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The current-voltage characteristics and quantum efficiencies of double layer planar heterostructure photodiodes were investigated. Results are reported on devices with cutoff wavelengths of 1.8, 2.4, and 3.3 µm. For these respective devices, the dominant currents for temperatures >250,>200,>150K are diffusion currents limited by shallow Shockley-Hall-Read (SHR) processes. The remarkable result is that the electrical and optoelectronic properties of these devices of diverse cut-off wavelength can be explained by simple models using independently measured layer parameters such as the minority carrier lifetimes. For all three cases, the analysis suggests that the same shallow (SHR) centers located at 78% of the energy gap are causing the observed effects. These traps located in then-type base of the device are not influenced by the magnitude of n-type doping and this observation was used to significantly improve the performance of the devices and validate the predictive capability of the models used in the analysis. The shallow centers appear to be process induced rather than grown-in. This assertion is based on the observation that changes in the annealing process led to an order of magnitude improvement in the minority carrier lifetime.

The capability of growing state-of-the-art middle wavelength infrared (MWIR)-HgCdTe layers by molecular beam epitaxy (MBE) on large area silicon substrates has been demonstrated. We have obtained excellent compositional uniformity with standard deviation of 0.001 with mean composition of 0.321 across 1.5″ radii. R0A as high as 5 × 107 ω-cm2 with a mean value of 7 × 106 Θ-cm2 was measured for cut-off wavelength of 4.8 µm at 77K. Devices exhibit diffusion limited performance for temperatures above 95K. Quantum efficiencies up to 63% were observed (with no anti-reflection coating) for cut-off wavelength (4.8–5.4) µm @ 77K. Excellent performance of the fabricated photodiodes on MBE HgCdTe/CdTe/Si reflects on the overall quality of the grown material in the MWIR region.

This paper describes recent advances in MBE HgCdTe technology. A new 3 inch production molecular beam epitaxy (MBE) system, Riber Model 32P, was installed at Rockwell in 1994. The growth technology developed over the years at Rockwell using the Riber 2300 R&D system was transferred to the 32P system in less than six months. This short period of technology transfer attests to our understanding of the MBE HgCdTe growth dynamics and the key growth parameters. Device quality material is being grown routinely in this new system. Further advances have been made to achieve better growth control. One of the biggest challenges in the growth of MBE HgCdTe is the day-to-day control of the substrate surface temperature at nucleation and during growth. This paper describes techniques that have led to growth temperature reproducibility within + - 1°C, and a variation in temperature during substrate rotation within 0.5°C. The rotation of the substrate during growth has improved the uniformity of the grown layers. The measured uniformity data on composition for a typical 3 cm × 3 cm MBE HgCdTe/CdZnTe shows the average and standard deviation values of 0.229 and 0.0006, respectively. Similarly, the average and standard deviation for the layer thickness are 7.5 and 0.06 µm, respectively. P-on-n LWIR test structure photodiodes fabricated using material grown by the new system and using rotation during growth have resulted in high-performance (R0)A, quantum efficiency) devices at 77 and 40K. In addition, 128 × 28 focal plane arrays with excellent performance and operability have been demonstrated.

We have carried out a study and identified that MBE HgCdTe growth-induced void defects are detrimental to long wavelength infrared photodiode performance. These defects were induced during nucleation by having surface growth conditions deficient in Hg. Precise control and reproducibility of the CdZnTe surface temperature and beam fluxes are required to minimize such defects. Device quality material with void defect concentration values in the low 102 cm2 range were demonstrated.

We have developed a low temperature procedure for molecular beam epitaxy of CdTe buffer layers on {211} Si wafers and have used Si/ZnTe/CdTe composite substrates for molecular beam epitaxy of double layer Hg1−xCdxTe heterostructures. Planar p-on-n double layer heterostructures were formed by an implantation technique and test diodes were fabricated and characterized. At 77 K, devices with 30×30 μm2 junction area had R0A values in the range 1.5×106–1×107Ω cm2 with a uniform cut-off wavelength of 4.65 μm.

