108 results on '"Cunge, Gilles"'
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2. Cryogenic cyclical etching of Si using CF4 plasma passivation steps: The role of CF radicals.
3. Precision Defect Integrated Graphene as Reliable Support Membrane for High-Resolution Cryo-Transmission Electron Microscopy
4. Impact of plasma operating conditions on the ion energy and angular distributions in dual-frequency capacitively coupled plasma reactors using CF4 chemistry
5. PbS quantum dot thin film dry etching.
6. Hydrogen Plasmas Processing of Graphene Surfaces
7. Surface and plasma characterization of a self-limited two step etch process for SiN spacer etching applications
8. Dry-Etching Processes for High-Aspect-Ratio Features with Sub-10 nm Resolution High-χ Block Copolymers
9. Top-coats for scalable nano-manufacturing with high-χ block copolymers in lithographic applications
10. Multifunctional Top-Coats Strategy for DSA of High-χ Block Copolymers
11. Lithographically Defined Cross-Linkable Top Coats for Nanomanufacturing with High-χ Block Copolymers
12. Top-coats for scalable nano-manufacturing with high-χ block copolymers in lithographic applications
13. Vacuum ultraviolet-absorption spectroscopy and delocalized plasma-induced emission used for the species detection in a down-stream soft-etch plasma reactor
14. Cleaning chamber walls after ITO plasma etching process
15. Helium plasma modification of Si and Si 3 N 4 thin films for advanced etch processes
16. Engineering Self-Assembly of a High-χ Block Copolymer for Large-Area Fabrication of Transistors Based on Functional Graphene Nanoribbon Arrays
17. Effective patterning and cleaning of graphene by plasma etching and block copolymer lithography for nanoribbons fabrication
18. CF4/H2 Plasma Cleaning of Graphene Regenerates Electronic Properties of the Pristine Material
19. Helium plasma modification of Si and Si3N4 thin films for advanced etch processes
20. PESM2017 PBezard - Different approaches to reduce DSA defectivity by dry-etching
21. Top-coats for scalable nano-manufacturing with high-χ block copolymers in lithographic applications
22. Diagnostics in pulsed hydrogen plasmas
23. Diagnostics of Pulsed Hydrogen Plasmas
24. Producing ion waves from acoustic pressure waves in pulsed inductive plasmas
25. Overview of several applications of chemical downstream etching (CDE) for IC manufacturing: advantages and drawbacks versus WET processes
26. Study of selective chemical downstream plasma etching of silicon nitride and silicon oxide for advanced patterning applications
27. Roughness generation during Si etching in Cl2 pulsed plasma
28. Optical and electrical diagnostics in chlorine based pulsed plasmas of an industrial silicon etching reactor
29. Directed self-assembly of PS-b-PDMS into 193nm photoresist patterns and transfer into silicon by plasma etching
30. CF4/H2 Plasma Cleaning of Graphene Regenerates Electronic Properties of the Pristine Material.
31. Helium plasma modification of Si and Si3N4 thin films for advanced etch processes.
32. Cleaning chamber walls after ITO plasma etching process
33. 2D fluid simulations of acoustic waves in pulsed ICP discharges: Comparison with experiments
34. Challenges related to linewidth roughness
35. Hydrogen Plasmas Processing of Graphene Surfaces
36. Emerging Nanotechnology for Integration of Nanostructures in Nanoelectronic Devices
37. Silicon etching in a pulsed HBr/O2 plasma. II. Pattern transfer
38. Silicon etching in a pulsed HBr/O2 plasma. I. Ion flux and energy analysis
39. 'Plasma/reactor walls interactions in advanced gate etching processes'
40. Mass spectrometry studies of resist-trimming processes in HBr/O2 and Cl2/O2 chemistries
41. Pulsed Transfer Etching of PS–PDMS Block Copolymers Self-Assembled in 193 nm Lithography Stacks
42. Development of plasma etching processes to pattern sub-15 nm features with PS-b-PMMA block copolymer masks: Application to advanced CMOS technology
43. Contact hole shrink by directed self-assembly: Process integration and stability monitored on 300 mm pilot line
44. Directed self-assembly of PS-b-PDMS into 193nm photoresist patterns and transfer into silicon by plasma etching
45. Patterning of silicon nitride for CMOS gate spacer technology. III. Investigation of synchronously pulsed CH3F/O2/He plasmas
46. Time-resolved ion flux, electron temperature and plasma density measurements in a pulsed Ar plasma using a capacitively coupled planar probe
47. Block copolymer technology applied to nanoelectronics
48. Scaling-down lithographic dimensions with block-copolymer materials: 10-nm-sized features with poly(styrene)-block-poly(methylmethacrylate)
49. Roughness generation during Si etching in Cl2 pulsed plasma.
50. Ion flux and ion distribution function measurements in synchronously pulsed inductively coupled plasmas
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