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Tape ball grid array package analysis.

Authors :
Wang, Y.P.
Her, T.D.
Source :
2000 Proceedings 50th Electronic Components & Technology Conference (Cat. No.00CH37070); 2000, p1629-1633, 5p
Publication Year :
2000

Details

Language :
English
ISBNs :
9780780359086
Database :
Complementary Index
Journal :
2000 Proceedings 50th Electronic Components & Technology Conference (Cat. No.00CH37070)
Publication Type :
Conference
Accession number :
80767712
Full Text :
https://doi.org/10.1109/ECTC.2000.853436