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We demonstrated a prototype Gated Lateral power bipolar junction transistor (GLP-BJT) on wide bandgap semiconductor. The device combined the intrinsic advantages of high current gain of a Gated Lateral-BJT and good current handling and voltage blocking capabilities of GaN material. As a result, the common-emitter current gain remained over 300 at a high collector current density of 2 kA/cm2 despite a wide p-base region of 2µm. The open base breakdown voltage BVCEO was over 300 V corresponding to a high critical field of 2.5 MV/cm. These figures of merit show great promise of GaN-based GLP-BJT in power applications and also shed light on the development of state-of-the-art bipolar transistors based on other wide bandgap semiconductors.

For rooting the development of GaN-based optoelectronic devices, understanding the roles of midgap recombination centers (MGRCs), namely, nonradiative recombination centers and deep-state radiative recombination centers, on the carrier recombination dynamics is an essential task. By using the combination of time-resolved photoluminescence and positron annihilation spectroscopy (PAS) measurements, the origins of major MGRCs in the state-of-the-art GaN epilayers, bulk crystals, and Mg-implanted layers were identified, and their concentrations were quantified for deriving the capture coefficients of minority carriers. In this article, potential standardization of the room-temperature photoluminescence lifetime for the near-band-edge emission (τ PL RT ) as the concentration of major MGRCs well below the detection limit of PAS is proposed. For n-GaN substrates and epilayers grown from the vapor phase, τ PL RT was limited by the concentration of carbon on N sites or divacancies comprising a Ga vacancy (VGa) and a N vacancy (VN), [VGaVN], when carbon concentration was higher or lower, respectively, than approximately 1016 cm−3. Here, carbon and VGaVN act as major deep-state radiative and nonradiative recombination centers, respectively, while major MGRCs in bulk GaN crystals were identified as VGa(VN)3 vacancy clusters in Na-flux GaN and VGa or VGaVN buried by a hydrogen and/or VGa decorated with oxygen on N sites, VGa(ON)3–4, in ammonothermal GaN. The values of τ PL RT in n-GaN samples are compared with those of p-GaN, in which τ PL RT was limited by the concentration of VGa(VN)2 in Mg-doped epilayers and by the concentrations of VGaVN and (VGaVN)3 in Mg-implanted GaN right after the implantation and after appropriate activation annealing, respectively. [ABSTRACT FROM AUTHOR]

The anisotropic hole transport along [0001] and [11 2 ¯ 0] in the p-doped (10 1 ¯ 0) GaN layer was compared for layers grown on bulk (10 1 ¯ 0) GaN substrates and on (10 1 ¯ 0) sapphire. The sheet resistance along [0001] was 1.1 times larger on GaN substrates and even 1.2 times larger on sapphire than that along [11 2 ¯ 0]. The anisotropic hole transport on bulk GaN substrates is due to the anisotropy of the hole's effective mass and the different contribution of carriers in different bands, whereas the larger anisotropy for GaN on sapphire is also due to additional scattering at stacking faults. The annealing process of metal Mg applied to the m-plane p-type GaN successfully results in a robust p-type ohmic contact, functioning as a p + + layer. [ABSTRACT FROM AUTHOR]

This Letter reports an investigation of hole transport in p-GaN/AlGaN/GaN heterostructures through experimental and theoretical analyses under varied conditions. Highly non-linear current–voltage (I–V) characteristics, obtained via the linear transmission line method measurements, are utilized for this study. At low bias voltage, the transport can be ascribed to the Schottky nature of the contact, while at high bias, the conduction is observed to be governed by space-charge limited current (SCLC). The Schottky characteristics (Schottky barrier height and non-ideality factor) and the SCLC exponent were analyzed for devices with varying contact spacings and at different high temperatures. The SCLC exponent, m, is in the range of 2 ≤ m ≤ 4 depending on the applied voltage range, revealing the existence of the trap states in the channel region. The findings of this work indicate that the charge injection, field-induced ionization, and trap states in the p-GaN channel are critical factors in the current transport of p-GaN/AlGaN/GaN heterostructure. [ABSTRACT FROM AUTHOR]

As the size of micro light-emitting diodes (μLEDs) decreases, μLEDs encounter etching damage especially at the sidewalls that critically affects their properties. In this study, we investigated the influence of etching bias power (Pbias) on the performance of μLEDs and found that the current–voltage and light output–current characteristics of μLEDs were enhanced when Pbias was reduced. It was shown that at low Pbias, the chemical reaction between etching gas and gallium nitride, rather than ion sputtering, dominated the etching process, leading to low plasma damage and rough surface morphology. Additionally, to understand the etching-induced surface roughening behaviors, various substrates with different threading dislocation densities were treated at low Pbias. It was found that for the sample (with p-contact size of 10 × 10 μm2), the efficiency droop was approximately 20%, although the current reached 10 mA due most probably to the suppressed polarization effect in the quantum well. It was further observed that the external quantum efficiency (EQE) was dependent on Pbias, where the lowest Pbias yielded the highest maximum EQE, indicating that the plasma damage was mitigated by reducing Pbias. Optimization of dry etching and polarization-suppression conditions could pave the way for realizing high-performance and brightness μLEDs for next-generation displays. [ABSTRACT FROM AUTHOR]

