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Optimized thermal conductivity of diamond/Cu composite prepared with tungsten-copper-coated diamond particles by vacuum sintering technique
- Source :
- Vacuum. 153:74-81
- Publication Year :
- 2018
- Publisher :
- Elsevier BV, 2018.
-
Abstract
- Diamond/Cu composites with excellent thermal performance were fabricated by a novel method which coated diamond particles with tungsten as the inner layer through salt-bath plating and then deposited copper as the outer layer through electroless plating. After ultra-high cold pressing and vacuum sintering, these double-layer particles directly formed diamond/Cu composites without addition of copper powders. The thermal conductivity of 60 vol.% diamond/Cu composite reached maximum at 661 W m-1 K-1. The outstanding performance can be ascribed to strong interface bonding in the double-layer particles and uniform distribution of diamond particles in the composites when electroless plating was used to replace copper powder addition.
- Subjects :
- 010302 applied physics
Pressing
Materials science
Composite number
chemistry.chemical_element
Diamond
02 engineering and technology
Tungsten
engineering.material
021001 nanoscience & nanotechnology
Condensed Matter Physics
01 natural sciences
Copper
Surfaces, Coatings and Films
Thermal conductivity
chemistry
Plating
0103 physical sciences
engineering
Composite material
0210 nano-technology
Instrumentation
Layer (electronics)
Subjects
Details
- ISSN :
- 0042207X
- Volume :
- 153
- Database :
- OpenAIRE
- Journal :
- Vacuum
- Accession number :
- edsair.doi...........a232a87b44c756d2072d61fa16963a90