46 results on '"Ohkubo M"'
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2. Design and high-speed tests of a single-flux-quantum time-to-digital converter for time-of-flight mass spectrometry
3. Superconducting tunnel junction (STJ) detectors for ion-charge-number sensitive mass spectrometry
4. Development and Pilot Study of a Mobile Phone-aided Mutual Monitoring Support System.
5. Novel InP/InGaAs D-HBTs with selective multisteps MOCVD regrowth techniques for high-speed application.
6. First fabrication of continuously graded InGaAsP on GaAs for 0.98/spl mu/m lasers.
7. Compositionally graded C-doped In/sub 1-x/Ga/sub x/As base in InP/InGaAs D-HBTs grown by MOCVD with low base sheet resistance and high current gain.
8. Graded-GaAs/sub 1-x/P/sub x/ base in heterojunction bipolar transistors with InGaP emitters.
9. InGaAs/InP double-heterojunction bipolar transistors with graded-InGaAsP between InGaAs base and InP collector grown by metal organic chemical vapor deposition.
10. Titanium Based Transition Edge Microcalorimeters for Optical Photon Measurements.
11. Digital Signal Processing Based on a Clustering Algorithm for Ir/Au TES Microcalorimeter.
12. Effects of Spatial Nonuniformity of Superconducting-Tunnel-Junction Jon Detectors on Mass Spectroscopy.
13. High power CW operation of aluminium-free InGaAs/GaAs/InGaP strained layer single quantum well ridge waveguide lasers
14. Imaging Analysis of Superconducting Transition Edge Sensors for Calorimeters.
15. Fabrication and characterization of superconducting X-ray calorimeters with transition edge sensors.
16. 1-GHz fully pipelined 3.7-ns address access time 8 k×1024 embedded synchronous DRAM macro.
17. 980-nm aluminum-free InGaAs/InGaAsP/InGaP GRIN-SCH SL-QW lasers.
18. 0.98 mu m InGaAs-InGaAsP-InGaP GRIN-SCH SL-SQW lasers for coupling high optical power into single-mode fiber.
19. Heavily Zn-doped graded-base AlGaAs/GaAs HBTs grown by MOCVD.
20. Development of Optical Fiber/Power Line Composite Tether Cable for a Remotely Operated Unmanned Submersible.
21. Universal coding for multiple access channels.
22. A strong outer bound to the capacity region for multiple access channels (Corresp.).
23. Concatenated codes for multiple access channels (Corresp.).
24. Development of optical fiber/power line composite tether cable for remotely operated unmanned submersible.
25. Status Of The Jaeri FEL System.
26. Signal Analysis of a Small-Pixel TES in a Digital Operation Mode.
27. Beam instability in 980-nm power lasers: experiment and analysis.
28. Convolutional tree codes for multiple access channels (Corresp.).
29. Reflection and transmission of electromagnetic waves by anisotropic plasma half-space moving in longitudinal direction.
30. Novel InP/InGaAs D-HBTs with selective multisteps MOCVD regrowth techniques for high-speed application
31. Compositionally graded C-doped In/sub 1-x/Ga/sub x/As base in InP/InGaAs D-HBTs grown by MOCVD with low base sheet resistance and high current gain
32. High power, high reliable 980 nm and 1480 nm pumping lasers
33. 980 nm laser diodes using strained-layer GaInAsP quantum-wells
34. Graded-GaAs/sub 1-x/P/sub x/ base in heterojunction bipolar transistors with InGaP emitters
35. Space proven GaAs solar cells-main power generation for CS-3
36. 1 GHz fully pipelined 3.7 ns address access time 8 k×1024 embedded DRAM macro
37. Digital signal processing based on a clustering algorithm for Ir/Au TES microcalorimeter
38. 1 GHz fully pipelined 3.7 ns address access time 8 k×1024 embedded DRAM macro.
39. Digital signal processing based on a clustering algorithm for Ir/Au TES microcalorimeter.
40. Beam steering in 980 nm high power laser diodes.
41. High power, high reliable 980 nm and 1480 nm pumping lasers.
42. 980 nm laser diodes using strained-layer GaInAsP quantum-wells.
43. Bias-dependent photoluminescence intensity for the estimation of surface recombination velocity in compound-semiconductor solar cell.
44. Production and loss processes of high-energy oxygen negative ions in a DC magnetron plasma.
45. Space proven GaAs solar cells-main power generation for CS-3.
46. RFID Privacy Issues and Technical Challenges.
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