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We investigate the vertical leakage mechanism in metal–organic chemical vapor deposition-grown carbon (C)-doped AlGaN/GaN High Electron Mobility Transistors (HEMTs) on 6-in silicon wafer. Substrate bias polarity-dependent ${I}$ – ${V}_{s}$ , temperature-dependent fitting, and band diagram analysis pointed to the Poole–Frenkel (P–F) type of conduction mechanism for vertical transport in the devices with breakdown as high as 580 V for a buffer of $\textsf {4}~\mu \text{m}$ . Trap activation energy of 0.61 eV was estimated from the P–F fitting which matches well with values reported in the literature. We propose that higher dislocation density leads to shallower traps in the buffer and build an analytical model of dislocation-mediated vertical leakage around this. The variation in leakage as a function of dislocation density at a given field is predicted and is found to be the most abrupt in the range from $\sim 10^{\textsf {7}}$ to $\sim 10^{\textsf {9}}$ cm $^{-\textsf {2}}$ of dislocation density. This can be attributed to a sharp decrease in trap activation energy in the above range of dislocation density, possibly due to complex formation between point defects and dislocations.

We report on the growth of crystalline κ-Ga2O3 using mist-chemical vapor deposition (CVD) on (0001) sapphire. The κ-phase was confirmed using high-resolution x-ray diffraction (XRD) θ-2θ scan and pole figure-scan of (122) reflex, respectively, while an on-axis full width at half maximum (FWHM) of 104 arcsec was measured in symmetric rocking curve scan. Further, the heteroepitaxial film was analyzed using a mosaic crystal model employing reciprocal space maps (RSM) and a series of asymmetric rocking curve scans. A bandgap of 5.1 eV and excitonic binding energy of 85 meV were estimated from absorption measurements. Built-in field, depletion width, and doping density level were extracted from parabolic WKB model fit. Cathodoluminescence (CL) spectroscopy revealed a defect peak at 329 nm, which was found to be blue-shift with increasing excitation energy, indicating a possible donor-acceptor pair (DAP) transition. Temperature-dependent Current–voltage (I–V) study was performed to extract Schottky barrier height ( Φ B ) and ideality factor (η), which were found to be correlated with temperature. Photodetectors fabricated on the sample exhibited pure solar-blind characteristics.

In this work, we show that a bilayer SiN x passivation scheme which includes a high-temperature annealed SiN x as gate dielectric, significantly improves both ON and OFF state performance of AlGaN/GaN metal insulator semiconductor high electron mobility transistors (MISHEMTs). Surface and bulk leakage paths were determined from devices with different SiN x passivation schemes. Temperature-dependent mesa leakage studies showed that the surface conduction could be explained using a 2D variable range hopping mechanism; this is attributed to the mid-gap interface states at the GaN(cap)/SiN x interface generated due to the Ga–Ga metal like bonding states. It was found that the high temperature annealed SiN x gate dielectric exhibited the lowest interface state density and a two-step C–V indicative of a superior quality SiN x /GaN interface as confirmed from conductance and capacitance measurements. High-temperature annealing helps form Ga–N bonding states, thus reducing the shallow metal-like interface states. MISHEMT measurements showed a significant reduction in gate leakage and a four-orders of magnitude improvement in the ON/OFF ratio while increasing the saturation drain current (I DS) by a factor of 2. Besides, MISHEMTs with two-step SiN x passivation exhibited a relatively flat transconductance profile, indicating lower interface states density. The dynamic R on with gate and drain stressing measurements also showed about 3× improvements in devices with bilayer SiN x passivation.