Advances in obtaining untwinned (10 1 ¯ 3)-oriented semi-polar GaN enable a new crystal orientation for the growth of green and red LED structures. We present a scanning electron microscopy study that combines the structural characterization of electron channeling contrast imaging with the optical characterization of cathodoluminescence hyperspectral imaging on a (10 1 ¯ 3) GaN layer. An extensive defect analysis revealed that the dominant defects consist of basal plane stacking faults (BSFs), prismatic stacking faults, partial dislocations, and threading dislocations. With a defect density of about an order of magnitude lower than in comparable. The optical properties of the defects have been characterized from 10 to 320 K, showing BSF luminescence at room temperature indicating a reduced density of non-radiative recombination centers in the as-grown samples compared to established semi- and non-polar orientations. Our findings suggest that growth along (10 1 ¯ 3) has the potential for higher radiative efficiency than established semi-polar orientations. [ABSTRACT FROM AUTHOR]

Minority carrier properties in dopant-free p-type distributed polarization doped (DPD) AlGaN layers were investigated on the basis of the forward-biased current density–voltage (J–V) characteristics of p–n+ diodes. The fabricated p-DPD AlGaN/n+–AlGaN:Si diodes exhibited ideal electrical characteristics despite the absence of acceptor atoms in the p-type layer. The extracted Shockley–Read–Hall lifetime exceeded 300 ps, which was longer than that reported for p-GaN:Mg on GaN substrates with a similar acceptor concentration (20–50 ps). Moreover, the electron diffusion coefficient was about 20 cm2 s−1 at any temperature, which was convincing in terms of the electron mobility in DPD layers. The results suggest that p-DPD AlGaN has more desirable minority carrier properties than conventional p-GaN:Mg, particularly for bipolar device applications. [ABSTRACT FROM AUTHOR]

We have demonstrated the fabrication process for a lateral p-type Schottky barrier diode (SBD) with the annealed Mg ohmic contact layer on a MOVPE-grown p-GaN wafer and measured the electrical characteristic of the diode. Because of the selective-area ohmic contact, the interface between the Schottky electrode and p-type GaN is well protected from any damage introduced by dry-etching or regrowth. The ideality factor of the forward current–voltage characteristic is as low as 1.09 at room temperature and an on–off ratio above 109 is also achieved. Various metals are deposited as the Schottky electrode and the work function dependence of the Schottky barrier height is confirmed with a pinning factor of 0.58. The temperature dependence of the current–voltage characteristic indicates that the GaN p-type SBD still fits the thermionic emission mode at 600 K with an ideality factor of 1.1. The reverse current of the p-SBD is also studied with the Poole–Frenkel emission model, and the trap energy level in the p-GaN is confirmed. [ABSTRACT FROM AUTHOR]

With the ammonothermal method, one of the most promising technologies for scalable, cost-effective production of bulk single crystals of the wide bandgap semiconductor GaN is investigated. Specifically, etch-back and growth conditions, as well as the transition from the former to the latter, are studied using a 2D axis symmetrical numerical model. In addition, experimental crystal growth results are analyzed in terms of etch-back and crystal growth rates as a function of vertical seed position. The numerical results of internal process conditions are discussed. Variations along the vertical axis of the autoclave are analyzed using both numerical and experimental data. During the transition from quasi-stable conditions of the dissolution stage (etch-back process) to quasi-stable conditions of the growth stage, significant temperature differences of 20 K to 70 K (depending on vertical position) occur temporarily between the crystals and the surrounding fluid. These lead to maximum rates of seed temperature change of 2.5 K/min to 1.2 K/min depending on vertical position. Based on temperature differences between seeds, fluid, and autoclave wall upon the end of the set temperature inversion process, deposition of GaN is expected to be favored on the bottom seed. The temporarily observed differences between the mean temperature of each crystal and its fluid surrounding diminish about 2 h after reaching constant set temperatures imposed at the outer autoclave wall, whereas approximately quasi-stable conditions are reached about 3 h after reaching constant set temperatures. Short-term fluctuations in temperature are mostly due to fluctuations in velocity magnitude, usually with only minor variations in the flow direction. [ABSTRACT FROM AUTHOR]

