The application of mold flow simulation in electronic package.

Authors :: Chai, K.
Liu, V.
Wang, Y.P.
Her, T.D.
Source :: International Symposium on Electronic Materials & Packaging (EMAP2000) (Cat. No.00EX458); 2000, p330-334, 5p
Publication Year :: 2000

Language :: English
ISBNs :: 9780780366541
Database :: Complementary Index
Journal :: International Symposium on Electronic Materials & Packaging (EMAP2000) (Cat. No.00EX458)
Publication Type :: Conference
Accession number :: 81183569
Full Text :: https://doi.org/10.1109/EMAP.2000.904175