17 results on '"Her, T.D."'
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2. Substrate designs to improve die crack damage in CSP.
3. Characterization of molded underfill material for flip chip ball grid array packages.
4. Electrical characterization of quad flat non-lead package for RFIC applications.
5. The advent of 3-D package age.
6. Evaluating underfill material for flip chip ball grid array package.
7. Tape ball grid array package analysis.
8. Bridging the gap: package level and system level thermal modeling.
9. The application of mold flow simulation in electronic package.
10. Advanced substrate technology for ball grid array in electronic packaging.
11. Bridging the gap: package level and system level thermal modeling
12. Tape ball grid array package analysis
13. Characterization of molded underfill material for flip chip ball grid array packages
14. Substrate designs to improve die crack damage in CSP
15. Advanced substrate technology for ball grid array in electronic packaging
16. The application of mold flow simulation in electronic package
17. The effects of floating body operation on hot carrier behavior in SOS MOSFETs.
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