Lanthanoid-doped Gallium Nitride (GaN) integrated into nanophotonic technologies is a promising candidate for room-temperature quantum photon sources for quantum technology applications. We manufactured praseodymium (Pr)-doped GaN nanopillars of varying size, and showed significantly enhanced room-temperature photon extraction efficiency compared to unstructured Pr-doped GaN. Implanted Pr ions in GaN show two main emission peaks at 650.3 nm and 651.8 nm which are attributed to 3P0-3F2 transition in the 4f-shell. The maximum observed enhancement ratio was 23.5 for 200 nm diameter circular pillars, which can be divided into the emitted photon extraction enhancement by a factor of 4.5 and the photon collection enhancement by a factor of 5.2. The enhancement mechanism is explained by the eigenmode resonance inside the nanopillar. Our study provides a pathway for Lanthanoid-doped GaN nano/micro-scale photon emitters and quantum technology applications. [ABSTRACT FROM AUTHOR]

GaN-based devices have grown rapidly in recent decades, due to their important research value and application prospects. There is a desire to monolithically integrate different GaN devices into a single chip for the development of future optoelectronic systems with low power consumption. In addition to improved multifunctional performance, a miniature integrated system can result in a significant reduction in material costs, processing costs, and packaging costs. In view of such prospects, we propose monolithic, top-down approaches to build III-nitride transmitter, modulator, waveguide, beam splitter, receiver, and monitor as a single unit onto a conventional GaN-on-silicon wafer without involving regrowth or postgrowth doping. Data communication among these components is realized through light propagation, opening up horizons for GaN optoelectronic systems on a chip. [ABSTRACT FROM AUTHOR]

For the fundamental understanding and the technological development of the ammonothermal method for the synthesis and crystal growth of nitrides, an in situ monitoring technique for tracking mass transport of the nitride throughout the entire autoclave volume is desirable. The feasibility of using high-energy computed tomography for this purpose was therefore evaluated using ex situ measurements. Acceleration voltages of 600 kV were estimated to yield suitable transparency in a lab-scale ammonothermal setup for GaN crystal growth designed for up to 300 MPa operating pressure. The total scan duration was estimated to be in the order of 20 to 40 min, which was sufficient given the comparatively slow crystal growth speed in ammonothermal growth. Even shorter scan durations or, alternatively, lower acceleration voltages for improved contrast or reduced X-ray shielding requirements, were estimated to be feasible in the case of ammonoacidic growth, as the lower pressure requirements for this process variant allow for thinned autoclave walls in an adapted setup designed for improved X-ray transparency. Promising nickel-base and cobalt-base alloys for applications in ammonothermal reactors with reduced X-ray absorption in relation to the maximum operating pressure were identified. The applicability for the validation of numerical simulations of the growth process of GaN, in addition to the applicability of the technique to further nitride materials, as well as larger reactors and bulk crystals, were evaluated. [ABSTRACT FROM AUTHOR]

Herein, the operation of dopant‐free GaN‐based p‐n junctions formed by distributed polarization doping (DPD) is experimentally demonstrated and their space charge profiles and carrier transport properties are investigated. The device exhibits ideal space charge profiles explained by polarization effects and demonstrates the excellent controllability of DPD. In addition, it shows rectification and electroluminescence under forward‐biased conditions. The carrier transport properties could be explained by the conventional recombination/diffusion model used for impurity‐doped p‐n junctions. Repeatable breakdowns are also observed in all devices and the temperature‐dependent breakdown voltages reveal that the breakdowns are caused by avalanche multiplication, which is also the same as those reported in impurity‐doped GaN p‐n diodes. These results indicate that DPD is a promising doping technology for GaN‐based power devices overcoming any issues associated with conventional impurity doping. [ABSTRACT FROM AUTHOR]

We have demonstrated a fabrication process for the Ohmic contact on low-doping-density p-type GaN with nitrogen-annealed Mg. An Ohmic contact with a contact resistance of 0.158 Ω cm2 is realized on p−-GaN ([Mg] = 1.3 × 1017 cm−3). The contact resistance of p-type GaN with higher Mg concentration ([Mg]=1.0 × 1019 cm−3) can also be reduced to 2.8 × 10−5 Ω cm2. A localized contact layer is realized without any etching or regrowth damage. The mechanism underlying this reduced contact resistance is studied by scanning transmission electron microscopy with energy dispersive x-ray spectroscopy and secondary ion mass spectrometry, representing a mutual diffusion of Ga and Mg atoms on the interface. Reductions in the barrier height and surface depletion width with the nitrogen-annealed Mg layer are confirmed by XPS and Hall effect measurements qualitatively. [ABSTRACT FROM AUTHOR]

Conventional lumped small signal circuit (SSC) models of AlGaN/GaN metal oxide semiconductor high electron mobility transistors (MOS-HEMTs) are derived from the low frequency portion of the experimentally measured ${Y}$ -parameters. Consequently, these models cannot faithfully capture the high frequency behavior of the device. In this work, modified SSC models of AlGaN/GaN MOS-HEMTs are developed by fitting the entire broadband measured ${Y}$ -parameters of the device with rational functions. These rational functions are then physically realized using additional passive circuit elements added to the conventional SSC model. The accuracy of the proposed SSC models can be improved by increasing the order of the rational functions. The proposed models are demonstrably more accurate than the conventional SSC models in estimating the higher order poles and zeroes present in the experimentally measured ${Y}$ -parameters of AlGaN/GaN MOS-HEMTs. [ABSTRACT FROM AUTHOR]