We report on the band offset and interfacial electronic properties of e-beam evaporated HfO2 gate dielectrics on III-nitride device stacks on Si. A conduction band offset of 1.9 eV is extracted for HfO2/GaN along with a very low density of fixed bulk and interfacial charges for optimally annealed samples. Normally-ON HfO2/AlGaN/GaN metal–insulator–semiconductor high-electron-mobility transistors exhibit negligible shifts in threshold voltage, transconductances of 120 mS/mm for 3- $\mu \text{m}$ gate length devices, and three-terminal off-state gate leakage currents of 55 nA/mm at a ${V}_{D}$ of 100 V. Dynamic capacitance dispersion measurements in the temperature range of 25 °C–200 °C show two peaks at the AlGaN/GaN interface corresponding to slow and fast interface traps with a peak ${D}_{\text {it}}$ of ${5.5}\times {10}^{13}$ and ${1.5} \times {10}^{13}$ eV−1cm−2 respectively as a function of Fermi level position above ${E}_{C}$ . The HfO2/AlGaN interface exhibits a reasonably constant peak ${D}_{\text {it}}$ of ${2} \times {10}^{13}$ – ${4.4} \times {10}^{13}$ eV−1cm−2 at trap levels of 0.42–0.72 eV below ${E}_{\text {C}}$ . Hysteretic pulsed $I_{D}$ – $V_{G}$ measurements revealed a negative shift in threshold voltages indicative of unoccupied donor-like trap states at the HfO2/AlGaN interface and comparable ${D}_{\text {it}}$ to that inferred from conductance measurements.

We report on a billion-fold reduction in reverse-bias leakage current density (11.3 A/cm(2) to 8.5 nA/cm(2 )at 20 V) across Schottky contacts made to Al0.50Ga0.50N epilayers grown on sapphire. Interdigitated back-to-back Ni/Au Schottky contacts were made to unintentionally doped Al0.50Ga0.50N epilayers grown by metal organic chemical vapor deposition to realize photodetectors with metal-semiconductor-metal geometry. Testing on a self-con-sistent series of samples grown under different conditions revealed that a two-order reduction in screw dislocation density is primarily responsible for the significant reduction in the lateral leakage (dark) current. This observation is validated by conducive atomic force microscopy experiments. Analytical modelling by temperature-dependent current-voltage measurements confirm a screw dislocation mediated carrier transport mechanism. The anomalously high reverse-bias leakage current (mu A-mA) in the highly defective samples is found to be dominated by thermionic field emission (TFE) at low biases and Poole-Frenkel emission (PFE) from a deep donor level at high biases. With a significant improvement in the crystalline quality, a solar-blind photodetector with an EQE of 47%, photo/dark current ratio of 1.4 x 10(5) and transient characteristics of < 20 ms is demonstrated. This study towards understanding the leakage in Al0.50Ga0.50N is expected to benefit the development of various deep-UV devices and GaN-AlGaN based power transistors.

In this work, we have investigated the material properties of PECVD (Plasma Enhanced Chemical Vapor Deposition) amorphous Silicon nitride (SiN) films and the influence of deposition conditions on gate-leakage increase of AlGaN/GaN HEMT’s (High Electron Mobility Transistor) after passivation. We have studied the effect of gas flow ratio (SiH4/NH3) on the structural and compositional properties of SiNx deposited on crystalline Silicon (Si). Based on the inference, electrical properties of the SiNx films were examined by depositing on AlGaN/GaN HEMT as a passivation layer. The optimized SiNx which is N-rich with a refractive index of 1.83, tensile stress of 681 MPa and NH3/SiH4 ratio of 18 shows only a 1.2x variation in gate leakage, 1.4x increase in gm, minimum left shift of 0.03 V in Vth and 1.26x increase Ion/Ioff ratio after passivation. We believe that the 3x reduction in Si-H bonds resulting in reduced interface traps at SiN/AlGaN interface is the reason for the minimal increase in gate leakage after passivation.

We report on the characterization of the interfaces of Al2O3/InAlN/GaN HEMT structure grown on 200 mm diameter silicon using conductance dispersion technique. Irreversible threshold voltage (VTH) shift of up to +similar to 2.5 V was observed due to the gate stress induced activation of acceptor states. Further, frequency dependent VTH shift during capacitance voltage measurements were also recorded due to the presence of slow traps at InAlN/GaN interface. The conductance dispersion indicated the presence of acceptor traps of the order of similar to 4 x 10(12) to 7 x 10(13) cm(-2) eV(-1) with a time constant of similar to 10 to 350 ls at the InAlN/GaN interface. Trap density at the Al2O3/InAlN was found to be in similar range but with a time constant of similar to 2 ms. The presence of high density of traps at InAlN/GaN interface is attributed to the unavoidable growth interruption before the start of InAlN growth. (C) 2017 Elsevier Ltd. All rights reserved.