We report a process to fabricate planar Hg1−yCdyTe/Hg1−xCdxTe (x

We report the demonstration of an all molecular beam epitaxy HgCdTe bias‐selectable dual‐band infrared photodetector. The mesa device, an n‐p‐n three layer HgCdTe heterostructure, was in situ doped with arsenic and indium for p‐ and n‐type doping. The device design is similar to a heterostructure floating base transistor. The feasibility of the two‐color bias‐switchable detector was demonstrated by obtaining backside illuminated spectrally pure dual‐band detection at 77 K. Wavelength cutoff (λco) selection to 5.2 μm with 60% quantum efficiency (QE) was obtained by applying a negative bias of −250 meV, and to λco=7.9 μm with 36% QE by applying a positive bias of 250 meV. The current‐voltage characteristics of this device can be described in terms of a simple back‐to‐back diode model.

Rockwell Science Center has developed a double layer planar heterostructure (DLPH) detector array fabrication process with significant advantages over the PACE-1 process now being used to produce 256 X 256 and 1024 X 1024 FPAs for low background IR astronomy. The DLPH detectors are p- on-n photodiodes fabricated in a double layer of wide and narrow bandgap HgCdTe grown by molecular beam epitaxy on CdZnTe substrates. The double layer structure provides superior surface passivation while the lattice matched CdZnTe substrate reduces the defect density. DLPH FPAs have been fabricated in array sizes up to 640 X 480 and with cutoff wavelengths as long as 15 micrometers . Quantum efficiencies are typically in the 0.5 to 0.8 range. For a 256 X 256 array DLPH detectors with 5.3 micrometers cutoff wavelength at 50K, the median dark current was 0.39 e-/sec at 0.5V reverse bias. For 7 of 17 individual DLPH detector with 10.6 micrometers cutoff at 30K, the dark current was less than 10 4 e-/sec at 20 mV bias. For long cutoff wavelengths, the detector breakdown voltage is too low to permit signal integration directly on the reverse biased detector capacitance. Such detectors require a readout circuit that maintains the detector near zero bias and provides a separate capacitor to store the integrated signal.

The relatively large detector size of conventional focal plane arrays often acts as a limiting source of noise currents and requires these devices to run at undesirably low temperatures. To reduce the detector size without reducing the detector's quantum efficiency, we have developed efficient on-focal plane collection optics consisting of arrays of thin film binary optic microlenses on the back surface of hybrid detector array structures. P/n polarity photodiodes of an unusual `planar-mesa' geometry were fabricated in epitaxial HgCdTe deposited by molecular beam epitaxy on the `front' side of a CdZnTe substrate. Diffractive (8 - 16 phase level) Ge microlenses were deposited on 48 micrometers centers in a registered fashion (using an IR mask aligner and appropriate marks on the front surface of the CdZnTe) on the back side of the substrate using a lifting process. The lifting process circumvents some of the process limitations of the more conventional chemical etching method to diffractive microlens processing, allowing them to approach more closely their theoretical efficiency limit of > 95%. Prior to microlens deposition, but after diode fabrication, the test structures were flip- chip bonded or `hybridized' using indium interconnections to metallic strip lines which had been photolithographically deposited on sapphire dice (a process equally compatible with a silicon integrated circuit readout). After hybridization, the CdZnTe was thinned to equal the focal length of the lenses in the CdZnTe material. Optical characterization has demonstrated that the microlenses combined with the detector mesas concentrate light sufficiently to increase the effective collection area. The optical size of the mesa detectors being larger than the theoretical diffraction limit of the microlenses precludes determining whether the lenses themselves produce the theoretical diffraction-limited gain, but they clearly decrease required detector area by at least 3 - 6X. To our knowledge, this is the first successful demonstration of IR detectors and binary optics microlens integration.