A vertical GaN p+-n junction diode with an ideal breakdown voltage was grown by halide vapor phase epitaxy (HVPE). A steep p+-n interface was observed even with the use of the HVPE method. No Si-accumulating layer was formed at the p+-n interface because of the continuous HVPE growth from the n-type drift layer to the p-type layer. This method provides improved electrical properties compared with the regrowth of p-type GaN layers. The minimum ideality factor of approximately 1.6 was obtained. The breakdown voltage increased from 874 to 974 V with the increase in the temperature from 25 to 200 °C, which suggests that avalanche multiplication causes the breakdown. The temperature-dependent breakdown voltage was in good agreement with the breakdown voltage calculated using the ideal critical electric field. These results indicate that HVPE is promising for the fabrication of vertical GaN power devices. [ABSTRACT FROM AUTHOR]

We have investigated the possibility of applying lasers to slice GaN substrates. Using a sub-nanosecond laser with a wavelength of 532 nm, we succeeded in slicing GaN substrates. In the laser slicing method used in this study, there was almost no kerf loss, and the thickness of the layer damaged by laser slicing was about 40 µm. We demonstrated that a standard high quality homoepitaxial layer can be grown on the sliced surface after removing the damaged layer by polishing. [ABSTRACT FROM AUTHOR]

Gallium nitride (GaN)-based devices surpass the traditional silicon-based power devices in terms of higher breakdown voltage, faster-switching speed, higher thermal conductivity, and lower on-resistance. However, heteroepitaxial GaN growths like GaN on sapphire are not suitable for power devices due to the threading dislocation densities as high as 108/cm2. Recently, homoepitaxial GaN growth has become possible thanks to the native GaN substrates with dislocation densities in the order of 104/cm2 but the extremely high cost of the GaN substrates makes the homoepitaxy method unacceptable for industrial applications, and the slicing of wafers for reusing them is an effective solution for cost reduction. In this study, we will investigate a route for slicing the GaN single crystal substrate by controlling the laser pulse energy and changing the distance between each laser shot. The 2D and 3D crack propagations are observed by a multiphoton confocal microscope, and the cross section of samples is observed by a scanning electron microscope (SEM). The results showed that two types of radial and lateral cracking occurred depending on the pulse energy and shot pitch, and controlling them was of importance for attaining a smooth GaN substrate slicing. Cross-sectional SEM images showed that at suitable pulse energy and distance, crack propagation could be controlled with respect to the irradiation plane. [ABSTRACT FROM AUTHOR]

We have demonstrated non-polar GaN power diodes (Schottky barrier diode and p–n junction diode) on foreign substrates featuring the true-lateral p–n and metal–semiconductor junctions. The diodes were fabricated on GaN islands laterally overgrown on the mask-patterned sapphire and Si substrates by metalorganic vapor phase epitaxy. The anode and cathode were formed on the opposed a-plane sidewalls of the island, making the device architecture essentially like the 90° rotation of the desired true-vertical power diodes. The ideality factor of the Schottky barrier diode remained 1.0 (from 1.00 to 1.05) over 7 decades in current. Specifically, a high critical electric field of 3.3 MV/cm was demonstrated on the p–n junction diode with avalanche capability. These performances reveal a strong potential of non-polar GaN with the true-lateral junctions for high power applications. [ABSTRACT FROM AUTHOR]

GaN nanorods (NRds) with axial InGaN/GaN MQWs insertions are synthesized by an original cost-effective and large-scale nanoimprint-lithography process from an InGaN/GaN MQWs layer grown on c-sapphire substrates. By design, such NRds exhibit a single emission due to the c-axis MQWs. A systematic study of the emission of the NRds by time-resolved luminescence (TR-PL) and power dependence PL shows a diameter-controlled luminescence without significant degradation of the recombination rate thanks to the diameter-controlled strain tuning and QSCE. A blueshift up to 0.26 eV from 2.28 to 2.54 eV (543 nm to 488 nm) is observed for 3.2 nm thick InGaN/GaN QWs with an In composition of 19% when the NRds radius is reduced from 650 to 80 nm. The results are consistent with a 1-D based strain relaxation model. By combining state of the art knowledge of c-axis growth and the strong strain relieving capability of NRds, this process enables multiple and independent single-color emission from a single uniform InGaN/GaN MQWs layer in a single patterning step, then solving color mixing issue in InGaN based nanorods LED devices. [ABSTRACT FROM AUTHOR]