In this report, we demonstrate dual band vertical heterojunction photodetector realized by integrating α-In2Se3 with p-type GaN. Flakes of ∼ 110 nm thickness were exfoliated on MOCVD grown p-GaN on silicon substrate. Devices showed two distinct detection peaks in spectral responsivity, one at 365 nm and another at 850 nm, corresponding to band edges of GaN and α-In2Se3 respectively, with considerable rejection in visible spectrum. Normalised responsivity values were found out to be ∼70 mA/W at both 365 nm and 850 nm for the bias of -3V along with photo-to-dark current ratio of ∼665 and ∼75 in that order. The Devices also showed fast transient response with no persistent photoconductivity (PPC). The specific detectivity values estimated were ∼1011 Jones and ∼1010 Jones corresponding to illumination at 365 nm and 850 nm, respectively. Device showed ∼0.4 dependence on incident power at 365 nm. The device performance, post annealing was also studied. This study is expected to pave the way for new type of optoelectronic devices by integrating direct bandgap layered material like α-In2Se3 and wide bandgap semiconductors.

We report on a multi‐layer MoS2‐based low power synaptic transistor using Ta2O5 as a back‐gate dielectric for mimicking the biological neuronal synapse. The use of high‐k dielectric allows for a lower voltage swing compared to using conventional SiO2, thus offering an attractive route to low‐power synaptic device architectures. Exfoliated MoS2 is utilized as the channel material and the hysteresis in the transfer characteristics of the transistor is exploited to demonstrate Excitatory and Inhibitory postsynaptic currents, long term potentiation and depression (LTP/LTD), indirect Spike Timing Dependent Plasticity (STDP) based on single and sequential gate (Vg) pulses respectively. The synapse had achieved a 35% weight change in channel conductance within 15 electrical pulses for negative synaptic gate pulse and 28% change for positive synaptic gate pulse. We also demonstrate complete tunability of weight in the synapse by Spike Amplitude dependent plasticity (SADP) at a low voltage of 4V This article is protected by copyright. All rights reserved.

A new method for the separation of contact resistance ( $R_{\mathrm {contact}})$ into Schottky barrier resistance ( $R_{\mathrm {SB}})$ and interlayer resistance ( $R_{\mathrm {IL}})$ is proposed for multilayered MoS2 FETs. While $R_{\mathrm {SB}}$ varies exponentially with Schottky barrier height ( $\Phi _{\mathrm {bn}})$ , $R_{\mathrm {IL}}$ essentially remains unchanged. An empirical model utilizing this dependence of $R_{\mathrm {contact}}$ versus $\Phi _{\mathrm {bn}}$ is proposed and fits to the experimental data. The results, on comparison with the existing reports of lowest $R_{\mathrm {contact}}$ , suggest that the extracted $R_{\mathrm {IL}}$ (1.53 $\text{k}\Omega ~\cdot ~\mu \text{m}$ ) for an unaltered channel would determine the lower limit of intrinsic $R_{\mathrm {contact}}$ even for barrierless contacts for multilayered exfoliated MoS2 FETs.

