25 results on '"Xing, Charles"'
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2. Fab Environment Effect on Crescent Pits Defect in Cu Metallization Process
3. Study on Al-Ge Bonding and Quality Improvement in CMEMS Process
4. Effective Approach for Hillock Defect Reduction in Cu Metallization Process
5. A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13?m CMOS Technology
6. Study on the Ring Type Crater Defect Reduction in Cu CMP Process
7. The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects
8. Investigation of Mechanical Effects on Advanced Copper CMP
9. Novel Approach for W Loss Defect Prevention on WCMP Re-Clean Process
10. Mechanism and Solution of Isb Failure on Deep Trench DRAM
11. Study on Effects of Slurry Key Factors on Advanced Oxide CMP Performance
12. WCVD Seam Hole Improvement to Prevent BEOL Copper Diffusion
13. Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process
14. Fab Environment Effect on Crescent Pits Defect in Cu Metallization Process
15. Effective Approach for Hillock Defect Reduction in Cu Metallization Process
16. Study on Al-Ge Bonding and Quality Improvement in CMEMS Process
17. The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects
18. A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13μm CMOS Technology
19. Study on the Ring Type Crater Defect Reduction in Cu CMP Process
20. Study on Effects of Slurry Key Factors on Advanced Oxide CMP Performance
21. Investigation of Mechanical Effects on Advanced Copper CMP
22. Novel Approach for W Loss Defect Prevention on WCMP Re-Clean Process
23. Mechanism and Solution of Isb Failure on Deep Trench DRAM
24. WCVD Seam Hole Improvement to Prevent BEOL Copper Diffusion
25. Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process
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