The large detector size of conventional focal plane arrays (FPAs) often acts as a limiting source of noise currents and requires these devices to run at undesirably low temperatures. To reduce the detector size without reducing the detector’s quantum efficiency (QE), we have developed efficient on-focal-plane collection optics consisting of arrays of thin-film binary-optics microlenses and photoresist-based refractive microlenses on the back surface of hybrid detector array structures. Photodiodes of p/n polarity, of an unusual planar-mesa geometry, were fabricated in epitaxial HgCdTe deposited by molecular beam epitaxy (MBE) on the front side of a CdZnTe substrate. Diffractive (8- to 16-phase-level) Ge microlenses were deposited on 48-µm centers in a registered fashion (using an IR mask aligner and appropriate marks on the front surface of the CdZnTe) on the back side of the substrate using a lifting process. The lifting circumvents some of the process limitations of the more conventional chemical etching methods on diffractivemicrolens processing, allowing the microlenses to approach more closely their theoretical efficiency limit of .95%. Photoresist microlenses were fabricated by reflow of photolithographically defined photoresist islands. Prior to microlens deposition, but after diode fabrication, the test structures were flip-chip bonded or ‘‘hybridized’’ using indium interconnections to metallic striplines that had been photolithographically deposited on sapphire dice (a process equally compatible with a siliconintegrated- circuit readout). After hybridization, the CdZnTe was thinned to equal the focal length of the lenses in the CdZnTe material. Optical characterization has demonstrated that the microlenses combined with the detector mesas concentrate light sufficiently to increase the effective collection area. The optical size of the mesa detectors being larger than the theoretical diffraction limit of the microlenses precludes determining whether the lenses themselves produce the theoretical diffraction-limited gain, but they clearly decrease the required detector area by at least 3 to 6 times. To our knowledge, this is the first successful demonstration of IR detectors and binary optics and of photoresist refractive-microlens integration.

This study deals with the effects of perturbing the surfaces of unpassivated HgMnCdTe and HgCdTe short‐wavelength infrared photodiodes to further our understanding of these effects on dark currents. Perturbations include illuminating ultraviolet (UV)radiation in high vacuum and in various gaseous species. The change in dark current at 0.8 V reverse bias and its evolution with time was monitored in situ. By correlating the amount of excess dark current generated by UV radiation to the vacuum conditions, we conclude that it is a surface‐related problem. A drastic improvement in device performance was found by illuminating its surface with UV radiation in high vacuum. This simple treatment prevents the generation of excess and persistent dark current and stabilizes the leakage current at low reverse bias. This can be understood in terms of photodesorption of surfacecontaminants which induce deep level surface states, giving rise to the persistent dark current generation. By studying the effects of various gaseous species, we identified water molecules as the key surfacecontaminants. We also discovered an anomalous degradation in HgCdTe diodes when they were exposed to hydrogen and UV radiation simultaneously. This anomalous degradation can be interpreted as UV‐catalyzed chemical reduction of HgCdTe by hydrogen or the diffusion of hydrogen atoms into the bulk to change the junction characteristics.

A detailed study has been made of the current-voltage characteristics of Hd1-xCdxTe ion-implanted p-n junctions with x ⋍ 0.224. It is found that the dark currents, for diodes of high quality, can be represented over a broad range of voltage and temperature by three current components. A diffusion current dominates in the small bias region at temperatures > 50 K. This current component is also observed at sufficiently high forward biases at low temperatures. At temperatures of 30

A new device concept for CdTe gamma ray detectors has been demonstrated using p+(HgCdTe)-n(CdTe)-n+ (HgCdTe) diode structures. Both P+ and n+ Hg0.25Cd0.75Te epilayers were grown by the liquid phase epitaxy (LPE) technique on semi-insulating CdTe sensor elements. The LPE grown P-I-N structure offers potential advantages for p-n junction and ohmic contact formation over standard ion implanted diodes or Schottky barrier devices. Detectors with active areas of 2 mm2 were fabricated. Resolutions of 10 KeV were obtained for the 122 KeV gamma peak of Co57 at room temperature.

The isothermal vapor‐phase‐epitaxial (ISOVPE) growth of device‐quality HgCdTe layers on both CdTe and CdTe/Al2O3 substrates has been demonstrated. The material and device properties on both types of substrates have been studied and compared with reported values for HgCdTe grown by other techniques. The as‐grown ISOVPE Hg1−xCdxTe (x≂0.3) epilayers are always p type with carrier concentrations of ∼5×1015 to 3×1016 cm−3 and mobilities of ∼230–260 cm2/V s at 77 K. The temperature and compositional dependence of electrical properties of ISOVPE Hg1−xCdxTe are somewhat different from those of liquid‐phase epitaxy (LPE) and bulk HgCdTe. In particular, the acceptor ionization energy, EA =7 meV, is about half that obtained in midwavelength infrared LPE or bulk HgCdTe, and nearly independent of composition x. The R0A product of a representative photodiode (λc ≂4.65 μm, 77 K) is 2×106 and 4 Ω cm2 at 77 and 195 K, respectively, with comparable device qualities seen on both CdTe and CdTe/Al2O3 substrates.