We report on crystalline quality-to-device performance correlation for self-powered Al0.40Ga0.60N, p-i-n ultraviolet (UV) photodetectors on c-plane sapphire. The active p-i-n detector stack was grown over an AlN buffer. Careful optimization of the nucleation density on growth surface helped achieve a two-orders and one-order of magnitude reduction in the screw and edge dislocation density in the buffer layer, respectively. This resulted in a nine-orders of magnitude reduction in the reverse leakage current from 4.3 mA to 4.2 pA (at 10 V). Correspondingly, a thirteen-fold enhancement in the zero-bias external quantum efficiency (EQE) from 3.4 to 45.5, when measured under 289 nm front-illumination was also observed. The detector epi-stack grown over the optimal AlN buffer layers led to the realization of high-performance p-i-n detectors with a dark current density below 4 nA cm-2 at 10 V and a zero-bias EQE of 74.7 under back-illumination. This is one of the highest zero-bias EQE reported for solar-blind detectors realized on template-free and mask-free III-nitrides grown using metal organic chemical vapor deposition on any substrate. The deep-UV-to-visible rejection ratio exceeded 106 while the deep-UV-to-near UV rejection exceeded 103. The thermal-noise limited detectivity was estimated to be 4 1014 cm Hz1/2 W-1. Hopping conduction along screw dislocation-mediated localized trap states was found to be the dominant carrier transport mechanism in the samples exhibiting high reverse leakage. For these samples, the responsivity (photocurrent) exhibited an exponential variation with reverse bias and a nonlinear variation with input optical power. This is explained using a hole-trapping associated gain mechanism and its impact on the transient characteristics of the detectors is investigated. A 6 1 linear array of the highest EQE detectors was realized and detector performance parameters were found to be comparable before and after wire bonding. This study is expected to enhance the understanding of III-nitrides-based vertical, self-powered detectors and benefit the development of high-performance, focal plane arrays using less complicated growth techniques. © 2020 IOP Publishing Ltd.

Herein, device demonstration based on vertical transport in multilayer I±-In2Se3 is reported. Photodetectors realized using a metal/I±-In2Se3/indium tin oxide (ITO) vertical junction exhibit clear signature of the band edge in spectral responsivity. The wavelength at 680 nm corresponding to an ultrahigh responsivity of 1000 A Wâ��1 and a detectivity of >1013 cm Hz0.5 Wâ��1 at a bias of 0.5 V. The variation of responsivity and detectivity with optical power density is studied, and a transient response of 20 ms is obtained for the devices (instrument limitation). In addition, an asymmetric barrier height arising out of ITO and Au contacts to a vertical I±-In2Se3 junction resulted in a photovoltaic effect with VOC â��0.1 V and ISC â��0.4 I¼A under an illumination of 520 nm.

In this letter, we report on a unique device design strategy for increasing the breakdown voltage and hence Baliga Figure of Merit (BFOM) of III-nitride HEMTs by engineering the gate edge towards the drain. The breakdown of such devices with meandering gate-drain access region (M-HEMT) are found to be 62% more compared to that of conventional HEMT while the ON resistance suffers by 76%, leading to an overall improvement in the BFOM for by 28%. 3D-TCAD simulations show that the decrease in the peak electric field at the gate edge was responsible for increased breakdown voltage.

A buried channel normally-off AlGaN/GaN MOS-HEMT with gate recess etching is reported. The buried channel operation is achieved by in situ doping of GaN to introduce a p-n junction in the GaN buffer. The fabricated buried channel MOS-HEMT with 12.5 nm atomic layer deposition (ALD) Al2O3 gate dielectric featured a threshold voltage of 1.3 V with a drain saturation current of 287 mA mm(-1) for a device with 3.5 mu m long gate length and 11 mu m sourcedrain spacing. The field effect mobility improved from 25 cm(2)/Vs for a reference device to 142 cm(2)/Vs for the buried channel device. Due to the presence of the p-n junction depletion region in the GaN buffer, the leakage in the off state decreased by about 4 orders of magnitude (4 nA mm(-1) compared to 76 uA mm(-1) for the reference device). The buried channel device also gives better breakdown characteristics, with a breakdown voltage of 158 V compared to 98 V for the reference device.

Leakage mediated by GaN buffer traps is identified and studied using a novel characterization technique. Through back-gating measurement, the effect of buffer trap states on the lateral leakage is determined by probing mesa-isolated Ohmic pads. Time-dependent leakage measurements are carried out to study the extent of the increase in buffer leakage due to the traps. It is observed that the mesa leakage is more prominent at very slow sweep rates and high substrate bias. The temperature-dependent measurements show that the mesa leakage and the substrate leakage are characterized by thermionic emission from the traps with an activation barrier of 0.34 and 0.2 eV, respectively.