The oxygen incorporation kinetics of vicinal m(10−10) gallium nitride (GaN) growth during metal‐organic vapor phase epitaxy is clarified using a diffusion equation‐based approach that incorporates diffusion potentials obtained by large‐scale density functional theory (DFT) calculations. A diffusion model based on the Burton, Cabrera and Frank (BCF) theory is proposed, and then, the oxygen concentration in the epitaxial films is calculated quantitatively. The calculation results agree with the experimental tendency that the oxygen concentration in the −c 5° off m‐GaN epilayers is lower than that in the +c 5° off m‐GaN epilayers. Then, the off‐angle dependence of oxygen incorporation in vicinal m‐GaN growth is predicted. [ABSTRACT FROM AUTHOR]

Herein, a newly developed birefringence microscope is used to observe dislocations in gallium nitride (GaN) substrates. The comparison results of the observation method using this microscope with other observation methods, such as X‐ray topography and Raman microscopy, confirms that dislocations in a GaN substrate can be detected with a birefringence microscope. In addition, the observation can be carried out as easily as with an optical microscope. It is also found that under certain observation conditions, the direction of the edge component of dislocations can be determined. [ABSTRACT FROM AUTHOR]

Herein, gallium nitride (GaN) samples implanted with magnesium (Mg) and fluorine (F) ions are investigated by photoluminescence (PL) measurements. In low‐temperature PL measurements, the characteristic green luminescence (GL) band attributable to nitrogen vacancies (VN) is observed in Mg‐ion‐implanted GaN. As VN are likely to act as donors, suppressing their formation is essential to realizing p‐type conductivity. The energy required for a F impurity to replace VN in GaN and eventually form F on a N site decreases when the Fermi level approaches the valence band maximum, and therefore F is employed as a subsequent implantation element to compensate for VN. The GL band peak disappears upon implanting Mg and F ions at a high temperature and adjusting the F concentration to an appropriate value. This result suggests that VN generated by Mg ion implantation can be suppressed using an element with a lower formation energy than that of VN. [ABSTRACT FROM AUTHOR]

The excitonic optical properties of a-plane AlN epitaxial layers have been studied by means of temperature-dependent photoluminescence (PL) and optical reflectance (OR) spectroscopy. An exciton resonance and free-exciton luminescence were clearly observed up to room temperature in the OR and PL measurements, respectively. Analysis of the low temperature OR spectrum enabled us to obtain a splitting energy of 7.3 meV between longitudinal and transverse-exciton resonances for AlN, which was approximately one order of magnitude larger than that for GaN. An emission from the upper branch of the excitonic polariton was also observed at temperatures above 100 K, reflecting thermal repopulation of excitonic polaritons from the lower to the upper branch. In addition, the temperature dependence of the transverse-exciton resonance could be well described using an empirical equation based on Bose–Einstein statistics, in which the Einstein characteristic temperature was estimated to be 455 K. [ABSTRACT FROM AUTHOR]

We study the effect of a combination of N[sub 2] and H[sub 2] carrier gases on the residual strain and crystalline properties of GaN, and we propose its application to the improvement of crystalline quality of GaN/Al[sub 0.17]Ga[sub 0.83]N multiple quantum well (MQW) structures. GaN was grown with H[sub 2] or N[sub 2] carrier gas (H[sub 2]- or N[sub 2]-GaN) on an AlN low-temperature-deposited buffer layer. A (0001) sapphire substrate was used. N[sub 2]-GaN was grown on H[sub 2]-GaN. The total thickness was set to be 1.5 μm, and the ratio of N[sub 2]-GaN thickness to the total thickness, x, ranged from 0 to 1. With increasing x, the tensile stress in GaN increased. Photoluminescence intensity at room temperature was much enhanced. Moreover, the crystalline quality of GaN/Al[sub 0.17]Ga[sub 0.83]N MQW was much higher when the MQW was grown with N[sub 2] on H[sub 2]-GaN than when it was grown with H[sub 2] on H[sub 2]-GaN. These results were due to the achievement of control of strain in GaN using a combination of N[sub 2]-GaN and H[sub 2]-GaN. © 2001 American Institute of Physics. [ABSTRACT FROM AUTHOR]

The growth of GaN 3-D microstructures is investigated by SAG-HVPE. Capitalizing on the properties of this kinetically-controlled process, the main experimental parameters and physical mechanisms that control the shaping of 3D GaN prisms and pyramids in SAG-HVPE are highlighted. Growth experiments performed on N-polar AlN/Si(100) and Ga-polar GaN/Si(111) substrates also provide insight into how to switch from a pyramid to a prismatic shape for a given substrate polarity. The aspect ratio of GaN rods could be tuned by playing with the HCl partial pressure additionally introduced during growth. The influence of both mass transport and surface kinetics is discussed, as the crystal growth rate varies with increasing surface area as time goes by. Ammonia treatment prior to the growth, aimed at blocking the r planes thanks to H2 passivation, is proposed to tune the morphology of the GaN rods. Raman spectroscopy performed on individual GaN rods shows no relevant strain field and no structural differences between the rods and state-of-the-art bulk GaN. [ABSTRACT FROM AUTHOR]

