co. Ltd. and Rambus Inc. It states that Samsung will pay a total of 900 million U.S. dollars which includes an investment, an initial payment and a quarterly payment as part of the deal. Furthermore, the companies have signed a memorandum of understanding about a new generation of memory technologies and will focus on graphics and mobile memory.

The article reports on the joint venture between Boise, Idaho-based semiconductor company Micron Technology Inc. and Sydney, New South Wales-based integrated energy company Origin Energy Ltd. According Mark Duncan, Micron president and chief operating officer (COO), the combination of Micron's semiconductor manufacturing expertise and Origin's solar experience could result into a strong partnership. It notes that the combined company will focus on the development of photovoltaic technology.

The article focuses on the announcement of a long-term partnership between Nokia Corp. and ST-Ericsson, in the area of TD-SCDMA technology that will see Nokia use ST-Ericsson as a key chipset supplier for its Symbian-based TD-SCDMA devices. Heikki Koivu, vice-president of TD-SCDMA at Nokia, said in a statement that TD-SCDMA is a core part of their strategy to deliver the best mobile user experience to Chinese people.

The article reports that Belgium-based IMEC and leading foundry TSMC have extended their relationship to forge. They are calling this deal an Innovation Incubation Alliance, focused on moving emerging more-than-Moore technology options from design to manufacturing to product stages. The core concept of the alliance is that by combining IMEC's R&D and prototyping processes with TSMC's knowledge of high-volume manufacturing, they can shift more smoothly to trial, validation, and end product.

The article reports that Taiwan Semiconductor Manufacturing Co. Ltd. will collaborate with nanoelectronics research center IMEC in Leuven, Belgium. According to an agreement, TSMC will extend its collaboration with IMEC as a core partner. IMEC's core partner program focuses on collaborative research for 22 nm and beyond IC process technologies.

The article informs that Tokyo Ohka Kogyo Co. Ltd. (TOK) has joined Sematech Inc.'s team of researchers from Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering to demonstrate Extreme Ultraviolet (EUV) materials and develop resists for 22-nm patterning technologies. At the RMDC, TOK can use Sematech's two-micro-exposure tools to participate in cooperative research with other member companies.

The article reports on the server memory partnership between Virident Systems Inc. and Numonyx BV. Under the letter of intent signed by both parties, it notes that Virident will utilize the Numonyx flash and phase-change memories (PCM) in its future servers. It notes that the servers of Virident using Numonyx memory products will be available in the second half of 2009. Virident president Raj Parekh notes that the partnership will help them develop efficient cloud applications and servers.

The article presents information on newly entered partnership between CEA/Leti and International Business Machines Corp. (IBM). The agreement has enabled, Grenoble, France-based CEA/Leti to become a research associate of IBM and IBM's semiconductor Joint Development Alliance ecosystem centered in Albany, New York.

The article reports that Nvidia Corp. has formally announced a method for connecting to start-up GPU companies through its just launched GPU Ventures Program. The size of investments made through this program is expected to range from $500,000 to $5 million, and partnerships are expected to span joint marketing, development, and product distribution. Nvidia has also launched a GPU Venture Zone web site for showcasing its partners GPU innovations.

The article presents information on an agreement between Intel Corp. and TSMC Corp. According to the agreement, Intel will port its Atom processor central processing unit (CPU) cores to the TSMC technology platform, including processes, Internet protocol (IP), libraries, and design flows. Intel believes that with the TSMC collaboration it will be able to expand its Atom SoCs availability to a wider range of applications.

The article offers information on the professional career of Jack Gifford, founder of Maxim Integrated Products Inc. in the U.S. He attended University of California in Los Angeles (UCLA) on a baseball scholarship and worked at Fairchild Corp. He partners with his former Fairchild colleague Jerry Sanders to establish AMD where he served as chief finance officer. Gifford founded Maxim and acted as the company's chief executive officer (CEO) until his retirement in 2007.

The article reports on the agreement between Intel Corp. and Hitachi Global Storage Technologies to develop and provide solid-state drivers (SSDs) for workstations, servers and storage arrays in the U.S. According to the companies, the products will be compatible with the traditional rotating-media drives manipulating applications that require demand high reliability and, interoperability (I/O) performance, and power consumption reduction. The first product is expected to be released by 2010.

The article reports that the company NXP Semiconductors has formed a partnership with Phonak Inc. to develop a single chip, ultra-low power radio for use in hearing systems. Medical electronics is stated to be one of the fastest growing areas of semiconductor development. The power radio is currently being integrated into Phonak's portfolio of hearing systems and wireless accessories. NXP's chief technology officer, Rene Penning de Vries said that they value customer engagement.