We report on the demonstration of UV/visible and UV/near-IR photodetectors of high spectral responsivity (SR) in a non-conventional heterojunction, realized by combining multi-layered materials with wide band gap Gallium Nitride (GaN). Multi-layer MoS2 and β-In2Se3 flakes were exfoliated separately on epitaxial GaN-on-sapphire, followed by fabrication of photodetectors in a lateral inter-digitated metal semiconductor metal geometry with Ti/Au contacts. Devices exhibited distinct steps in SR graph at 365 nm with responsivity value of 127 A W−1 and at ~685 nm with responsivity value of 33 A W−1 for MoS2/GaN heterostructure. Whereas, similar steps exhibited at 365 nm with responsivity value of 1.6 A W−1 and at ~850 nm with responsivity value of 0.03 A W−1 in case of β-In2Se3/GaN heterostructure. The wavelength dependent I–V characteristics showed photo-to-dark current ratio of ~30 at 685 nm in case of MoS2/GaN heterostructure and ratio of ~2 at 850 nm for β-In2Se3/GaN heterostructure. The reasons which limit the performance of the devices were also investigated using transient analysis and power dependent responsivity analysis. In summary, current work paves the way for futuristic layered-materials/3D heterostructure devices.

In this paper, a epitaxial design of InAlN/AlN/InGaN/GaN high electron mobility transistors (HEMTs), considering the vital aspects related to its device exploration is proposed. Mobility of two dimensional electron gas in the proposed, practically viable structures of InxGa1-xN-channel (0.1 0.3.

An optical phonon limited velocity model has been employed to investigate high-field transport in a selection of layered 2D materials for both, low-power logic switches with scaled supply voltages, and high-power, high-frequency transistors. Drain currents, effective electron velocities and intrinsic cut-off frequencies as a function of carrier density have been predicted thus providing a benchmark for the optical phonon limited high-field performance limits of these materials. The optical phonon limited carrier velocities of a selection of transition metal dichalcogenides and black phosphorus are found to be modest as compared to their n-channel silicon counterparts, questioning the utility of these devices in the source-injection dominated regime. h-BN, at the other end of the spectrum, is shown to be a very promising material for high-frequency high-power devices, subject to experimental realization of high carrier densities, primarily due to its large optical phonon energy. Experimentally extracted saturation velocities from few-layer MoS2 devices show reasonable qualitative and quantitative agreement with predicted values. Temperature dependence of measured vsat is discussed and found to fit a velocity saturation model with a single material dependent fit parameter., Comment: 8 pages, 6 figures

We investigate the effects of quantum capacitance in an N-polar GaN/AlGaN/GaN heterostructures by directly measuring quantum displacement of the electron wavefunction Δd. A comparison between electrically and microscopically measured thicknesses showed negative quantum displacement effects in the inverted high-electron-mobility-transistor (HEMT) structure. As a result of the quantum capacitance effects, a quantum displacement Δd of ~ -4nm was extracted from the measurements. Further analysis using 1-D self-consistent Schrodinger-Poisson solver has been done to validate the measured data. Our simulation results, including multiple-subband occupancy, explain the increasing capacitance in the measured C-V profile in N-polar GaN-based HEMTs.

