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Start Over Descriptor "Packaging density" Publisher ieee computer society
14 results on '"Packaging density"'

1. Design for packageability: early consideration of packaging from a VLSI designer's viewpoint

Author

Dehkordi, Peyman H. and Bouldin, Donald W.

Subjects
Circuit Design, Chip Packaging, New Technique, Research and Development, Packaging Density, Multichip Module, Integrated circuit fabrication, Very-large-scale integration, Hybrid integrated circuits -- Design and construction, Integrated circuit fabrication -- Innovations, Very-large-scale integration -- Innovations
Published
1993

2. Overlay high-density interconnect: a chips-first multichip module technology

Author

Daum, Wolfgang, Burdick, William E., Jr., and Fillion, Raymond A.

Subjects
Multichip Module, Chip Packaging, New Technique, Technology, Research and Development, Packaging Density, Integrated circuit fabrication, General Electric Co. Research and Development Center -- Research, Hybrid integrated circuits -- Design and construction, Semiconductor industry -- Research, Integrated circuit fabrication -- Innovations
Published
1993

3. Trends in low-cost, high performance substrate technology

Author

Carey, David H.

Subjects
Substrates, Integrated circuit fabrication, Multichip Module, New Technique, Optimization, Packaging Density, Integrated circuit fabrication -- Methods, Packaging density (Electronics) -- Methods
Published
1993

4. Addressing the challenges of advanced packaging and interconnection

Author

Herrell, Dennis J.

Subjects
Packaging Density, Multichip Module, Substrates, Integrated circuit fabrication, New Technique, Miniaturization, Packaging density (Electronics) -- Innovations, Semiconductor industry -- Packaging, Integrated circuit fabrication -- Innovations
Published
1993

5. An MPGA-like FPGA

Author

Marple, David

Subjects
Circuit Design, Gate Arrays, Program Logic, New Technique, Scientific Research, Transistor, Packaging Density
Published
1992

7. A rapid-prototyping environment for digital-signal processors

Author

Hartley, Richard, Welles, Kenneth, II, Hartman, Michael, Chatterjee, Abhijit, Delano, Paul, Molnar, Barbara, and Rafferty, Colin

Subjects
Computer-Aided Design, Circuit Design, Digital Signal Processor, New Technique, Software Packages, Packaging Density, Prototype, Testing, Debugging, Technology, General Electric Co. -- Product information, GE Diodes (CAD system) -- Design and construction
Published
1991

8. Advanced packaging and interconnection technology

Author

Misunas, David

Subjects
Packaging Density, New Technique, Integrated circuit fabrication, Trends, Packaging density (Electronics) -- Innovations, Integrated circuits -- Design and construction, Semiconductor industry -- Packaging
Published
1993

9. Architecture-compiler synergism in GaAs computer systems

Author

Milutinovic, Veljko, Fura, David, Helbig, Walter, and Linn, Joseph

Subjects
Compiler/decompiler, RISC, Packaging Density, Miniaturization, Gallium Arsenide Semiconductor, Very-Large-Scale Integration, Processor Architecture, Computer Design
Published
1987

10. Systolic arrays - from concept to implementation

Author

Fortes, Jose A.B. and Wah, Benjamin W.

Subjects
Computer Systems, Pipelining, Parallel Processing, Processor Architecture, Computer Design, Array Processor, Implementation, Multiprocessing, Packaging Density, Trends, Future Technologies
Published
1987

11. Trends in advanced packaging technology

Author

Balde, John W.

Subjects
Multichip Module, Industry Analysis, Trends, Semiconductor industry, Chip Packaging, Packaging Density, Circuit Design, Semiconductor industry -- Analysis, Integrated circuits -- Design and construction
Published
1992

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