The article reports on the partnership between IBM Research and five universities in the U.S. The partnership aims to create low-power-consumption and compact-sized computing systems that simulate and emulate the brain's abilities for sensation, perception, action, interaction, and cognition. Josephine Cheng, vice president of IBM's Almaden Research Center, believes that the partnership will help shape the future of computing in a significant way.

The article reports on the partnership between Applied Materials Inc. and the Flexible Display Center (FDC) of the Arizona State University. The partnership aims to advance the development and commercialization of full-color flexible electronic display technologies. Applied is also expecting the agreement to achieve digital display breakthroughs.

The aritcle reports on the collaboration entered by Freescale Semiconductor Inc. and Samsung Electronics Co. Ltd. to address the market for light-emitting diodes(LEDs). Arman Naghavi, VP and general manager of Freescale's analog, mixed-signal, and power division, says that their team up with Samsung on LED backlighting will help promote innovation and growth in the LCD market. Moreover, the firm estimated LED backlights with local dimming can help lower power consumption by up to 60%.

The article reports on the initiative of UMC Corp. to manufacture fully functional 28-nanometer (nm) Static random access memory (SRAM) chips based on its low-leakage process technology. It mentions that UMC's revelation follows on plans from Integrated Business Machines Corp. (IBM) and its Common Platform Alliance partners Chartered and Samsung. UMC claimed that its 28-nm process provides almost twice the density of its 40-nm technology which is produced at its 300-nm fabrications.

The article reports on the move of SanDisk Corp. to enter into plans to sell the 30% manufacturing capacity of Toshiba Corp. joint ventures, Flash Partners and Flash Alliances. According to the agreement, SanDisk and Toshiba will continue to be equal partners for the joint ventures' remaining 70% capacity of the fabrication (Fab) facility , specifically Fab 3 and Fab 4 at Toshiba's Yokkaichi Operations in Japan.

The article reports on the partnership agreement between TSMC Corp. and Virage Logic Corp. to develop physical intellectual property (IP) such as embedded memories and logic libraries. The companies believe that the partnership will allow each company to quickly meet customer's shifting and stringent application-specific requirements. According to Brani Buric, vice president of marketing at Virage, TSMC and Virage Logic responds to the global semiconductor industry's need to have optimized IP.

The article reports on the partnership agreement between Global Semiconductor Alliance (GSA) and China Semiconductor Industry Association (CSIA) in the semiconductor industry. A memorandum of understanding (MOU) has been signed by the two groups committing them for an ongoing support of one another's initiatives and activities in a variety of areas. The MOU aims to strengthen the mutual interests between GSA and CSIA, directing to support the semiconductor industry.

The article reports on the decision of NEC Electronics Inc. to join in the 32-nm development alliance of International Business Machines Corp. (IBM). IBM and NEC have signed a multi-year joint development agreement under which they will develop next-generation semiconductor process technology. Other members of the alliance Chartered Semiconductor Manufacturing Ltd., Freescale Semiconductor Inc. and Samsung Electronics Co. Ltd.

The article reports on the collaboration of Ovonyx Inc. and Synopsys Inc. to develop and enhance the simulation capability of phase change memory (PCM). Ovonyx is confident that its partnership with Synopsys will help in the commercialization efforts of PCM products by chipmakers. The two companies will calibrate Transactions on Computer-Aided Design (TCAD) models in developing PCM products.

The article reports on the collaboration of Interuniversity Microelectronics Centre (IMEC) and Plextronics Inc. to develop a reproducible process for organic solar cells using Plexcore materials and inks. These materials from Plextronics have shown efficiencies as high as 5.9%. As part of the deal, IMEC will investigate Plexcore OS polymer. Director Jef Poortmans says that IMEC expects that the partnership will help accelerate its development of an industrial large-area process.

The article offers information on a collaboration between Woburn, Massachusetts-based carbon nanotube (CNT) semiconductor device developer Nantero Inc. and SVTC Technologies to accelerate the commercialization of carbon nanotube-based electronics products. Nantero is said to be working with semiconductor development foundry SVTC to install a complementary metal-oxide-semiconductor friendly CNT process at SVTC's fabs in San Jose, California, and Austin, Texas.

The article reports on a partnership agreement signed between chip giant Intel Corp. and supercomputer maker Cray Inc. to create high-performance computing (HPC) systems from Cray, based on Intel microprocessors. The collaboration is meant to provide the HPC market segment with access to Intel's microprocessors in advanced supercomputers, which Cray also said will strengthen its adaptive supercomputing vision.

The article reports on the decision of Intel Corp. and LSI Corp. to enter into a multi-generation agreement that covers technical collaboration on Intel's RAID data protection technology. The resulting technology from the companies will allow advanced data protection for business-critical data that resides on Intel servers and workstations.