Transistor Z. C. Yang, D. N. Nath, and S. Rajan Department of Electrical and Computer Engineering, The Ohio State University Columbus, OH, 43210 Phone: (614)-717-8245 | E-mail: yangzh@ece.osu.edu In this work, we use ballistic quantum transport in a III-nitride to realize room temperature negative differential resistance (NDR) in a GaN-based Tunneling Hot Electron Transistor. The results showed reproducible double-sweep characteristics, with peak-to-valley ratio (PVCR) of 7.2 and peak current density (PCD) about 143 A/cm. This is the first report of repeatable room temperature negative differential resistance in a III-nitride device. GaN-based materials have attracted considerable interests because of several advantages such as larger band gap, larger conduction band offset, better thermal stability, and higher breakdown field. In the reported GaN-based RTDs, reproducibility has been poor and the reverse-sweep NDR is usually not observed. The results are highly influenced by dislocation density, interface roughness and particularly polarization effect. In this work, we show that repeatable NDR can be measured at room temperature in a GaN-based tunneling hot electron transistor[1]. In a tunneling hot electron transistor, electrons are injected from the emitter across the base. The collector barrier forms a high pass filter for the injected hot electrons. When the injected electrons have lower energy than the collector barrier, the flow into the base. When the injected energy exceeds the collector barrier, they flow ballistically into the collector, inducing NDR in the base current. We have done detailed Monte Carlo simulations of transport in this device, and find that ballistic transport across thin base layers (< 7 nm) can enable coherent quantum phenomena to be observed. The investigated epitaxial structure consists of a 3.8 nm Al0.6Ga0.4N emitter tunneling barrier, a 22 nm n+ GaN base transit layer (Si doping on the order of 10 cm), and a collector barrier of 5.3/7.9/9 nm AlxGa1-xN (graded from 30% to 15%)/Al0.3Ga0.7N/AlxGa1-xN (graded from 50% to 32%), as confirmed by XRD ω-2θ scan. The structure was grown in Ga-rich conditions by plasma-assisted MBE on free-standing GaN substrates (St. Gobain, n-type doped, TDD ~5x10 cm). Devices have an emitter contact of Ti/Au/Ni (20/50/30 nm), and two base contacts of Al/Ni/Au/Ni (20/20/50/30 nm). The active emitter area is about 12 μm, and mesa area around 100 μm. The investigated structure shows low base-collector leakage, moderate emitter-base injection current, ohmic base-base characteristic. High composition tunneling barrier is applied to narrow the electron energy distribution and reduce percolative transport in low composition barrier, which is important for the observation of NDR. The devices were measured by sweeping emitter bias with both base and collector grounded. At baseemitter bias from 1.5 to 2.8 V, the I-V characteristics shows PVCR of 7.2, and PCD of 143 A/cm at 1.5 V. The repeatability is demonstrated by multiple forward and reverse sweeps, with different voltage steps. The voltage at which NDR emerges is consistent among different devices, and is close to the collector barrier height, which is also expected from the energy distribution. The good repeatability and double-sweep characteristics indicate the potential of such device in high frequency applications We acknowledge funding from ONR N00014-11-1-0721 DATE MURI (Program manager: Dr. Paul Maki).

We have investigated the electron transport phenomena in large area chemical vapor deposition (CVD) grown epitaxial MoS 2 on sapphire with in-plane and out of plane crystallinity over centimeter length scales. The high quality of these films leads to record high room temperature electron mobility of 192 cm 2 /Vs and high current density (> 150 mA/mm). The transport measurements are in good agreement with theoretical predictions of scattering and anisotropy in effective mass. This is the first report of synthetic few layer MoS 2 with longrange crystalline order, and mobility approaching theoretical limits.

Hysteresis in channel conductance is commonly observed on graphene field effect transistors. Although consistent and repeatable hysteresis could possibly be attractive for memory based applications, it is detrimental to the deployment of graphene in high speed electronic switches. While the origin of such hysteresis has been variously attributed to graphene-insulator interface traps, adsorbed molecules and bulk charges in the dielectric, its dependence on the quality of the graphene has been largely unexplored. Since, CVD is the most promising synthesis route for large area graphene and defects in such a growth process are inevitable, it is important to understand the influence of the quality of graphene on hysteresis. Here we demonstrate, for the first time, the effect of graphene growth defect density on device hysteresis. By intentionally tailoring the defect densities in the growth phase, we demonstrate a linear correlation between the film defect density and conductance hysteresis. The trap charge density calculated from the observed hysteresis in the electrical transfer characteristics was found to both follow the same qualitative trend, and give reasonable quantitative agreement with the defect density as extracted from Raman spectroscopy. Most importantly, by extrapolation from the observed behavior, we identify the intrinsic limits of hysteresis in graphene-SiO2 system, demonstrating that the defects in graphene contribute to traps over and above the baseline set by the SiO2 surface trap charge density.

