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4. 1343 Novel conditionally active bispecific HER2 x CD3 T cell engager targeting solid tumors

5. 1342 A novel dual CAB Nectin-4 x CD3 bispecific antibody targeting solid tumors

6. Abstract 1879: A novel dual CAB nectin-4 x CD3 bispecific antibody targeting solid tumors

7. Abstract 1541: NextGen conditionally active biologic (CAB) anti-Nectin-4-ADC with improved stability and safety

8. Abstract 1871: Novel conditionally active bispecific HER2 x CD3 T cell engager targeting solid tumors

9. Topical K+ channel blockage improves pharyngeal collapsibility: A translational, placebo-controlled trial.

10. BAY 2253651 for the treatment of obstructive sleep apnoea: a multicentre, double-blind, randomised controlled trial (SANDMAN)

13. BAY 2253651 for the treatment of obstructive sleep apnoea: a multicentre, double-blind, randomised controlled trial (SANDMAN)

27. Abstract 2708: Potent CAB CTLA4 antibody to reduce immune side effects and toxicities associated with single-agent and combination cancer immuno therapies

31. Fused tricyclic indoles as S1P1 agonists with robust efficacy in animal models of autoimmune disease

32. Discovery and characterization of potent and selective 4-oxo-4-(5-(5-phenyl-1,2,4-oxadiazol-3-yl)indolin-1-yl)butanoic acids as S1P 1 agonists

33. Discovery of fused bicyclic agonists of the orphan G-protein coupled receptor GPR119 with in vivo activity in rodent models of glucose control

34. Kinetics of 5-HT2BReceptor Signaling: Profound Agonist-Dependent Effects on Signaling Onset and Duration

36. Discovery and characterization of potent and selective 4-oxo-4-(5-(5-phenyl-1,2,4-oxadiazol-3-yl)indolin-1-yl)butanoic acids as S1P1 agonists

40. Discovery of the First Potent and Orally Efficacious Agonist of the Orphan G-Protein Coupled Receptor 119

41. Fab Environment Effect on Crescent Pits Defect in Cu Metallization Process

42. Study on Al-Ge Bonding and Quality Improvement in CMEMS Process

43. Effective Approach for Hillock Defect Reduction in Cu Metallization Process

44. A Robust Shallow Trench Isolation High Density Plasma Chemical Vapor Deposition Void Free Process for 0.13?m CMOS Technology

45. Study on the Ring Type Crater Defect Reduction in Cu CMP Process

46. The Influence of The SIN Cap Process on The Voltage Breakdown and Electromigration Performance of Dual Damascene Cu Interconnects

47. Novel Approach for W Loss Defect Prevention on WCMP Re-Clean Process

48. Study on Effects of Slurry Key Factors on Advanced Oxide CMP Performance

49. Studies of Wafer Backside Micro-arcing Prevention In Encore Ta Process

50. Discovery and characterization of potent and selective 4-oxo-4-(5-(5-phenyl-1,2,4-oxadiazol-3-yl)indolin-1-yl)butanoic acids as S1P1 agonists

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