The reduction of unintentional impurities in m‐plane ( 10 1 ¯ 0 ) GaN homoepitaxial layers is demonstrated by using nitrogen (N2), as opposed to hydrogen (H2), as carrier gas in metalorganic vapor phase epitaxy (MOVPE). Secondary ion mass spectrometry (SIMS) analysis shows that the impurity levels of residual oxygen (O), carbon (C), and silicon (Si) are decreased by nearly one order of magnitude in N2‐grown samples. Although the full width at half maximum (FWHM) values for the on‐axis m‐plane X‐ray rocking curves of all specimens are quite similar (around 50 arcsec), plan‐view scanning transmission electron microscopy (STEM) measurements reveal a clear reduction of dislocation densities in N2‐grown films. Their origin is likely related to an initial surface roughening with H2 carrier gas, which also causes surface faceting resulting in the formation of large four‐sided pyramidal hillocks, while using N2 results in smoother surfaces. Hence, MOVPE growth with N2 carrier gas is an effective method to lower the impurity incorporation in m‐plane GaN materials in addition to reducing the formation of defects and improving the surface morphology, which can enable the development of high‐performance GaN‐based devices on non‐polar surfaces. [ABSTRACT FROM AUTHOR]

In this study, GaN m‐plane Schottky barrier diodes are fabricated by metalorganic vapor‐phase epitaxy (MOVPE) on several off‐angle gallium nitride (GaN) substrates, and the off‐cut angle dependence of impurity incorporation is investigated. We show that the MOVPE layer on the substrate inclined 5° toward the [000–1] direction has extremely low impurity incorporation. These results provide important suggestions for the fabrication of m‐plane power devices. [ABSTRACT FROM AUTHOR]

A gallium nitride (GaN) epitaxial layer with a low density of threading dislocations is successfully grown on a silicon substrate by using in situ gas etching. Silicon nitride (SiNx) film is used as a mask, and ammonia is intermittently supplied in hydrogen ambient during the etching. After etching, high‐density deep pits appeared on the surface of a GaN template layer and corresponded to the threading dislocations in the layer. In this novel method, before growing an additional GaN layer on the template GaN layer, a second SiNx layer is deposited after the etching process, and this layer prevents GaN nuclei from growing on the upper side‐walls of the pits. By using this method, the density of threading dislocations of the GaN surface is reduced to 6.7 × 107 cm−2. This method is cost effective, completing all the necessary processes in one growth run without taking samples out from a metalorganic chemical vapor deposition (MOCVD) reactor. [ABSTRACT FROM AUTHOR]

Dislocations that cause a reverse leakage current in vertical p-n diodes on a GaN free-standing substrate were investigated. Under a high reverse bias, dot-like leakage spots were observed using an emission microscope. Subsequent cathodoluminescence (CL) observations revealed that the leakage spots coincided with part of the CL dark spots, indicating that some types of dislocation cause reverse leakage. When etch pits were formed on the dislocations by KOH etching, three sizes of etch pits were obtained (large, medium, and small). Among these etch pits, only the medium pits coincided with leakage spots. Additionally, transmission electron microscopy observations revealed that pure screw dislocations are present under the leakage spots. The results revealed that 1c pure screw dislocations are related to the reverse leakage in vertical p-n diodes. [ABSTRACT FROM AUTHOR]

We investigate the influence of crystal defects on p-type GaN grown by metalorganic vapor phase epitaxy. Sets of p-type GaN films were grown on sapphire substrates and on free-standing GaN (F-GaN) substrates simultaneously using various Et-Cp2Mg flow rates. Although there is a difference of two orders of magnitude between the threading dislocation densities of p-type GaN grown on sapphire and F-GaN substrates, there is no significant difference in hole concentration. However, there are problems with the surface morphology of p-type GaN grown on sapphire. The deterioration of the surface was caused by the difference in nanopipe density. The electrical properties of a p-n junction diode formed on sapphire with a high density of nanopipes were observed using emission microscopy under both forward- and reverse-bias conditions. Our results demonstrate that the nanopipes are electrically inactive, and that other types of threading dislocation have more influence on the current-voltage characteristics. [ABSTRACT FROM AUTHOR]

In this study, GaN m-plane Schottky barrier diodes fabricated with a metalorganic vapor-phase epitaxy on a GaN substrate were investigated using emission microscope, photoluminescence, and cathodoluminescence. In addition, facet dependence of leakage current under reverse-biased condition was observed. We showed that the leakage-current distribution was caused by the facet dependence of the carrier concentration and oxygen concentration. These results can provide important suggestions for the fabrication of m-plane devices. (a) four-faceted hillocks on m-plane GaN MOVPE sample, facet dependence of (b) leakage current and (c) PL peak intensity of the m-plane GaN Schottky barrier diode. [ABSTRACT FROM AUTHOR]