The article reports on the partnership of Intel Corp. and Microsoft Corp. with academia to create two universal parallel computing research centers which meant to accelerate what they said are developments in mainstream parallel computing for consumers and businesses in desktop and mobile computing. The centers will be established at the University of California, Berkeley and the University of Illinois at Urbana-Champaign. According to the companies, software developed by the centers will be made available to the community for additional development.

The article reports on an extension of work of Elpida Memory Inc. with Taiwan-based United Microelectronics Corp. (UMC) to pursue semiconductor foundry opportunities in Japan and commercial agreement with Waltham, Massachusetts-based Mears Technologies Inc. Under the agreement, Elpida will provide its 300-mm wafer manufacturing capacity while UMC will contribute IP support and logic technologies. According to the article, the alliance extends the joint development program that the two companies announced in October 2007.

The article reports on the acquisition of Chip Estimate Corp. by Cadence Design Systems. Through the deal, Cadence gains Chip Estimate's Web portal, which hosts a collaborative partnership of more than 175 intellectual property (IP) suppliers and foundries featuring more than 6,000 IP components. Chip Estimate products also focus on prediction analysis for die size, power consumption, performance, and cost of chips based on various design architecture, IP and silicon process node options.

The article reports that Synopsys Inc. is partnering with semiconductor embedded memory IP company Novelics to expand its DesignWare IP portfolio. This technology licensing and development partnership covers the addition of SRAM-1T embedded memory IP into Synopsys' DesignWare IP library, which is implemented in bulk logic CMOS technology, requiring no additional manufacturing costs.

The article announces that Taiwan Semiconductor Manufacturing Co. (TSMC) is the new foundry partner of Sun Microsystems Inc. for 45-nanometer (nm) and smaller processors. This move is a result of Texas Instrument's changes to its business strategy over the past several years including the cessation of its 32-nm and smaller digital process development, and the disclosure that it will outsource some of its manufacturing. David Yen of Sun Microsystems said TSMC gives leading process technology coupled with the economics scale of high volume and lower cost.

The article reports on the move of chip giant Intel Corp. to team up with NEC Electronics Corp. and its U.S. subsidiary, NEC Electronics America Inc. on power management ICs (PMICs) optimized for mobile Internet devices (MIDs). Intel aims to combine power management, logic, audio and communications functions in a single chip. NEC said that Intel-based MIDs are meant to bring the best Internet experience in the consumer's pocket and allow them to stay in touch with family, entertain with friends, stay informed and be productive on the go.

The article reports that Microchip Technology Inc., the provider of microcontroller and analog semiconductors, has added Avnet Memec, as a new distribution partner. Ending its relationship with Arrow Electronics, Microchip announced it is expanding its use of the distribution channel through Avnet Electronics Marketing and Future Electronics. With this change today, Microchip continues to build on its technical customer support focus with two global distributors, Avnet and Future, in its lineup, said Microchip's president and CEO Steve Sanghi.

The article reports on the collaboration between researchers from Powerchip Semiconductor Corp. (PSC) and IMEC to develop technologies for the 32 nanometer node memory process generation. PSC researchers will reside at IMEC to accomplish the project. According to PSC Chairman Frank Huang, as photolithography technology approaches 32 nanometer, physical limitations are encountered while development costs are increasing, driving the need for alliances and joint development in the industry.

This article reports on the collaboration of IBM Research with European Union partners on the ACOTES project, which aims to maximize the potential of parallel computing in chips while extending battery life of consumer devices. The project's near-term goal is to get more parts of chips to work in parallel to increase the utilization of contemporary and future parallel chip architectures. According to project leader Harm Munk, a robust methodology for working manually will be developed first.

The article reports on an agreement between AMI Semiconductor (AMIS) and IMEC to develop the future Smart Power integration technologies. Under the deal, AMIS will develop Smart Power processes and devices in IMEC facilities and use IMEC expertise in deep submicron process technology. According to Christine King, chief executive officer (CEO) of AMIS, the deal will allow them to develop next-generation I4T Smart Power technology platform while protecting their different intellectual property.

The article reports on the Internet Protocol television (IPTV) collaboration announced by Microsoft Corp. and Broadcom Corp. at the International Consumer Electronics Show (CES) being held in January 2008 in Las Vegas, Nevada. Under the IPTV collaboration, the companies will work together to develop Microsoft's Mediaroom IPTV client software to operate on next-generation set-top boxes (STBs), based on Broadcom's BCM7405 chip.

The article reports on the partnership formed by Sharp Corp. and Toshiba Corp. to collaborate on the development and production of liquid crystal displays (LCD). Through the agreement, Sharp aims to satisfy about 50% of its total demand for system LSI for TV in fiscal year 2010, while Toshiba targets meeting 40% of its demand for LCD modules in the same year.