We studied orientation dependent transport in vicinal N-polar AlGaN/GaN heterostructures. We observed significant anisotropy in the current carrying charge parallel and perpendicular to the miscut direction. A quantitative estimate of the charge anisotropy was made based on gated TLM and Hall measurements. The formation of electro-statically confined one-dimensional channels is hypothesized to explain charge anisotropy. A mathematical model was used to verify that polarization charges distributed on miscut structure can create lateral one-dimensional confinement in vicinal substrates. This polarization-engineered electrostatic confinement observed is promising for new research on low-dimensional physics and devices besides providing a template for manufacturable one-dimensional devices.

Heterostructures of two-dimensional (2D) layered materials are increasingly being explored for electronics in order to potentially extend conventional transistor scaling and to exploit new device designs and architectures. Alloys form a key underpinning of any heterostructure device technology and therefore an understanding of their electronic properties is essential. In this paper, we study the intrinsic electron mobility in few-layer MoxW1-xS2 as limited by various scattering mechanisms. The room temperature, energy-dependent scattering times corresponding to polar longitudinal optical (LO) phonon, alloy and background impurity scattering mechanisms are estimated based on the Born approximation to Fermi's golden rule. The contribution of individual scattering rates is analyzed as a function of 2D electron density as well as of alloy composition in MoxW1-xS2. While impurity scattering limits the mobility for low carrier densities (

Room temperature negative differential resistance is demonstrated in a unipolar GaN-based tunneling hot electron transistor. Such a device employs tunnel-injected electrons to vary the electron energy and change the fraction of reflected electrons, and shows repeatable negative differential resistance with a peak to valley current ratio of 7.2. The device was stable when biased in the negative resistance regime and tunable by changing collector bias. Good repeatability and double-sweep characteristics at room temperature show the potential of such device for high frequency oscillators based on quasi-ballistic transport.

We report on the vapor-solid growth of single crystalline few-layer MoS2 films on (0001)-oriented sapphire with excellent structural and electrical properties over centimeter length scale. High-resolution X-ray diffraction scans indicated that the films had good out-of-plane ordering and epitaxial registry. A carrier density of ∼2 × 1011 cm−2 and a room temperature mobility of 192 cm2/Vs were extracted from space-charge limited transport regime in the films. The electron mobility was found to exhibit in-plane anisotropy with a ratio of ∼1.8. Theoretical estimates of the temperature-dependent electron mobility including optical phonon, acoustic deformation potential, and remote ionized impurity scattering were found to satisfactorily match the measured data. The synthesis approach reported here demonstrates the feasibility of device quality few-layer MoS2 films with excellent uniformity and high quality.

We investigate the energy levels of electron traps in AlGaN/GaN high electron mobility transistors by the use of electron tunneling spectroscopy. Detailed analysis of a typical spectrum, obtained in a wide gate bias range and with both bias polarities, suggests the existence of electron traps both in the bulk of AlGaN and at the AlGaN/GaN interface. The energy levels of the electron traps have been determined to lie within a 0.5 eV band below the conduction band minimum of AlGaN, and there is strong evidence suggesting that these traps contribute to Frenkel-Poole conduction through the AlGaN barrier.

We report on the growth of N-polar InxGa1−xN by N2 plasma-assisted molecular beam epitaxy. Ga-polar and N-polar InGaN films were grown at different growth temperatures and the composition was estimated by photoluminescence (PL) measurements. A growth model that incorporates the incoming and desorbing atomic fluxes is proposed to explain the compositional dependence of InGaN on the flux of incoming atomic species and growth temperature. The growth model is found to be in agreement with the experimental data. The peak PL intensity for N-face samples is found to exhibit a two order of magnitude increase for a 100 °C increase in growth temperature. Besides, at 600 nm, the N-face sample shows more than 100 times higher PL intensity than Ga-face sample at comparable wavelengths indicating its superior optical quality. The understanding of growth kinetics of InGaN presented here will guide the growth of N-polar InGaN in a wide range of growth temperatures.