Injecting current with a uniform carrier concentration is important for applications with three-dimensional architectures such as vertical power devices or displays. In III-nitride nanostructures, dopants not only incorporate differently depending on the surface orientation but can also seriously affect the kinetic equilibrium shapes of the nanorods. Herein, we report selective-area growth of doped GaN nanorods grown by pulsed-mode metalorganic chemical vapor deposition. Two dopants, Si and Mg, were employed as donor and acceptor atoms, respectively, for a mono-doping approach. Furthermore, a mixed flow of Si and Mg was supplied for a co-doping approach. We compared the morphological effects and growth rates of each doped GaN nanorod array. Then, we proposed appropriate growth mechanisms for the doped GaN nanorods on the basis of our structural characterizations. These results might extend the morphological functionality of GaN nanorods by including doping and may also provide an appropriate foundation for the design of nanostructure-based electronic or photonic devices. [ABSTRACT FROM AUTHOR]

This article combines two papers, “Nobel Lecture: Growth of GaN on sapphire via low-temperature deposited buffer layer and realization of p-type GaN by Mg doping followed by low-energy electron beam irradiation,” Rev. Mod. Phys., 87 (2015) 1133, and “MOCVD of nitrides,” Handbook of Crystal Growth Second Edition, Volume III, Part A, Chapter 16, Elsevier, 683–704, 2015. For more detailed information, please read the two original papers. [ABSTRACT FROM AUTHOR]

This Review is a personal reflection on the research that led to the development of a method for growing gallium nitride (GaN) on a sapphire substrate. The results paved the way for the development of smart display systems using blue LEDs. The most important work was done in the mid to late 80s. The background to the author's work and the process by which the technology that enables the growth of GaN and the realization of p-type GaN was established are reviewed. [ABSTRACT FROM AUTHOR]

This is a personal history of one of the Japanese researchers engaged in developing a method for growing GaN on a sapphire substrate, paving the way for the realization of smart television and display systems using blue LEDs. The most important work was done in the mid to late 1980s. The background to the author's work and the process by which the technology enabling the growth of GaN and the realization of p-type GaN was established are reviewed. [ABSTRACT FROM AUTHOR]

A set of GaN/GaInN single quantum wells (SQWs) were grown on c-plane GaN/sapphire templates using metal organic vapor phase epitaxy (MOVPE) and atomic layer epitaxy (ALE). The structural information on the interfaces and surfaces was obtained by fitting the experimental X-ray spectra and was compared between MOVPE and ALE mode. The X-ray crystal truncation rod (CTR) scattering measurement results showed that the samples grown by ALE had sharper interfaces than those grown by MOVPE. Both the X-ray reflectivity (XRR) curve-fitting results and atomic force microscope (AFM) results indicated that the surfaces of the ALE-grown SQWs were smoother than those of MOVPE-grown SQWs. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

To achieve both the reduction of threading dislocation density (TDD) and the enhancement of light extraction efficiency (LEE) of light-emitting diodes (LEDs), a two-directional stripe-patterned sapphire substrate (TPSS) was fabricated. First, a stripe pattern parallel to the a-axis of Al2O3 was formed on an as-received c -sapphire wafer and then a second stripe pattern rotated around 3° from the m-axis of Al2O3 was formed on the first stripe PSS. The light output power of TPSS LEDs was around 1.25 times higher than that of LEDs on a flat sapphire substrate. This enhancement is caused by the increase of both the internal quantum efficiency (IQE) and the LEE. On the other hand, although the LED on TPSS with the second stripe just parallel to the m-axis of Al2O3 showed a similar enhancement ratio of the light output power, the current leakage of this LED increased with the concentration of threading dislocations on the surface of LEDs. Stripes rotated 3° from the m-axis of Al2O3 changed the growth mode and realized GaN films with a smooth surface without pit formation. Therefore, the misalignment of the stripe from the m-axis of Al2O3 will become a new design parameter for realizing high-efficiency reliable LEDs. (© 2014 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

We investigated dislocation density dependence on stimulated emission characteristics of AlGaN/AlN multiquantum wells (MQWs: emission wavelength of approximately 285 nm) on AlN templates with various dislocation densities. We found that the stimulated emission characteristics of the deep UV MQWs were strongly dependent on the dislocation densities. A reduction of the dislocation densities is very important in order to realize good stimulated emission characteristics of deep UV MQWs. (© 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [ABSTRACT FROM AUTHOR]

The growth of GaN on sapphire by OMVPE using a low-temperature deposited buffer layer was characterized by in situ TEM observation. The crystalline quality, especially tilting and twisting of the mosaic GaN crystal, was characterized by conventional X-ray diffraction together with grazing-incidence X-ray diffraction. Strain and relaxation of the AlGaN and GaInN on GaN were also characterized by asymmetrical X-ray diffraction. © 1998 Scripta Technica, Electron Comm Jpn Pt 2, 81(10): 48–54, 1998 [ABSTRACT FROM AUTHOR]

