Study on Al-Ge Bonding and Quality Improvement in CMEMS Process

CMEMS(CMOS and Micro Electro Mechanical Systems) process is integration of CMEMS and cap wafer, which is realized through bonding process and has been more and more important in IC industry currently. The bonding process is kernel in CMEMS manufacture and is impacted by material, pressure, temperature and so on. In standard bonding process, Al-Ge bonding which is selected for the good adhesion comparing with other bonding material. In this paper, the bonding process conditions are designed according to the structure of CMEMS and characteristics of Al-Ge material, and experiments including leakage rate and bonding strength are implemented to discuss the bonding quality. In the end, suitable bonding process and its summary of side effect for Al-Ge are put forward.