1. Optimized thermal conductivity of diamond/Cu composite prepared with tungsten-copper-coated diamond particles by vacuum sintering technique
- Author
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Pan Yanpeng, Mao Wu, Xuanhui Qu, Xinbo He, and Shubin Ren
- Subjects
010302 applied physics ,Pressing ,Materials science ,Composite number ,chemistry.chemical_element ,Diamond ,02 engineering and technology ,Tungsten ,engineering.material ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,01 natural sciences ,Copper ,Surfaces, Coatings and Films ,Thermal conductivity ,chemistry ,Plating ,0103 physical sciences ,engineering ,Composite material ,0210 nano-technology ,Instrumentation ,Layer (electronics) - Abstract
Diamond/Cu composites with excellent thermal performance were fabricated by a novel method which coated diamond particles with tungsten as the inner layer through salt-bath plating and then deposited copper as the outer layer through electroless plating. After ultra-high cold pressing and vacuum sintering, these double-layer particles directly formed diamond/Cu composites without addition of copper powders. The thermal conductivity of 60 vol.% diamond/Cu composite reached maximum at 661 W m-1 K-1. The outstanding performance can be ascribed to strong interface bonding in the double-layer particles and uniform distribution of diamond particles in the composites when electroless plating was used to replace copper powder addition.
- Published
- 2018