Numerical simulations are a valuable tool for the design and optimization of crystal growth processes because experimental investigations are expensive and access to internal parameters is limited. These technical limitations are particularly large for ammonothermal growth of bulk GaN, an important semiconductor material. This review presents an overview of the literature on simulations targeting ammonothermal growth of GaN. Approaches for validation are also reviewed, and an overview of available methods and data is given. Fluid flow is likely in the transitional range between laminar and turbulent; however, the time-averaged flow patterns likely tend to be stable. Thermal boundary conditions both in experimental and numerical research deserve more detailed evaluation, especially when designing numerical or physical models of the ammonothermal growth system. A key source of uncertainty for calculations is fluid properties under the specific conditions. This originates from their importance not only in numerical simulations but also in designing similar physical model systems and in guiding the selection of the flow model. Due to the various sources of uncertainty, a closer integration of numerical modeling, physical modeling, and the use of measurements under ammonothermal process conditions appear to be necessary for developing numerical models of defined accuracy. [ABSTRACT FROM AUTHOR]

A low voltage (−20 V) operating high-energy (5.48 MeV) α-particle detector with a high charge collection efficiency (CCE) of approximately 65% was observed from the compensated (7.7 × 1014 /cm3) metalorganic vapor phase epitaxy (MOVPE) grown 15 µm thick drift layer gallium nitride (GaN) Schottky diodes on free-standing n+-GaN substrate. The observed CCE was 30% higher than the bulk GaN (400 µm)-based Schottky barrier diodes (SBD) at −20 V. This is the first report of α–particle detection at 5.48 MeV with a high CCE at −20 V operation. In addition, the detectors also exhibited a three-times smaller variation in CCE (0.12 %/V) with a change in bias conditions from −120 V to −20 V. The dramatic reduction in CCE variation with voltage and improved CCE was a result of the reduced charge carrier density (CCD) due to the compensation by Mg in the grown drift layer (DL), which resulted in the increased depletion width (DW) of the fabricated GaN SBDs. The SBDs also reached a CCE of approximately 96.7% at −300 V. [ABSTRACT FROM AUTHOR]

We have succeeded in growing crack-free AlN of even 0.5 μm thickness on GaN by metalorganic vapor phase epitaxy. A (0001) sapphire substrate was used. Crack-free AlN was grown on GaN at 1000 °C with N[sub 2] carrier gas. An AlN layer was grown on GaN of 2 μm thickness grown at 1050 °C, following the low-temperature deposition of an AlN buffer layer of 30 nm. No cracks were observed in the microphotographs of AlN on GaN grown using N[sub 2]. X-ray diffraction analysis revealed that AlN/GaN superlattices (SLs) were coherently grown on GaN, and satellite peaks up to the third order were observed. The structure of AlN/GaN SLs on GaN showed a maximum electron mobility of 1580 cm[sup 2]/V s at room temperature and a nominal sheet carrier density of 8.4×10[sup 12] cm[sup -2]. © 2001 American Institute of Physics. [ABSTRACT FROM AUTHOR]

Studies the effects of isoelectronic indium (In) doping on the crystalline and optical properties of gallium nitride (GaN) grown on sapphire with hydrogen or nitrogen carrier gas by metalorganic vapor phase epitaxy. Relationship between lattice constants obtained by x-ray diffraction analysis; Increase of trimethylindium flow during growth.

Gallium Nitride: Influence of Temperature-Dependent Substrate Decomposition on Graphene for Separable GaN Growth (Adv. Keywords: gallium nitride; graphene; MOCVD; substrate decomposition Gallium nitride, graphene, MOCVD, substrate decomposition. [Extracted from the article]

Graphene has been adopted in III−V material growth since it can reduce the threading dislocations and the III−V epilayer can easily be separated from the substrate due to the weak chemical bond. However, depending on the substrate supporting the graphene, some substrates decompose in the III−V material growth environment, which results in the problem that no graphene remains. In this study, the influence of temperature‐dependent substrate decomposition on graphene through an annealing process that resembles conventional growth conditions in metal–organic chemical vapor deposition (MOCVD) is investigated. It is also confirmed that trimethylgallium, hydrogen, and ammonia gases do not directly affect the graphene loss through gallium nitride (GaN) growth on a graphene/sapphire. In addition, GaN grown on graphene/sapphire could separate, but GaN grown on a graphene/GaN template could not be separated due to GaN template decomposition and related graphene damage. Through further investigation for graphene/gallium arsenide, it is deduced that the gallium generated by substrate decomposition does not play a major role in damage to the graphene but instead the nitrogen generated by substrate decomposition is closely related to it. These results suggest that it is very important to adopt a decomposition‐free substrate that do not damage graphene during GaN growth in MOCVD. [ABSTRACT FROM AUTHOR]

Review: personal account of the background of the studies that led to the technologies for growing GaN and producing p-GaN; 61 refs. [ABSTRACT FROM AUTHOR]