To identify the dominant physical mechanisms determining current–voltage and spectral noise current characteristics, a comprehensive experimental study of Hg1−x Cdx Te (x=0.22) photodiodes has been performed. Over the voltage range −400 mV≤V≤100 mV and temperature region 5 K

Long and middle wavelength infrared (LWIR, MWIR) p+‐n photodiodes have been fabricated with Hg1−xCdxTe (0.20

Device‐quality Hg1−xCdxTe (0.26

High‐performance backside‐illuminated photodiodes have been fabricated for the first time from InAs1−xSbx‐InAs heterostructures prepared by liquid‐phase‐epitaxy technique. The peak wavelength can be tuned compositionally from 3.1 to over 7.0 μm at 77 K. The half‐width of the spectral responses as narrow as 1760 A (at 4.0 μm) have been achieved. Internal quantum efficiencies of 90% and zero‐bias‐resistance–area products of 2×107 Ω cm2 have been obtained at 77 K.

A planar HgCdTe/CdTe avalanche photodiode with peak responsivity at 1.22 μm and cutoff at 1.25 μm has been fabricated successfully by liquid phase epitaxy (LPE). Avalanche gains of higher than 15 have been obtained with 1.06‐μm Nd:yttrium aluminum garnet (YAG) laser illumination. A reverse breakdown voltage of 80 V and a leakage current density of 1×10−4 A/cm2 at 40 V were measured. The peak quantum efficiency at 1.22 μm is 72% without any antireflection coating.

Infrared photodiodes fabricated with HgCdTe epilayers grown on GaAs substrates by molecular beam epitaxy (MBE) are reported here for the first time. Growth was carried out on the (211)B orientation of GaAs, and the as‐grown epilayer (x=0.24) was p type. The n‐p junction was formed by Be ion implantation, the resistance‐area product (R0 A) at zero bias was 1.4×103 Ω cm2 , the wavelength cutoff was 8.0 μm, and the quantum efficiency was 22%; all were measured at 77 K. We show that in the diffusion regime diodes fabricated with MBE HgCdTe/GaAs have comparable R0 A product values to those made with HgCdTe grown by bulk techniques. This result discloses new possibilities for advanced monolithic HgCdTe devices based on GaAs integrated circuit technology.

Device‐quality Hg1−xCdxTe (0.2≤x≤0.35) epitaxial layers have been grown on CdTe substrates by open‐tube isothermal vapor phase epitaxy (ISOVPE). The surface morphology of the layers is mirrorlike, and the Hall data are comparable to those for HgCdTe grown by liquid phase epitaxy (LPE). Photovoltaic devices with a cutoff wavelength of 4.1 μm at 77 K were fabricated on an ISOVPE HgCdTe epilayer. Their performance is comparable with those that we have obtained for such devices fabricated on LPE HgCdTe epilayers.

Low‐capacitance (< 10 pF) Pb1−xSnxTe photodiodes operating near 77 °K (areas 1.7 × 10−4 cm2) have been obtained via liquid‐phase epitaxial growth of low‐carrier‐concentration material (low 1014 cm−3 to high 1015 cm−3). Response to a mode‐locked 1.06‐μm Nd:YAG laser with the devices terminated in 50 Ω indicated a frequency response to 400 MHz. With a 14‐Ω load and by exciting a photocurrent with radiation from a CO2 laser, the shot noise rolloff point was found to be 1200 MHz. Optimum parameters have not yet been achieved, as evidenced by the increase in frequency response with increase in reverse bias; these results represent only a lower limit to this material's capability.

Hgi-xCdxTe epitaxial layers have been successfully grown in various compositions, for 1-3 μm applications. n+/p junctions are formed either by a standard B-implantation into as-grown p-type layers or by doubly grown p- and n-layers. The SWIR HgCdTe photodiodes exhibit quantum efficiencies of 55-65% without AR coating. For the diodes with 1.39 μm cut-off at room temperature, the zero bias detector resistance-area (RoA) product is 4 x 10 4 Ω-cm2, and the dark current density is ~ 1 x 10 -4 A/cm2 at half-breakdown voltage. The same values of ~ 104 Ω-cm2 RoA products have also been measured for 2.4 μm cut-off photodiodes at 195K. The energy gap and temperature dependence of RoA product is in excellent agreement with the bulk limited generation-recombination model. The breakdown voltages of SWIR diodes vary from 12 volts to greater than 130 volts, depending on the Cd composition (x) and base carrier concentrations.