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Helium plasma modification of Si and Si 3 N 4 thin films for advanced etch processes
- Source :
- Journal of Vacuum Science and Technology A, Journal of Vacuum Science and Technology A, American Vacuum Society, 2018, 36 (4), pp.041301, Journal of Vacuum Science & Technology A, Journal of Vacuum Science & Technology A, 2018, 36 (4), pp.041301
- Publication Year :
- 2018
- Publisher :
- HAL CCSD, 2018.
-
Abstract
- International audience
- Subjects :
- [PHYS]Physics [physics]
ComputingMilieux_MISCELLANEOUS
[PHYS] Physics [physics]
Subjects
Details
- Language :
- English
- ISSN :
- 07342101
- Database :
- OpenAIRE
- Journal :
- Journal of Vacuum Science and Technology A, Journal of Vacuum Science and Technology A, American Vacuum Society, 2018, 36 (4), pp.041301, Journal of Vacuum Science & Technology A, Journal of Vacuum Science & Technology A, 2018, 36 (4), pp.041301
- Accession number :
- edsair.dedup.wf.001..79d1aa516a793809a7e5c1b45ee7692d